Imagination raises MIPS bid News & Analysis 12/17/2012 1 comment The bidding war between Imagination Technologies and Ceva for MIPS Technologies Inc. has reached $100 million. MIPS is a long-established licensor of processor architectures and IP.
IBM provides Russia with 90-nm process News & Analysis 12/15/2012 2 comments IBM has agreed to help Russia's Angstrem out with a 90-nm manufacturing process as part of a broader agreement on collaboration that will range from mathematics to microelectronics and computer science.
Altera eyes FDSOI process for FPGAs News & Analysis 12/15/2012 4 comments In what could signify a move away from foundry TSMC, Altera has been looking at a fully-depleted silicon-on-insulator manufacturing process as an option for future FPGAs.
FDSOI roadmap renames next node as 14-nm News & Analysis 12/12/2012 5 comments Documents presented at a meeting about fully depleted silicon on insulator (FDSOI) chip manufacturing in San Francisco show that the FDSOI roadmap now omits a 20-nm and goes straight to 14-nm and then on to 10-nm on a two-yearly period.
IBM details 3-D server chip stacks News & Analysis 12/12/2012 4 comments IBM will show work stacking 45-nm server processors with memory and transceivers at IEDM, techniques that could give it significant performance and power gains.
Toshiba claims MRAM can replace SRAM News & Analysis 12/11/2012 7 comments Smartphones and tablet computers could benefit from a prototype memory that Toshiba expects to be used to replace SRAM in cache memory for mobile processors.
28-nm FDSOI is production ready, says ST News & Analysis 12/11/2012 11 comments To coincide with a meeting on process technology held alongside IEDM, European chip company ST has announced that its 28-nm fully depleted silicon-on-insulator (FDSOI) is available for pre-production volumes from its wafer fab at Crolles, France.
ADI introduces two waveform generators Product News 12/11/2012 Post a comment Analog Devices, Inc. has introduced the AD9106 quad-channel, 12-bit, and the AD9102 single-channel, 14-bit, 180-MSPS waveform generators, integrating on-chip static random access memory and direct digital synthesis for complex waveform generation.
IBM, Intel face off at 22 nm News & Analysis 12/11/2012 4 comments IBM is prototyping server CPUs in a new 3-D ready, 22-nm process disclosed at IEDM as Intel shared details of its SoC work and talked privately about its costs and foundry business.
Imagination raises bid for MIPS News & Analysis 12/10/2012 1 comment Imagination Technologies, the graphics processor IP licensor, has raised its bid for processor IP specialist MIPS Technologies to $80 million in an attempt to top rival bidder Ceva.
Top 10 smartphone gadgets & apps News & Analysis 12/10/2012 9 comments Smartphones are turning the CE industry upside down. A new design imperative is to leverage a smartphone or build a genuine "partner" for a smartphone, when designing a new gadget.
ST remains committed to FD-SOI, says CEO News & Analysis 12/10/2012 2 comments Despite planning to exit from its joint venture ST-Ericsson, one of few users of its fully-depleted silicon on insulator (FDSOI) manufacturing process, European chip maker intends to keep faith with the technology and continue using it at its wafer fab in Crolles, near Grenoble, France.
ST-Ericsson vows to keep working on turnaround News & Analysis 12/10/2012 2 comments Loss-making mobile digital chip company ST-Ericsson NV, the joint venture that STMicroelectronics has said it will exit, has said it will not change its strategy as a result of ST's announcement.
ST to exit ST-Ericsson in 2013 News & Analysis 12/10/2012 12 comments As part of a strategic plan to improve the financial situation of the company STMicroelectronics has announced its intention to exit from mobile digital joint venture ST-Ericsson during 2013.
Voyager: Electronics for the long haul News & Analysis 12/7/2012 9 comments The electronics revolution of the last four decades has contributed mightily to humankind’s attempt to test Carl Sagan’s theory: "If we are alone in the Universe, it sure seems like an awful waste of space."
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.