Under the Hood: iPod video, up close and personal Teardown 12/3/2007 1 comment Virtual display glasses aren't new, but MyVu uses Kopin's on-glass LCD technology and advanced packaging, materials and integration to bring the cost, size, power and weight down to a usable format for consumers.
ASIC design starts to fall 4% in 2007, says Gartner News & Analysis 12/3/2007 Post a comment The number of ASIC designs taping out in 2007 looks set to be 3,275 down 4 percent from 3,408 ASIC design start tape outs in 2006, according to market research company Gartner Inc. Of the 2007 ASIC design starts about 200 starts made at 65-nanometer design rules or below.
Energy harvesting matures News & Analysis 12/3/2007 1 comment At least two energy harvesting companies are reporting sharp increases in sales to customers who are finding all types of ordinary uses for power harvesting devices in advance of widespread deployment of wireless sensor networks.
Tips for testing outsourced software News & Analysis 12/3/2007 Post a comment One challenge that enterprise organizations face is effectively testing software products developed offshore. Following are some activities that can be followed to effectively execute an outsourced project.
LBOs bring private pain News & Analysis 12/3/2007 Post a comment Say a prayer for Freescale Semiconductor Inc. Loaded down with $9.4 billion in long-term debt and shackled to a weak wireless handset OEM while struggling to boost margins in a softening market, Freescale might seem to epitomize everything that can go wrong in the leveraged-buyout world.
Why Intel took the high-k leap News & Analysis 12/3/2007 Post a comment Intel Corp. started 2007 with a bang: a breakthrough in transistor design that was one of the biggest advances in the electronics industry in 40 years. High-k 45-nanometer technology became a buzzword as Intel drew first blood in its intense battle for processor supremacy.
ISSCC broadens its perspective News & Analysis 12/3/2007 Post a comment The International Solid-State Circuits Conference, the forward-looking industry event that traditionally travels the bleeding edge of circuit wizardry, will take somewhat of a turn when it convenes in February, diversifying its general sessions and bringing in a range of topics that underscore designers' impact on the "big picture."
First crack in mobile carriers' fortress? News & Analysis 12/3/2007 Post a comment Someday, users may be able to buy any mobile device they want and hop onto any cellular network, in the same way they now buy a PC and plug into the Web. Taking a small step toward such an open, mobile world, Verizon Wireless announced last week that it will open its network to any compliant device starting sometime next year.
Politics of engineering News & Analysis 12/3/2007 Post a comment Engineering interests historically haven't been at the forefront of the political debate, at least not compared with those of, say, farming, law or health care.
Fabless organization changes name, role News & Analysis 12/3/2007 Post a comment The Fabless Semiconductor Association has gotten the global-supply-chain gospel. The industry group, formed in 1994 to champion the fabless business model, will announce this week that it is changing its name to the Global Semiconductor Alliance.
IDT gears up for DisplayPort as standard gains momentum News & Analysis 12/3/2007 Post a comment Integrated Device Technology has created a digital display division focused on chips for the emerging DisplayPort standard. IDT's move validates a ma- jor shift to DisplayPort from analog VGA and low-voltage differential signaling in PC monitors, notebooks and LCD TVs.
European chip sales growth leads U.S., lags Asia News & Analysis 12/3/2007 Post a comment The three-month average of chip sales for Europe in October was $3.62 billion, up 2.5 percent from the previous month and up 2.2 percent compared with October 2006, according to numbers sent out by the Semiconductor Industry Association.
Speculations rise on Siemens holdings News & Analysis 12/3/2007 Post a comment The concept of Siemens CEO Paul Loescher to simplify the company's structure has triggered speculations. The fate of the company's communications and computing activities seems highly uncertain – including the joint ventures with Nokia and Fujitsu.
Texas Instruments sues Chipcon founder News & Analysis 12/3/2007 Post a comment Texas Instruments Inc. (Dallas, Texas), which paid $200 million to acquire mixed-signal and wireless chip company Chipcon Group ASA (Oslo, Norway) in January 2006, is taking Chipcon founder Geir Forre to court, according to sources close to TI.
Israel's technology exports hit by rising materials costs News & Analysis 12/3/2007 Post a comment The annual growth rate for the value of Israel's technology-based exports is going to fall from 20 percent in 2006 to only 7 percent in 2007, according to economists in the Manufacturers Association of Israel. The rising cost of manufacturing materials and components and the weakness of the U.S. dollar are blamed.
October chip sales beat expectations, PC sales help News & Analysis 12/3/2007 Post a comment Worldwide semiconductor sales in October rose to $23.1 billion, an increase of 5 percent over the $22 billion reported in October 2006 and 2 percent higher than the $22.6 billion reported in September of this year, the Semiconductor Industry Association (SIA) reported today. The numbers came in ahead of analyst expectations and were attributed to strong PC sales.
Wavecom starts educational partnership program News & Analysis 12/3/2007 Post a comment French M2M technology specialist Wavecom SA (Issy-Les-Moulineaux, France) has extended its collaboration with the academic community by launching a new partnership program with two Asian engineering schools, namely Ngee Ann Polytechnic in Singapore and the University of Technology of Ho Chi Minh City in Vietnam.
Jerusalem Global Ventures to launch $200 million tech fund News & Analysis 12/3/2007 Post a comment Jerusalem Global Ventures announced it will launch JGV Growth Equity Fund, L.P., a $200 million fund. The fund will invest in private Israeli-related technology companies that are on a trajectory to IPO within three years and have a proven business model. First closing is scheduled for April 2008.
Sidense wins design slot in XMOS silicon News & Analysis 12/3/2007 Post a comment Sidense Corp. (Ottawa, Canada), a develop of antifuse-based non-volatile memory, has announced that its one-time programmable (OTP) technology has been designed into a software-programmable semiconductor product from XMOS Semiconductor Ltd. (Bristol, England).
MATLAB-to-C tool get major upgrade Product News 12/3/2007 Post a comment Catalytic's MATLAB-to-C tool can now generate C code for over 300 MATLAB functions, including functions from the signal processing, communications, imaging, and math toolboxes.
TI rolls DaVinci for HD transcoding Product News 12/3/2007 Post a comment The TMS320DM6467 targets video transcoding in products such as set-top boxes and media gateways. It can simultaneously encode and decode multi-format HD video at resolutions up to H.264 HP@L4.
IDT gears up for shift to DisplayPort News & Analysis 12/3/2007 Post a comment Integrated Device Technology has created a new digital display division focused on chips for the emerging DisplayPort standard, validating a major shift to DisplayPort from analog VGA and low voltage differential signaling in PC monitors, notebooks and inside LCD TVs.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.