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Content posted in December 2009
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Analysis: More buyers seen for used fab tools
News & Analysis  
12/22/2009   Post a comment
Insiders say the quantity and quality of used semiconductor equipment thrown onto the market by the downturn has created more buyers--even among chip vendors who formerly shied away from refurbished gear.
Micron logs first profit in three years
News & Analysis  
12/22/2009   Post a comment
Memory chip vendor Micron Technology swung to profit in the quarter ended Dec. 3, topping Wall Street's expectations with sales of $1.74 billion.
Rubicon discloses capex plan
News & Analysis  
12/22/2009   Post a comment
Rubicon Technology Inc. has released additional details related to the company's two-year capacity expansion plan.
2010: 20 good and bad signs for electronics biz
News & Analysis  
12/22/2009   2 comments
Heading into 2010, there are both good and bad signs in the marketplace. Here's what various analysts think.
NIST award teams two providers of CNTs and inks
News & Analysis  
12/22/2009   Post a comment
Swent, a manufacturer of single-wall and specialty multi-wall carbon nanotubes, and Brewer Science, a producer of CNT inks for electronics applications, will team up to develop CNTs and inks on a commercial scale.
Five unsolicited tips to CE makers
News & Analysis  
12/22/2009   Post a comment
EE Times offers five unsolicited tips for conventional CE vendors in a new CE era -- when superior hardware specs alone won't help them gain market share or even assure their survival.
Bipolar 40-V precision op amps offer low power, low noise benefits
Product News  
12/22/2009   Post a comment
Intersil has introduced the latest members of the company's growing bipolar low power precision operational amplifier series.
Avnera chip provides multi-point HD audio connections
News & Analysis  
12/22/2009   Post a comment
Fabless chip maker Avnera unveils the world's first multi-point wireless solution to connect up to 10 audio devices from music players to speakers, according to the company.
Gyroscope and accelerometer share MEMS package
News & Analysis  
12/22/2009   Post a comment
STMicroelectronics has integrated an accelerometer with a gyroscope into MEMS package.
Spring shielding on M9 connectors rated to 4A
Product News  
12/22/2009   Post a comment
Binder Connector has enhanced its extensive range of M9 connectors with the introduction of iris spring technology for terminating the cable screen in the metal-bodied 712 series of sub-miniature circular connectors.
Hitachi High-Tech Instruments and Renesas Eastern Japan Semiconductor enter absorption-type company split agreement
News & Analysis  
12/22/2009   Post a comment
Hitachi High-Tech Instruments Co., a wholly owned subsidiary of Hitachi High-Technologies, and Renesas Eastern Japan Semiconductor, a wholly owned subsidiary of Renesas Technology, entered into an absorption-type company split agreement.
Power Paper, GE team on OLED lighting
News & Analysis  
12/22/2009   Post a comment
Power Paper Ltd. (Tel Aviv, Israel), a group developing thin and flexible micro-power source technology and devices, is working with GE Global Research, the technology development arm for the General Electric Company to develop self-powered OLED lighting devices.
Infineon raises guidance for fiscal first quarter
News & Analysis  
12/22/2009   Post a comment
German chip company Infineon Technologies AG (Munich, Germany) has raised the guidance for the first quarter of its 2009/10 fiscal year, which ends of Dec. 31, 2009.
LG forms OLED patent administrator, says report
News & Analysis  
12/22/2009   Post a comment
LG Electronics Inc. is reported to be forming a company to manage licenses and royalties for its patents in the area of organic light emitting diodes (OLEDs) and OLED displays, according to the Korea IT Times.
Automotive chip market to grow 13.5% in 2010, says Gartner
News & Analysis  
12/22/2009   Post a comment
The automotive semiconductor market is expected to decline by 26.5 percent in 2009 to $14.58 billion, after declining nearly 5 percent in 2008 to $19.53 billion, according to a fourth quarter update from market research firm Gartner.
12-V p-channel power MOSFET claims lowest on-resistance for a p-channel device in a PowerPAK SC-75
Product News  
12/22/2009   Post a comment
Vishay Intertechnology has introduced a new 12-V p-channel TrenchFET Gen III power MOSFET which the company claims offers the industry's lowest on-resistance for a p-channel device in the thermally enhanced PowerPAK SC-75, which features a 1.6-mm by 1.6-mm footprint area.
2-A and 3-A LDOs offer industry's fastest transient response, lowest dropout and highest DC accuracy
Product News  
12/22/2009   Post a comment
Intersil has introduced a pair of low voltage, high current, low dropout linear regulators (LDOs), specified at 2 A and 3 A output current respectively.
Universities gear up for smart grid training
News & Analysis  
12/22/2009   Post a comment
The U.S. Department of Energy is evaluating dozens of proposals from universities and others seeking $100 million in grants to train tomorrow's engineers and technicians for as many as 30,000 new jobs that could be needed over the next few years as today's electric grid transitions to a digital network.
GigOptix to devise integrated photonic transceiver
News & Analysis  
12/22/2009   Post a comment
GigOptix Inc. has been approved to receive $4.5 million in funding towards the development of an ''integrated photonic transceiver.''
Amkor raises Q4 sales target
News & Analysis  
12/22/2009   Post a comment
Semiconductor test and assembly house Amkor Technology Inc. Monday (Dec. 21) raised its fourth quarter sales target, citing higher than expected demand across all of its product lines.
Sun exec named Altera CFO
News & Analysis  
12/21/2009   Post a comment
Programmable logic supplier Altera Corp. Monday (Dec. 21) appointed Ronald J. Pasek, a 19-year veteran of Sun Microsystems Inc., to the position of chief financial officer.
Quake costs TSMC half day of production
News & Analysis  
12/21/2009   Post a comment
A magnitude 6.4 earthquake that struck Taiwan over the weekend resulted in the loss of more than half a day's wafer production at TSMC., the company said.
Report: TSMC to raise salaries 15%
News & Analysis  
12/21/2009   Post a comment
TMSC, he world's No. 1 semiconductor foundry, will increase base salaries for employees by 15 percent beginning next month, anticipating a strong year, according to a Reuters report.
Ford will enable Wi-Fi in some 2010 cars
Product News  
12/21/2009   Post a comment
Ford Motor Co. said the next generation of its Sync in-car infotainment systems to be released in 2010 will support Wi-Fi, but users will have to supply a wireless modem that plugs into the Sync systems USB slot to link the in-car Wi-Fi net to the Internet.
Is MEMC going down wrong solar path?
News & Analysis  
12/21/2009   Post a comment
Silicon wafer maker MEMC Electronic Materials Inc. continues to invest in solar.
Taiwanese multimedia chip company licenses MIPS cores
News & Analysis  
12/21/2009   Post a comment
Processor IP licensor MIPS Technologies Inc. (Sunnyvale, Calif.) has announced that Magic Pixel Inc. (Hsinchu, Taiwan), a supplier of multimedia SoCs, has licensed the 24KEc and 4KEc processor cores for use in digital photo frames (DPFs) and other portable multimedia applications.
Seven things to fix in 2010. Join the conversation
News & Analysis  
12/21/2009   17 comments
The editors of EE Times came up with their own informal list of things we hope engineers fix in 2010, spanning everything from nano-lithography to space travel. What do you want to see get done next year?
FormFactor recruits Chenming Hu to board
News & Analysis  
12/21/2009   Post a comment
Probe-card maker FormFactor Inc. (Livermore, Calif.) has announced the appointment of Chenming Hu to the company's board of directors.
Nanofabrication equipment market to reach $90 billion in 2014, says analyst
News & Analysis  
12/21/2009   Post a comment
The market for nanofabrication equipment will grow at a compound annual growth rate of 10.4 percent over the period 2009 to 2014 and reach $90.4 billion in that year, according to Innovative Research and Products Inc. (Stamford, Connecticut).
Winning, losing sectors in equipment markets through 2013
News & Analysis  
12/21/2009   Post a comment
The compound annual growth rates for the various market sectors quoted by IC Insights for the period 2008 to 2013 are generally low as they factor in a fall in the market for electronic equipment in 2009.
Green silliness, or 'there is no free lunch, sorry'
News & Analysis  
12/21/2009   5 comments
Pedaling to produce your own power. Is it a vision of the future, or a ride to the past?
In-vehicle-network ICs support powerful LIN slaves
Product News  
12/21/2009   Post a comment
Austriamicrosystems has introduced two new high voltage automotive CMOS LIN 2.1 transceiver ICs to support in-vehicle-network applications.
Vishay claims first 45-A single in-line rectifiers in a PowerBridge package
Product News  
12/21/2009   Post a comment
Vishay Intertechnology, Inc., has introduced a new series of enhanced high-current-density PowerBridge rectifiers with current ratings of 30 A to 45 A, maximum peak reverse voltage ratings of 600 V to 1000 V, and a high case dielectric strength of 1500 V.
Ericsson Power Modules extends Mouser Electronics distribution agreement to cover EMEA regions
News & Analysis  
12/21/2009   Post a comment
Ericsson Power Modules has extended its distribution agreement with electronic component distributor, Mouser Electronics to include the EMEA regions.
Tower Semiconductor raises Q4 guidance
News & Analysis  
12/21/2009   Post a comment
Foundry IC supplier Tower Semiconductor Ltd. (Migdal Haemek, Israel) has raised its fourth-quarter revenue guidance to between $98 million and $102 million. Tower trades as TowerJazz.
8-bit body control MCUs have standby power consumption of 0.65microA
Product News  
12/21/2009   Post a comment
NEC Electronics launched eight new all flash MCUs for automotive control, designed to respond to all temperature environments, with a standby power consumption of only 0.65microA.
Murata widens line-up of automotive grade NTC chip thermistors
Product News  
12/21/2009   Post a comment
Murata Electronics has launched a new automotive grade series of compact NTC (negative temperature coefficient) chip thermistors for operation at temperatures between -40 and +150 degree C.
Intel packs graphics on Atom for netbooks
News & Analysis  
12/21/2009   Post a comment
Intel Corp. is shipping new versions of its Atom processor that integrate graphics and a memory controller on the same die as the x86 CPU in hopes the new chips will help expand its lead in the rapidly growing market for netbooks.
Email to the editor: FTC's complaint is about runtime libraries
News & Analysis  
12/19/2009   1 comment
A reader provides extra detail on the compiler issues behind the FTC's recently-made suit against Intel.
Oclaro to buy Xtellus
News & Analysis  
12/18/2009   Post a comment
Oclaro Inc. has acquired Xtellus Inc. Under the terms, Xtellus will receive shares of common stock of Oclaro worth $33 million, a portion of which will be held in escrow for 18 months to support Xtellus' indemnification obligations to Oclaro.
Memsic buys 'mote' line from Crossbow
News & Analysis  
12/18/2009   Post a comment
Memsic Inc., a MEMS solution provider, has acquired selected products from Crossbow Technology.
Solar firm Solyndra files IPO
News & Analysis  
12/18/2009   Post a comment
Solyndra Inc. (Fremont, Calif.), a manufacturer of cylindrical photovoltaic systems, has filed a registration statement with the U.S. Securities and Exchange Commission (SEC) relating to the proposed initial public offering (IPO) of its common stock.
Texas Instruments qualifies Bluetooth low energy controller on BlueLink 7.0 solution
News & Analysis  
12/18/2009   Post a comment
Following hot on the heels of the adoption of Bluetooth Core Specification Version 4.0 by the Bluetooth Special Interest Group (SIG), Texas Instruments Incorporated has qualified a Bluetooth low energy wireless technology controller on TI's highly-integrated BlueLink 7.0 (BL6450-L) solution.
Single channel power switches offer USB port protection
Product News  
12/18/2009   Post a comment
Diodes Incorporated has introduced 0.5 A single channel power switches optimized for USB port protection and other 3 V to 5 V hot swap interconnects.
Intel at 32-nm, $99 netbook, debt-free Freescale lead weekly story ranking
News & Analysis  
12/18/2009   Post a comment
Here are the top five online stories for the week beginning Sunday, Dec. 13, as ranked by EE Times readers, up to and including Friday, Dec. 18. The ranking is based on the number of reader "views" or "hits" on a particular article.
Bluetooth SIG adopts low energy specification
News & Analysis  
12/18/2009   Post a comment
The Bluetooth Special Interest Group has announced the adoption of the Bluetooth Core Specification Version 4.0, which includes a low energy modes.
IEEE to revise standard for rechargeable cellular batteries
News & Analysis  
12/18/2009   Post a comment
The IEEE has approved work to begin on a revision to IEEE Std 1725, "Standard for Rechargeable Batteries for Cellular Telephones" which addresses the quality and reliability of rechargeable lithium ion and lithium ion polymer batteries for cellular telephone applications.
SIG introduces Bluetooth low energy wireless technology
News & Analysis  
12/18/2009   Post a comment
The Bluetooth Special Interest Group (SIG) has announced it is to adopt Bluetooth low energy wireless technology, which is the hallmark feature of the Bluetooth Core Specification Version 4.0.
RMS power detector claims best-in-class power management device for 3G and 4G mobile terminals
Product News  
12/18/2009   Post a comment
Analog Devices, Inc., has expanded its industry-leading TruPwr RF power detector product family with the introduction of a new integrated device for 3G and 4G mobile terminals.
WD and NEC Electronics collaborate on the USB 3.0 standard
News & Analysis  
12/18/2009   Post a comment
External storage solutions provider WD and NEC Electronics collaborate to promote the USB 3.0 standard, capable of supporting data transfer rates of up to 5Gbps. The plan is to develop a USB Attached SCSI protocol (UASP) driver to deliver hard drives with very high performance, mass-storage capacity.
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