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Content posted in December 2003
<<   <   Page 27 / 27
Leverage the Latest in Mobile Rendering Protocols
News & Analysis  
12/1/2003   Post a comment
Choosing the optimum protocol for mobile multimedia devices requires careful evaluation of all system and air-interface parameters
Wireless mesh networks emerge
News & Analysis  
12/1/2003   Post a comment
Startup Ember Corp. has launched an IEEE 802.15.4-based wireless transceiver with mesh-networking software.
So, what are you bringing?
News & Analysis  
12/1/2003   Post a comment
It's important to emphasize the word "changes" as we sneak peeks over the wall of time into 2004.
SST, Powerchip team up, aim to take 'SuperFlash' to 65-nm
News & Analysis  
12/1/2003   Post a comment
Non-volatile memory developer Silicon Storage Technology Inc. (SST) has teamed up with Taiwanese DRAM maker Powerchip Semiconductor Corp. to develop a third generation of SST's SuperFlash memory, the company said Monday (December 1, 2003).
DC/DC-Wandler für HF-Applikationen
News & Analysis  
12/1/2003   Post a comment
Für rauschempfindliche Anwendungen in der Hochfrequenztechnik hat der japanische Chiphersteller Torex eine neue Familie von DC/DC-Wandlern entwickelt. Vor allem Bluetooth- und Mobilfunk-Applikationen könnten von der geringen Restwelligkeit der Chips profitieren.
European groups combine for secure multimedia delivery
News & Analysis  
12/1/2003   Post a comment
A leading group of European technology companies, research institutes and universities have combined to develop a multimedia framework that will enable the creation, delivery and use of digital media content on the public network, while protecting the rights of content owners and the privacy of consumers.
Powerwave increases wireless infrastructure operation by $407m acquisition of Allgon
News & Analysis  
12/1/2003   Post a comment
RF power amplifier specialist Powerwave Technologies, Inc. (Santa Ana, California) is buying, for about $407 million, Swedish mobile communications and antennas group LGP Allgon Holding AB in an all shares transaction.
Communicant jette l'éponge
News & Analysis  
12/1/2003   Post a comment
Les rêves sont terminés pour un fabricant de puces du Brandebourg : après avoir dépensé jusqu'aux derniers deniers, Communicant a été mis en liquidation.
Communicant au bord de la faillite
News & Analysis  
12/1/2003   Post a comment
La faillite menace le fabricant de semi-conducteurs Communicant avant même que la première puce ait été produite : à moins que les investisseurs réunissent le capital nécessaire avant vendredi de cette semaine, une procédure d'insolvabilité semble inévitable.
TTI nomme un nouveau vice-président Produits et Activités en Europe
News & Analysis  
12/1/2003   Post a comment
TTI, distributeur de composants passifs et de connecteurs, prévoit une croissance de ses activités européennes de l'ordre de 30% cette année ainsi que le doublement de son chiffre d'affaires d'ici 3 à 5 ans. Pour se préparer à une telle croissance, TTI annonce la nomination de Roberto Cuccato au poste de vice-président Produits et Activités Europe. Travaillant aux côtés de Glyn Dennehy, vice-président des Ventes et du Marketing en Europe, et sous l'autorité de Gene Conahan, président de TTI pour
Testa för kommunikation på slagfältet
News & Analysis  
12/1/2003   Post a comment
Nödradion är bara ett av flera militära kommunikationssystem som kräver noggranna tester om den ska fungera effektivt på en modern krigsskådeplats. Och att test av militär kommunikationsutrustning måste hålla jämna steg med den tekniska utvecklingen hos nya digitala system betonar författarna Jeff Gillum och Jim DeBroeck från Aeroflex Test Solutions.
Elektronikens "tetrapak" kapslar fukttätt
News & Analysis  
12/1/2003   Post a comment
Elektronikutrustning för utomhusbruk, för krävande civila, medicinska eller militära tillämpningar måste tåla fukt. Uppfinnaren Karl-Erik Leeb har utvecklat en genialisk metod, kallad ProofCap, som för låg kostnad ger en perfekt, diffusionstät kapsling. Dessutom ger den synnerligen god skärmning mot elektromagnetiska fält.
Sony spins out IC card, consumer operations
News & Analysis  
12/1/2003   Post a comment
Sony Corporation is merging its smart card operations into a joint venture operation with Japanese mobile network operator NTT DoCoMo. Dubbed FeliCa Networks Inc, the company, due to be established in late January, will develop the technology for a new IC chip, tentatively called 'mobile FeliCa IC' that will integrate mobile phones with the FeliCa technology.
Kostnadseffektiv lösning för tuffa miljöer
News & Analysis  
12/1/2003   Post a comment
Datorbaserade styrsystem används alltmer i både civila arbetsfordon och militära fordon. Ibland kan lösningar realiseras med hjälp av COTS (Commercial Of The Shelf) men i många fall är kravbilden alltför tuff. Hur gör man då i skogsmaskiner, bergborrningsutrustning och stridsfordon för att uppfylla både de högt ställda kraven och kostnadsnivån på en konkurrensutsatt marknad?
A new approach to system-level design
News & Analysis  
12/1/2003   Post a comment
SystemC, as it exists today, has a number of limitations. A research project based on Microsoft's .NET platform and the C# language presents a possible evolution of SystemC.
<<   <   Page 27 / 27


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