Breaking News
News Analysis
Content posted in December 1997
<<   <   Page 4 / 4
Compaq Becomes First Windows NT-Based Workstation Vendor To Join EDA Consortium
News & Analysis  
12/4/1997   Post a comment
Houston--Dec. 3, 1997--Compaq Computer Corporation and the ElectronicsDesign Automation (EDA) Consortium announced that Compaqhas become the first Windows NT-based workstation ...
Analog Devices To Provide DSP For 3Com 56k Modems--Integrated DSP & Mixed-Signal Solution Enables Modem System-On-A-Chip
News & Analysis  
12/4/1997   Post a comment
Norwood, Mass.--Dec. 3, 1997--Analog Devices, Inc. (ADI)announced that 3Com will use a new ADI chip that integrates all the analogand digital signal processing components of ...
DuPont Photomasks Breaks Ground For New Production Facility In Gresham, Oregon
News & Analysis  
12/4/1997   Post a comment
Gresham, Ore.--Dec. 3, 1997--DuPont Photomasks, Inc. (DPI)broke ground for its new production facility in Gresham, Oregon. A ceremony was held at the site of the new plant on ...
Hyundai Electronics Industries Orders 86 Additional K&S Gold Ball Bonders
News & Analysis  
12/3/1997   Post a comment
Willow Grove, Pa.-- Dec. 2, 1997--The Semiconductor Assembly &Test Division of Hyundai Electronics Industries Co., Ltd.,a major assembly subcontractor, has ordered 86 additional ...
Electronic Designs, Inc. Introduces High Density Synchronous DRAM Module
News & Analysis  
12/3/1997   Post a comment
Westborough, Mass.--Dec. 2, 1997--Electronic Designs, Inc. (EDI)introduced the highest density synchronous DRAM (SDRAM) module, packaged inthe 168 pin DIMM standard. The new ...
Cadence Adds Design Centers In Dublin And Paris
News & Analysis  
12/3/1997   Post a comment
San Jose, Calif.--Dec. 2, 1997--Cadence Design Systems, Inc. announced further expansion of its international Design Factory Network with the openingof Design Centers in Dublin ...
OrCAD Expands Management Team; New Vice President To Manage Integration Of Acquisitions And Organizational Development
News & Analysis  
12/3/1997   Post a comment
Beaverton, Ore.--Dec. 2, 1997--OrCAD announced that Leb Tannenbaum has joined the company as its new vice president of integration and development. Tannenbaum joins ...
Minc Acquires Synario
News & Analysis  
12/3/1997   Post a comment
Colorado Springs, Colo.--Dec. 2, 1997--Minc, Inc. announced ithas acquired selected assets of Synario Design Automation (Redmond, Wash.), aleading supplier of ready-to-use ...
Next Wave Technology's NW601 Available To Support C-Cube CL-550/560 Customers
News & Analysis  
12/3/1997   Post a comment
Sunnyvale, Calif.-- Dec. 2, 1997--Next Wave Technology announced thatits 70MB/s NW601--the world's fastest codec--is fully compatiblewith C-Cube's recently discontinued CL-550/560 ...
Coryphaeus Software And TSC To Develop Integrated Infrared Sensor Simulation
News & Analysis  
12/3/1997   Post a comment
Orlando, Fla.-- December 1, 1997 -- Coryphaeus Software, Inc.(Los Gatos, Calif.) and Technology Service Corporation (TSC)(Los Angeles, Calif.) announced a joint agreement to ...
New Bus Enhancement From Philips Semiconductors Reduces Costs In Mixed-Voltage System Design
News & Analysis  
12/3/1997   Post a comment
Sunnyvale, Calif.--Dec. 2, 1997--Philips Semiconductors has enhancedthe I2C bus, the de facto standard for communications betweenintegrated circuits. With the enhanced ...
North American Chip Spending Surges While Asia Cools Off
News & Analysis  
12/3/1997   Post a comment
Global chip-production equipment market should grow 7.7 percent in 1997, survey says, but no so for Japan.
Tundra Names New Customer Service Director
News & Analysis  
12/2/1997   Post a comment
Kanata, Ont.--Dec. 1, 1997--Tundra Semiconductor has appointed Nancy Hawkins to the newly created position of directorof customer service. Ms. Hawkins reports to Ed Hacker, ...
Prolinx's New Copper-Core BGA Elevates Performance And Thermal DissipationStandards In PBGA Packaging
News & Analysis  
12/2/1997   Post a comment
San Jose, Calif.--Dec. 1, 1997--ProLinx Labs announcedits Copper-Core BGA (C2BGA), a thermally-enhanced,plastic ball grid array (PBGA) substrate used for fabricatinghigh pin-count ...
Cadence Partners With Electronics Innovators To Accelerate Delivery Of NewEnvironment For Software And Hardware System Design
News & Analysis  
12/2/1997   Post a comment
San Jose, Calif.--Dec. 1, 1997--Cadence Design Systems, Inc.announced the formation of a technology initiative(code named "Felix") to deliver new methodologies and tools for ...
National Semiconductor Announces Appointment Of Vice President Of CorporateMarketing And Communications
News & Analysis  
12/2/1997   Post a comment
Santa Clara, Calif.-- Dec. 1, 1997--National SemiconductorCorporation announced that Steve Tobak, a Cyrix Corporationvice president, will join National's senior management team ...
Tundra Eighty-X Chip Connects Texas Instruments 'C80 And 'C82 DigitalSignal Processors To PCI
News & Analysis  
12/2/1997   Post a comment
Kanata, Ont.--Dec. 1, 1997--Tundra Semiconductor, a leader inPCI bus bridges, has introduced the Tundra Eighty-X PCI bus bridge for theTexas Instruments TMS320C80 ('C80) and ...
Toshiba Expands Its Line Of Power Integration Modules
News & Analysis  
12/2/1997   Post a comment
Deerfield, Ill.--Dec. 1, 1997--Toshiba America ElectronicComponents, Inc. (TAEC) has added two new powerintegration module (PIM) families to its line of insulated gate bipolartransistors ...
Copal to Sell Xicor's EEPOT Digitally Controlled Potentiometers
News & Analysis  
12/2/1997   Post a comment
Milpitas, Calif.-- December 1, 1997--Xicor, Inc. and CopalElectronics Co., Ltd. of Japan, have joined forces to further expand the market in Japan for Xicor's EEPOT digitally ...
Kawasaki LSI's Suite Of USB Interface Controllers Offers Systems Developers Numerous Design Options
News & Analysis  
12/2/1997   Post a comment
San Jose, Calif.--Dec. 1, 1997--Kawasaki LSI is now offering the first three members of its family of USB (universal serial bus) controllers, each with increased integration ...
AMD Hints Of Major K6 Win In China
News & Analysis  
12/2/1997   Post a comment
Advanced Micro Devices managers say AMD scores major design win for K6 processor line with China's largest PC maker.
TI Vice Chairman Weber To Retire
News & Analysis  
12/2/1997   Post a comment
Pat Weber led company through major transition from mostly commodity devices to higher-value integrated circuits.
Atmel Sues Vitesse
News & Analysis  
12/1/1997   Post a comment
Company files suit, claiming misappropriation of proprietary info regarding chip-processing tech.
New Report Charts Course For Chip Industry
News & Analysis  
12/1/1997   Post a comment
Microprocessors and dynamic RAM are pushing separate but equally important aspects of chip technology.
Reliable Real-Time Performance in Windows NT
News & Analysis  
12/1/1997   Post a comment
Hard as it may seem to fathom, Windows NT is being considered for many of the next generation embedded systems, particularly in the telecommunications field. Though NT has many features that make it an appropriate operating system for these applications, it also has some serious limitations such as the lack of determinism. This article addresses many of the limitations and shows at least what Radisys is proposing as fixes.
<<   <   Page 4 / 4


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
01:34
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...