Hitech Nordic och Saven blir Saven Hitech News & Analysis 11/27/2002 Post a comment Efter ett års rykten blir det verklighet: Hitech Nordic bildar tillsammans med Saven ett gemensamt bolag som beräknas omsätta 80 miljoner svenska kronor. Personalen på 12 personer från Hitech Nordic sammanförs med 18 personer från Saven och verksamheten koncentreras till Täby. Flyttningen planeras vara genomförd senast vid årsskiftet.
Neddragning av kärnverksamhet News & Analysis 11/27/2002 Post a comment Det kommer att hända mycket inom det som utan vidare kan betecknas som Ericssons innersta "kärnverksamhet"; och jag hoppas innerligt att det skall innebära att Ericsson kan nå upp till samma FoU-effektivitet som Nokia. Därför är det inte svårt att hålla med Urban Fagerstedt då han i ett internt PM konstaterar: "... vi måste skapa en fungerande och effektiv organisation, annars överlever vi inte!"
Samtidigt kan man förstås undra över varför man inte gjort det tidigare?
Difficult year weighs on Credence results News & Analysis 11/27/2002 Post a comment FREMONT, Calif. -- Sales revenue at automatic test equipment maker Credence Systems Corp. was $43.2 million in the fourth quarter of fiscal 2002 year. This was up 17% compared with the same quarter a year before but down 9% sequentially, the company said. The net loss for Q4 of fiscal 2002 was $112.0 million, nearly doubling the net loss of $60.2 million in the fourth quarter of 2001.
IBM inks process development pact with Chartered News & Analysis 11/26/2002 Post a comment IBM Corp. and Chartered Semiconductor Manufacturing Pte. have signed a joint development and manufacturing agreement that will result in a common process platform starting at the 90-nanometer node. The agreement will give each partner a second manufacturing source for parts produced on 300-mm wafers.
ESEC merges assembly divisions, announces new CEO News & Analysis 11/26/2002 Post a comment CHAM, Switzerland -- Chip-assembly equipment company ESEC announced today (November 26, 2002) that it would merge its die attach and wire bonder business units into a single business unit and that it has appointed Hans Wunderl as chief executive officer.
No decision yet on EU probe of possible Samsung subsidies News & Analysis 11/26/2002 Post a comment The European Union (EU) has apparently made no decision yet regarding government subsidies to Samsung Electronics Co. in a countervailing duty case filed against Korean DRAM firms by Infineon Technologies AG. It was erroneously reported earlier that the EU had absolved Samsung of receiving alleged illegal Korean government subsidies.
Chip makers bang away at metal gates News & Analysis 11/26/2002 Post a comment Technologists are girding for yet another major change in CMOS gate stack integration: the replacement of polysilicon gate electrodes with two metals for PMOS and NMOS transistors.
Motorola refines its finFET dual-gate transistor News & Analysis 11/26/2002 Post a comment Researchers at the Digital DNA Laboratory of Motorola's Semiconductor Products Sector claim to have made a key step forward with the finFET dual-gate transistor structure; enabling low-voltage operation but way of independently doped gates.
Telecom test project stirs interest at Ixia News & Analysis 11/26/2002 Post a comment Motivating a team to design a compact test module for 40-Gbit/second networks was not the easiest thing in the world at a time when market analysts were warning that 40-Gbit telecommunications transport would remain mired in overcapacity for quarters, or even years, to come.
Chip allows wallet-sized set-top-boxes, claims Zarlink News & Analysis 11/26/2002 Post a comment SWINDON, England --- Zarlink Semiconductor Inc. has designed a pair of digital television processing chips for the terrestrial digital video broadcast (DVB-T) standard written by the European Telecommunications Standards Institute (ETSI) and in use in Europe and elsewhere. The company claims that with its chips manufacturers could build a wallet-sized digital terrestrial set-top box.
If saved, Hynix could spend $3.6 billion on capex over four years, says report News & Analysis 11/26/2002 Post a comment SEOUL -- Hynix Semiconductor Inc. would be able to spend 4.4 trillion won (about $3.6 billion) in capital expenditure over the next four years if it manages to restructure its debt Hwang Hak-joong, managing director of the Korea Exchange Bank (KEB) is quoted as saying today (November 26, 2002) in a Dow Jones Business News report. KEB is Hynix' leading creditor.
PCI serial I/O adapter offers two ports News & Analysis 11/26/2002 Post a comment Sealevel Systems Inc.'s Ultra Comm+2.LPCI dual-port PCI bus serial I/O adapter provides two RS-232/422/485 ports, allowing field-selectable connection to P-LCs, bar code readers, scales and other data acquisition/control devices.
PC/104 SBC targets embedded apps News & Analysis 11/26/2002 Post a comment WinSystems Inc.'s SAT-520Plus PC/104 expandable embedded computer combines an AMD SC520 processor with a 10/100 Ethernet controller, four serial COM ports and a CRT/flat-panel video controller.
Dc/dc sheds inductors News & Analysis 11/26/2002 Post a comment The FAN5660 inductorless dc/dc converter from Fairchild Semiconductor boasts efficiency of more than 90 percent at full load for low-power, low-electromagnetic-interference applications, suiting it to portable applications.
Dc supplies head for distributed power News & Analysis 11/26/2002 Post a comment Transistor Devices Inc.'s Mercury 1.2-kilowatt front-end dc power supply, for distributed architectures and rectifier applications in the industrial, telecom and computing markets, provides +12, +24 or -48 Vdc power from a universal ac input.
BGAs combine flash, pseudo SRAM Product News 11/26/2002 Post a comment Integrated Silicon Solution Inc. (ISSI) has combined 64-Mbit NOR flash memory with 16-Mbit or 32-Mbit pseudo SRAM (PSRAM) in two new multi-chip packages (MCPs).
Ultracompact drum core inductor fits disk drives News & Analysis 11/26/2002 Post a comment Pulse Engineering Inc.'s PG0063 series of unshielded drum core inductors is designed for portable handheld devices and disk drive applications. Inductance values range from 0.9 microhenries at 3.5 amps to 900 microHenry at 120 milliamps.
1U power unit fits tight spots News & Analysis 11/26/2002 Post a comment Panel Components Corp.'s 852Q2L20 Interpower 19-inch rack-mount power distribution unit offers 12 IEC 60320 Sheet F outlets with a C20 inlet and is rated at 16 amps for service at 250 volts ac.
Tiny connector 'snaps' into card News & Analysis 11/26/2002 Post a comment The latest addition to Bomar Interconnect Products Inc.'s subminiature E-Snap Series of edge board connectors, called the MCX E-Snap LP, is designed for use with PCMCIA cards.
Relay designs raise performance levels News & Analysis 11/26/2002 Post a comment Frequency, power consumption and voltage are the top concerns in the relay market, especially with respect to aerospace, automotive, industrial-control, instrumentation, military, and test and measurement applications.
Startups selected for DARPA RF MEMS program News & Analysis 11/26/2002 Post a comment STOW, Mass. -- Radant MEMS Inc. (RMI) said yesterday (November 25, 2002) that it has been awarded a contract by the U.S. Defense Advanced Research Projects Agency (DARPA) to participate in the agency's radio frequency micro-electromechanical systems (MEMS) improvement program.
Tiny TEC drivers from Maxim halve the heat News & Analysis 11/26/2002 Post a comment Two Peltier thermoelectric-cooler (TEC) drivers from Maxim Integrated Products are said to be among the smallest such devices available for small-form-factor and pluggable small-form-factor fiber-optic modules.
Net search engine dev kit News & Analysis 11/26/2002 Post a comment A software developer's kit has been released that allows designers to simulate the performance of the NSE4000GLQ network search engine.
Credence sells off test fixture subsidiary News & Analysis 11/26/2002 Post a comment Automatic test equipment maker Credence Systems Corp. has sold its subsidiary Dimensions Consulting Inc., a provider of ATE interface boards, test sockets and contactor systems. DCI is to remain in its headquarters, located in Santa Clara, Calif.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.