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Global chip sales fell 2.4% in October, says SIA
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12/1/2008   Post a comment
The three-month moving average of worldwide sales of semiconductors declined by 2.4 percent in October to $22.47 billion compared to sales of $23.03 billion in October 2007, according to the Semiconductor Industry Association (SIA), which referenced World Semiconductor Trade Statistics as its source.
October chip sales down 10.4% year-on-year, says WSTS
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12/1/2008   Post a comment
The global market for semiconductors was $19.31 billion in October, down 1.3 percent compared to October 2007, according to 'actual' data from the World Semiconductor Trade Statistics organization.
Poland hosts world's most energy-efficient supercomputer
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12/1/2008   Post a comment
Poland's University of Warsaw hosts the most energy-efficient supercomputer in the world.
Bosch picks Infineon SiGe chip for 3G radar system
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Robert Bosch GmbH has chosen Infineon's RASIC (Radar System IC) product family for its next-gen radar devices to be used in Adaptive Cruise Control (ACC) driver assistant systems.
Austriamicrosystems reports loss from currency hedging
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12/1/2008   Post a comment
Analog/Mixed Signal specialist Austriamicrosystems (AMS) said it expects a significant loss for its FY2008 — not through declining sales but due to currency hedging transactions that went wrong.
EVE launches university connection program
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12/1/2008   Post a comment
Emulation and Verification Engineering SA (EVE), French developer of hardware and software coverification tools, has formed the EVE University Connection program to provide universities with an access to its verification technologies and methodologies.
Harting : Ethernet platform creates communication hierarchy
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12/1/2008   Post a comment
Harting has developed a new switching technology which integrates Ethernet automation protocols into the Automation IT communications platform.
With investor in sight, Qimonda postpones financial report
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Ailing memory chip maker Qimonda AG (Munich, Germany) has announced progress in its negotiations with a potential investor. At the same time, the company said it will delay the release of its figures until mid-December.
Avnet to buy distributor in Japan
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12/1/2008   Post a comment
Avnet, Inc. has entered into an agreement to acquire Nippon Denso Industry Co., Ltd., a Tokyo-based value-added distributor, hoping to double its sales in Japan.
AMD: Fighting the unbeatable foe
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12/1/2008   2 comments
Advanced Micro Devices pursued rival Intel for years as the two jostled for dominance in the MPU market, but it may be time for AMD to accept its No. 2 position in the sector and distinguish its operations by carefully selecting areas in which to compete.
Salary Survey: Engineers confront the rising tide of job, economic fears
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12/1/2008   1 comment
The engineering profession is under pressure to change and adapt as the forces of globalization and manufacturing outsourcing push executives to move resources around the globe and hire engineers in low-cost locations to reduce operational expenses.
Salary Survey: Japanese engineers looking reluctantly overseas
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12/1/2008   Post a comment
More than half of Japanese engineers have not changed employers even once, according to an EE Times Japan survey. But there's growing evidence--albeit anecdotal--that some older Japanese engineers are receptive to moving to China or Korea for a few years to fatten their retirement stash. Others are moving to the United States for permanent stay.
Fairchild files patent suit against Infineon
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12/1/2008   Post a comment
Fairchild Semiconductor filed a lawsuit against Infineon Technologies, claiming the German chip maker is infringing eight of its patents.
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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
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