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Content posted in December 2010
<<   <   Page 6 / 6
Magma preps Talus IC implementation tool for 20nm
Product News  
12/3/2010   Post a comment
Magma Design Automation Inc. has introduced Talus 1.2, a next-generation IC implementation solution that features faster, more advanced routing, timing, extraction technologies to accelerate next generation SoC implementation.
TSMC hands out fab tool awards
News & Analysis  
12/3/2010   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) held its 10th annual supply chain management forum to recognize the support and outstanding contributions of its suppliers over the past year and to award nine exceptional materials, equipment, and facilities service suppliers.
Toshiba forms IC venture in Brazil
News & Analysis  
12/3/2010   6 comments
Japan's Toshiba Corp. has signed a memorandum of understanding on the establishment of a semiconductor design house joint venture with the Wernher von Braun Center for Advanced Research (VBC), one of Brazil's electronics engineering research institutes, and Semp Toshiba Informática Ltda. (STI), a Brazilian Toshiba affiliate.
Wafer prices dropped in Q3, says GSA
News & Analysis  
12/3/2010   4 comments
Wafer prices continued to fall in the third quarter of 2010 but by more modest percentages than in the previous quarter, according to a survey conducted by the Global Semiconductor Alliance.
October chip sales were flat, says ESIA
News & Analysis  
12/3/2010   10 comments
The three-month average of global sales of semiconductors for September was $26.32 billion, essentially flat compared with the previous month and up 19.8 percent compared with the same month a year before, according to the European Semiconductor Industry Association.
Survey: IC execs upbeat about 2011
News & Analysis  
12/3/2010   8 comments
Despite a lull in the market, semiconductor executives are generally optimistic about 2011, according to a global survey conducted by KPMG LLP, the U.S. audit, tax and advisory firm.
Motorola hits 'speed bump' in handsets
News & Analysis  
12/3/2010   7 comments
After years' of red ink and lost share, Motorola's handset unit has recently been making a comeback, according to an analyst.
Oracle lights Sparcs, breaks database record
News & Analysis  
12/3/2010   9 comments
Oracle retook the lead in database performance executing 30 million transactions/minute and announced an upgraded Sparc processor and progress on a next-generation chip.
Cypress PSOC5 CY8C52 begins sampling
Product News  
12/3/2010   Post a comment
Bobby Jania, Cypress product marketing manager, talks about his company's PSOC 5 device and potential applications, including motor-controlled baby strollers.
Magma hits targets, but swings to loss
News & Analysis  
12/2/2010   2 comments
Magma Design Automation said it exceeded all guidance targets for a seventh consecutive quarter, but the company reported a GAAP net loss after posting a profit in the year-ago quarter.
Is Samsung switching high-k camps?
News & Analysis  
12/2/2010   4 comments
Is South Korea's Samsung Electronics Co. Ltd. switching gears in high-k?
Avago's sales fall short of analysts' views
News & Analysis  
12/2/2010   Post a comment
Analog/mixed-signal chip vendor Avago Technologies posted sales for the quarter ended Oct. 31 that improved both sequentially and year-over-year, but fell slightly short of consensus analysts' expectations.
FPGA Space Forum 2011 kicks off in Los Angeles
News & Analysis  
12/2/2010   4 comments
Space Forum 2011, formerly known as the Actel Space Forum, kicks off today in Los Angeles, California (I wish I was there).
Mentor, RIM buy embedded software firms
News & Analysis  
12/2/2010   3 comments
In a sign of the rising importance of software in mobile and embedded systems, Mentor Graphics acquired assets of CodeSourcery the same day Research in Motion announced it has bought The Astonishing Tribe.
Plessey in talks over job cuts, say reports
News & Analysis  
12/2/2010   4 comments
Plessey Semiconductors Ltd., the company formed by the management teams from Plus Semi in Swindon, England, and the former X-Fab wafer fab in Plymouth, England, has begun a 30-day consultation over the jobs of more than a third of work force, according to local reports.
October chip sales were flat, says analyst
News & Analysis  
12/2/2010   3 comments
The three-month average of global chip sales for October is set to be $26.5 billion, the same as in September, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
Phase-change memory found in handset
News & Analysis  
12/2/2010   60 comments
Engineering consultancy UBM TechInsights has found a phase-change memory die inside a multi-chip package inside a mobile handset.
Qimonda administrator sues Infineon
News & Analysis  
12/2/2010   Post a comment
The insolvency administrator dealing with the bankruptcy estate of Qimonda AG, Michael Jaffe, has filed an action in the District Court Munich against its parent company, chipmaker Infineon Technologies AG, seeking an unspecified amount of money for the estate.
Samsung claims top density 30-nm LPDDR2 DRAM
Product News  
12/2/2010   Post a comment
Claiming an industry first, Samsung Electronics said it began sampling last month monolithic 4-gigabit (Gb), low power double-data-rate 2 (LPDDR2) DRAM using 30-nm class technology.
Micron clears up NAND with integrated part
News & Analysis  
12/2/2010   3 comments
Seeking to simplify the product design process, Micron Technology Inc. has rolled out a device that integrates NAND flash and error correction code (ECC) technology in the same package.
IP revenue to decline beyond 2014, says Gartner
News & Analysis  
12/2/2010   Post a comment
By 2014, the number of third-party semiconductor design IP blocks in an average chip design will double from the current level, according to Gartner Inc. However, average license and royalty revenues will continue to decline.
Micron recruits Spansion exec amid reorg
News & Analysis  
12/2/2010   1 comment
Following the acquisition of NOR flash vendor Numonyx BV earlier this year, Micron Technology Inc. has reorganized its memory operations, forming four separate units within the company.
Rambus sues six top chip makers
News & Analysis  
12/2/2010   12 comments
Rambus Inc. has filed multiple suits asking courts to bar imports of a wide range of chips—and systems using them--from Broadcom, Freescale, LSI, MediaTek, Nvidia and STMicroelectronics it claims infringe its patents.
Synopsys beats analysts' expectation
News & Analysis  
12/1/2010   Post a comment
EDA and IP vendor Synopsys reported fiscal fourth quarter sales that exceeded analysts' expectations and said it expects revenue growth of 9 to 11 percent in fiscal 2011.
Verizon details plan for Dec. 5 LTE launch
News & Analysis  
12/1/2010   9 comments
Verizon Wireless said it will turn on its Long Term Evolution network December 5 and announced first details of its mobile data plans and modem providers.
Moto splits up, preps tablet PC
News & Analysis  
12/1/2010   12 comments
As expected, Motorola Inc. has split into two entities. Amid the move, Motorola is preparing to roll out a new tablet PC, according to an analyst.
WSTS lowers IC forecast for '11
News & Analysis  
12/1/2010   4 comments
The World Semiconductor Trade Statistics (WSTS) group has altered its IC forecasts. The group raised its forecast for 2010, but lowered it for 2011.
Maxim Integrated Products' MAXQ7670A MAXQ mixed-signal microcontrollers
Product News  
12/1/2010   Post a comment
Maxim's latest MAXQ microcontroller integrates a differential amplifier to eliminate the need for external amplifiers on each sensor input channel.
Wavien, Osram team on LEDs for picoprojection
News & Analysis  
12/1/2010   1 comment
Wavien Inc., a licensor of technologies for enhancing lighting, has announced collaboration with Osram Opto Semiconductors GmbH to develop RGB LEDs for projection applications.
Telegent hits 100 million TV chips shipped
News & Analysis  
12/1/2010   Post a comment
Mobile TV chip vendor Telegent Systems Inc. has announced that it shipped its 100 millionth mobile TV receiver in November 2010.
STMicroelectronics' SPIMD20 motion control module
Product News  
12/1/2010   3 comments
STMicroelectronics has unveiled a customizable high-end motor-control module that is small enough to mount directly on the motor as well as provide connection via industrial Ethernet.
Samsung offers NFC chip for mobiles
News & Analysis  
12/1/2010   3 comments
Leading chip maker Samsung Electronics Co. Ltd. has announced a near field communications (NFC) chip with embedded flash memory intended for use in mobile handsets.
Vishay VH102Z and VHZ555 Bulk Metal Z-Foil resistors
Product News  
12/1/2010   Post a comment
Built on a new-generation Z-Foil technology, Vishay’s hermetically sealed metrology and laboratory-grade Bulk Metal Z-Foil resistors feature TCR to ±0.05ppm/°C, load-life stability of 0.005%, and tolerance to ±0.005%.
Huawei buys IMEC spin-off for $10 million
News & Analysis  
12/1/2010   7 comments
Chinese telecommunications equipment maker Huawei Technologies Co. Ltd. has agreed to acquire IMEC spin-off company M4S NV, from Option NV, a supplier of wireless broadband equipment, subsystems and software.
France offers to buy 14% of ST, say reports
News & Analysis  
12/1/2010   4 comments
France's strategic investment fund (FSI) has offered to buy a 14 percent stake in Europe's largest chip company, STMicroelectronics NV, for around 700 million euro (about $900 million), according to local reports.
Qualcomm's Jacobs still bullish on mobile TV
News & Analysis  
12/1/2010   8 comments
Mobile TV, payments and health care were hot topics for Qualcomm's Paul Jacobs and HP's Jon Rubinstein in an on-stage discussion.
Adesto gains Darpa award
News & Analysis  
12/1/2010   1 comment
Adesto Technologies Inc. said it has received an award from Darpa to develop and demonstrate CBRAM memory devices that operate at sub threshold voltages–a level that is more than 100 times lower than standard flash memory.
IBM debuts CMOS silicon nanophotonics
News & Analysis  
12/1/2010   38 comments
IBM Research demonstrated an all-silicon optical transceiver that combines modulators, wave guides, wavelength-division multiplexers, switches and detectors all on a single CMOS die.
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