Five unsolicited tips to CE makers News & Analysis 12/22/2009 Post a comment EE Times offers five unsolicited tips for conventional CE vendors in a new CE era -- when superior hardware specs alone won't help them gain market share or even assure their survival.
Spring shielding on M9 connectors rated to 4A Product News 12/22/2009 Post a comment Binder Connector has enhanced its extensive range of M9 connectors with the introduction of iris spring technology for terminating the cable screen in the metal-bodied 712 series of sub-miniature circular connectors.
Power Paper, GE team on OLED lighting News & Analysis 12/22/2009 Post a comment Power Paper Ltd. (Tel Aviv, Israel), a group developing thin and flexible micro-power source technology and devices, is working with GE Global Research, the technology development arm for the General Electric Company to develop self-powered OLED lighting devices.
Universities gear up for smart grid training News & Analysis 12/22/2009 Post a comment The U.S. Department of Energy is evaluating dozens of proposals from universities and others seeking $100 million in grants to train tomorrow's engineers and technicians for as many as 30,000 new jobs that could be needed over the next few years as today's electric grid transitions to a digital network.
Amkor raises Q4 sales target News & Analysis 12/22/2009 Post a comment Semiconductor test and assembly house Amkor Technology Inc. Monday (Dec. 21) raised its fourth quarter sales target, citing higher than expected demand across all of its product lines.
Sun exec named Altera CFO News & Analysis 12/21/2009 Post a comment Programmable logic supplier Altera Corp. Monday (Dec. 21) appointed Ronald J. Pasek, a 19-year veteran of Sun Microsystems Inc., to the position of chief financial officer.
Report: TSMC to raise salaries 15% News & Analysis 12/21/2009 Post a comment TMSC, he world's No. 1 semiconductor foundry, will increase base salaries for employees by 15 percent beginning next month, anticipating a strong year, according to a Reuters report.
Ford will enable Wi-Fi in some 2010 cars Product News 12/21/2009 Post a comment Ford Motor Co. said the next generation of its Sync in-car infotainment systems to be released in 2010 will support Wi-Fi, but users will have to supply a wireless modem that plugs into the Sync systems USB slot to link the in-car Wi-Fi net to the Internet.
Taiwanese multimedia chip company licenses MIPS cores News & Analysis 12/21/2009 Post a comment Processor IP licensor MIPS Technologies Inc. (Sunnyvale, Calif.) has announced that Magic Pixel Inc. (Hsinchu, Taiwan), a supplier of multimedia SoCs, has licensed the 24KEc and 4KEc processor cores for use in digital photo frames (DPFs) and other portable multimedia applications.
Tower Semiconductor raises Q4 guidance News & Analysis 12/21/2009 Post a comment Foundry IC supplier Tower Semiconductor Ltd. (Migdal Haemek, Israel) has raised its fourth-quarter revenue guidance to between $98 million and $102 million. Tower trades as TowerJazz.
Intel packs graphics on Atom for netbooks News & Analysis 12/21/2009 Post a comment Intel Corp. is shipping new versions of its Atom processor that integrate graphics and a memory controller on the same die as the x86 CPU in hopes the new chips will help expand its lead in the rapidly growing market for netbooks.
Oclaro to buy Xtellus News & Analysis 12/18/2009 Post a comment Oclaro Inc. has acquired Xtellus Inc.
Under the terms, Xtellus will receive shares of common stock of Oclaro worth $33 million, a portion of which will be held in escrow for 18 months to support Xtellus' indemnification obligations to Oclaro.
Solar firm Solyndra files IPO News & Analysis 12/18/2009 Post a comment Solyndra Inc. (Fremont, Calif.), a manufacturer of cylindrical photovoltaic systems, has filed a registration statement with the U.S. Securities and Exchange Commission (SEC) relating to the proposed initial public offering (IPO) of its common stock.
IEEE to revise standard for rechargeable cellular batteries News & Analysis 12/18/2009 Post a comment The IEEE has approved work to begin on a revision to IEEE Std 1725, "Standard for Rechargeable Batteries for Cellular Telephones" which addresses the quality and reliability of rechargeable lithium ion and lithium ion polymer batteries for cellular telephone applications.
WD and NEC Electronics collaborate on the USB 3.0 standard News & Analysis 12/18/2009 Post a comment External storage solutions provider WD and NEC Electronics collaborate to promote the USB 3.0 standard, capable of supporting data transfer rates of up to 5Gbps. The plan is to develop a USB Attached SCSI protocol (UASP) driver to deliver hard drives with very high performance, mass-storage capacity.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.