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Content posted in February 2003
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2.5-Gbit/s channelized GFP framer
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2/28/2003   Post a comment
The POSIC2G framer, also called the CY7C9537, is a 2.5-Gbit/s channelized Sonet/SDH framer equipped with generic framing procedure (GFP) capabilities and resilient packet ring (RPR) support.
ASML, Canon, Nikon take dip into immersion litho
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2/28/2003   Post a comment
During the SPIE Microlithography conference here today (February 27, 2003), ASML Holding NV, Canon Inc., and Nikon Corp. separately disclosed that they are taking the first steps in what could be the next "breakthrough" in chip production: immersion lithography.
Applied, Numerical to work on litho enhancement
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2/27/2003   Post a comment
Applied Materials Corp. and Numerical Technologies Inc. have signed a joint development agreement for reticle enhancement technologies (RETs) aimed at 193-nm lithography, according a Thursday (Feb. 27) announcement.
IDT trimming 5% of workforce
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2/27/2003   Post a comment
Hogan sees silicon explosion as costs drop
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2/27/2003   Post a comment
SANTA CLARA, Calif. — Speaking at a International Society for Optical Engineering (SPIE) manufacturing conference here, James Hogan, a founder of Cadence Design Systems and now senior vice president for business development at Artisan Components, opened a session on IC cost and performance with a discussion of "silicon economics.?
50 Hynix managers tender resignations
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2/27/2003   Post a comment
Hynix Semiconductor Inc. (Seoul, South Korea) said Thursday (Feb. 27) that all its senior executives, some 50 in number, had offered to resign, following shareholder approval of a bailout plan for the financially strapped DRAM maker, according to the Reuters news agency.
Rudolph cuts global workforce by 10%
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2/27/2003   Post a comment
Chip-equipment maker Rudolph Technologies Inc. today (February 27, 2003) said it would reduce its global workforce by approximately 10%, due to the continued weakness in the semiconductor industry.
Microtune expands legal assault against Broadcom
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2/27/2003   Post a comment
Microtune Inc. today (February 27, 2003) expanded its legal assault against Broadcom Corp., claiming Broadcom has violated the Texas Anti-Trust Act and engaged in anti-competitive and monopolistic conduct.
DDi defaults on credit agreements
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2/27/2003   Post a comment
IDT cuts 150 jobs, shuts down Dallas design center
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2/27/2003   Post a comment
Hit hard by the current and severe IC downturn, Integrated Device Technology Inc. here today (February 27) plans to reduce its workforce by 5 percent, or 150 employees.
Marvell's Q4 sales jumps 11% in tough market
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2/27/2003   Post a comment
Marvell Technology Group Ltd. reported sales of $150.8 million for the fourth quarter of fiscal 2003, an 82% increase from $82.8 million for the fourth quarter of 2002 and an 11% jump from $135.9 million for the third quarter of 2003.
Study sees opening for IP video networks
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2/27/2003   Post a comment
The break-even point and potential profitability for video services carried over newly deployed broadband networks could be less than two years now that incumbent telecommunication carriers have been freed from sharing their new fiber networks with rivals, according to multimedia analysts.
1:4 deserializer features CDR
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2/27/2003   Post a comment
Infineon says it still plans to leave ProMos
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2/27/2003   Post a comment
Infineon Technologies AG on Thursday denied that the German chipmaker was considering a reconciliation with Mosel Vitelic of Taiwan in the rupture of the two firms over their ProMOS joint DRAM venture.
Oscillator offers 4 output phases
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2/27/2003   Post a comment
Switches serve portable apps
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2/27/2003   Post a comment
Platform speeds fail-over in redundant systems
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2/27/2003   Post a comment
The Redundant Host product line, a continuous service availability subsystem for always-on applications, shortens fail-over time to milliseconds.
Controller built for USB 2.0
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2/27/2003   Post a comment
Nintendo may use Matrix's 3-D memory
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2/27/2003   Post a comment
Nintendo Co. Ltd. has invested $15 million in Matrix Semicondcutors Inc., which has developed a non-volatile 3D memory, Matrix said this week.
Telematics spec delivered amidst growing doubts
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2/27/2003   Post a comment
Capping an intense four-year effort, the Automotive Multimedia Interface Collaboration (AMI-C) introduced a hefty new multimedia standard Wednesday (Feb. 26) to a global auto industry that has begun to question the value of telematics.
Let China's fabs have top technology says Infineon's Schumacher
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2/27/2003   Post a comment
Ulrich Schumacher, chief executive officer of Infineon Technologies AG, said that is inevitable that Chinese foundries would develop or acquire leading-edge process technology and therefore companies should join with China's fabs and help them.
VLSI lowers '03 IC forecast, but shortages loom
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2/27/2003   Post a comment
VLSI Research Inc. here today lowered its semiconductor and fab-tool forecasts for 2003, but the market research firm also warned of capacity shortages by year's end.
Le centre R&D Crolles 2 ouvre ses portes à 1200 ingénieurs
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2/27/2003   Post a comment
Jacques Chirac a inauguré aujourd'hui le centre de recherche et de développement Crolles 2 sur le site de STMicroelectronics, près de Grenoble. Cette initiative commune entre Motorola, Philips et STMicroelectronics rentre dans le cadre d'un partenariat sur cinq ans, visant à développer conjointement les technologies de circuits intégrés d'une finesse de 90 à 32 nanomètres sur tranche de silicium de 300 mm. Cette alliance a été formée en mars 2002 lorsque Motorola a rejoint le tandem existant ST
Sind Elektronikingenieure nur noch Wegwerfware?
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2/27/2003   Post a comment
Der bekannte deutsch-amerikanische Fachjournalist Henning Wriedt (Bild) wird für EETimes.de künftig regelmäßig die Kolumne "Transatlantische Ansichten" schreiben. In seinem ersten Kommentar befasst sich Wriedt mit dem Berufsbild von Elektronik-Ingenieuren in den USA. Weit weg, glauben Sie? Im Zeitalter der globalen Wirtschaft sind uns die USA näher, als manche wahrhaben wollen ...
Numerical, Applied team on 193-nm resolution enhancement
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2/27/2003   Post a comment
SAN JOSE, Calif. --- Physical EDA company Numerical Technologies, Inc., has agreed with chipmaking equipment Applied Materials Inc. to work together on resolution enhancement technologies for 193-nanometer wavelength lithography.
Crolles2 R&D centre opens, looks to employ 1,200 engineers
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2/27/2003   Post a comment
French President Jacques Chirac today opened the Crolles2 R&D facility at STMicroelectronics' plant near Grenoble. The joint initiative between Motorola-Philips-STMicroelectronics forms part of a five-year partnership to jointly develop processes from the 90nm to 32nm nodes on a 300mm manufacturing line at the French R&D facility.
ASML erobert Platz drei unter Chip-Ausrüstern
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2/27/2003   Post a comment
Zwar konnte Applied Materials seine Führungsposition als größter Anbieter von Chip-Equipment auch 2002 verteidigen, doch der eigentliche Gewinner des vergangenen Jahres heißt ASML. Laut der "Top-ten-Hitliste" für 2002, die vom Marktforschungsunternehmen VLSI Research veröffentlicht wurde, konnte die ASML Holding NV zwei Plätze gut machen und sich als weltgrößter Lithographie-Anbieter etablieren.
IBM mahnt Zusammenarbeit bei Lithografie an
News & Analysis  
2/27/2003   Post a comment
Eine Führungskraft von IBM fordert die Halbleiter- und Chipausstatter-Branche nachdrücklich auf, ihre Differenzen auszuräumen und zeitig bei der Entwicklung von Tools für die Next Generation Lithography (NGL) zusammenzuarbeiten.
EITO sieht Markterholung für Europa vor USA
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2/27/2003   Post a comment
Nach den neuesten Zahlen des European Information Technology Observatory (EITO) befindet sich der Markt für Informationstechnologie und Telekommunikation (ITK) in Westeuropa auf dem Weg der Erholung.
Panelists urge focus on end customer
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2/27/2003   Post a comment
MONTEREY, Calif. — Three separate panels at the Global Press Summit here this week all came surprisingly close to the same conclusion: that with lengthening supply chains, uncertain end-user demand and no killer applications in sight, wisdom lies in getting to know not just your customer, but the end consumer.
Consumer-Elektronik verlangt EDA-Innovationen
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2/27/2003   Post a comment
Wenn sich die Welt von der noch anhaltenden Konjunkturflaute erholt hat, wird im Hightech-Sektor die Unterhaltungselektronik zu den interessantesten Branchen zählen. Es zeichnet sich ab, dass innovative Produktgruppen aus dem Endverbraucher-Segment als Triebfeder für die Halbleiterproduktion dienen werden.
Coalition creates multiple sources for tunable lasers
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2/27/2003   Post a comment
Four leading players in the optical communications sector, iolon, Intel, Bookham Technology and Santur Corporation have joined forces to establish a Multi-Source Agreement (MSA) for tunable lasers.
Premier Farnell rebrands U.S operations
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2/27/2003   Post a comment
Distributor Premier Farnell announced today that it is rebranding its American operations within its Marketing Distribution Division (MDD).
Fifty Hynix executives resign, says report
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2/27/2003   Post a comment
SEOUL, South Korea -- About 50 company executives at troubled DRAM maker Hynix Semiconductor Inc. have resigned, according to a Dow Jones Business News report
IRC resistor line offers power ratings up to 3 W
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2/27/2003   Post a comment
Designed for applications that require surface-mount components with high power ratings, a resistor series from TT electronics' IRC Wirewound and Film Technologies Division boasts power ratings up to 3 watts and superior pulse-handling characteristics.
Power relays shrink in size, power draw
News & Analysis  
2/27/2003   Post a comment
Pin-compatible with its previous NY series of power relays, Fujitsu Components America Inc.'s most recent high-performance relay offers a 31 percent height reduction and 8 percent lower power consumption for applications such as programmable logic controllers, I/O modules and inverter control.
Connector kit handles fiber
News & Analysis  
2/27/2003   Post a comment
Tyco Electronics' multimode LC connector plug kits come in simplex and duplex versions for 900-micron buffered cable and 1.6-to-2-mm, 2.4-mm and 3-mm jacketed cable. Pricing is roughly $2.70 for simplex and $5.40 for duplex in quantities greater than 1,000.
Fox touts tiny oscillator series
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2/27/2003   Post a comment
At 3.2 x 2.5 x 1.2 mm, Fox Electronics' F330 series oscillator is half the length of previous models, said the company.
SMT power inductors roll
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2/27/2003   Post a comment
Combining shielding and a small (10 x 10.2 x 4-mm) package size, the PM104SH series of SMT power inductors from J. W. Miller targets high-current applications.
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