Handy-Markt wächst rasant weiter News & Analysis 2/28/2006 Post a comment Im vergangenen Jahr wurden weltweit 816 Millionen Mobiltelefone verkauft – 21 Prozent mehr als im Jahr zuvor. Das Wachstum wird erst einmal weitergehen, prophezeit das Marktforschungsinstitut Gartner. Allerdings hält auch der Konzentrationsprozess an.
Micronic – allein im Fotomasken-Markt News & Analysis 2/28/2006 Post a comment Mit der Schließung von Etec Systems, dem ehemaligen Marktführer bei Patterngeneratoren für die Herstellung von Halbleiter-Fotomasken, hat sich Applied Materials in aller Stille aus der Maskenfertigung zurückgezogen. Seitdem gibt es nur noch einen wettbewerbsfähigen Anbieter von Laser-Anlagen für die Fotomasken-Herstellung: das schwedische Unternehmen Micronic Laser Systems AB.
SystemC IDE requires no license for executables creation News & Analysis 2/28/2006 Post a comment Electronic system level and hardware description language design solution provider Summit Design said its Vista integrated development environment for SystemC design and debug can now easily create and compile executables of SystemC designs based on the OSCI simulation kernel.
Silicon Design Chain claims methodology validation News & Analysis 2/28/2006 Post a comment The Silicon Design Chain Initiative claimed that a second, enhanced version of its power-management methodology and implementation up to tapeout of the ARM 1136JF-S processor is proof of the methodology and its interdependent technologies.
Report: Western Digital expects to meet guidance News & Analysis 2/27/2006 Post a comment Hard drive supplier Western Digital Corp. said that shipments and OEM demand are tracking to expectations for the March fiscal quarter, according to a Lehman Brothers analyst's note citing an 8-K filing from the company as the source.
China's Vimicro sees flat profits, sales News & Analysis 2/27/2006 Post a comment Vimicro International Corp., a fledging fabless semiconductor company in China, said revenue in the fourth quarter of 2005 was $27.5 million, compared with $27.4 million in the third quarter and up 113 percent from the $12.9 million reported in the fourth quarter of 2004.
Pentium-M chassis to underscore software productivity Product News 2/27/2006 Post a comment Thales Computers and IBM are readying a chassis called the PowerMP6. When it debuts in the near future, it will consist of multiple Pentium-M boards in a 19-in. rack. The PowerMP6 will be available in various customized configurations with up to eight processor boards per rack.
Op amps draw 13 uA per amp Product News 2/27/2006 Post a comment Exclusive to eeProductCenter: Linear Technology Corp. says its 1.8-volt dual and quad operational amplifiers are the first available in a tiny DFN package.
Memory Bulletin: NAND prices dive News & Analysis 2/27/2006 Post a comment Spot prices for NAND-based flash memories continue to fall at an alarming rate amid ongoing rumors of product order cancellations from Apple Computer Inc. and Sony Corp., according to Gartner Inc.
McTighe takes chair of Cambridge Semiconductor News & Analysis 2/27/2006 Post a comment Mike McTighe, an experienced U.K. electronics industry executive, has taken on the role of non-executive chair at Cambridge Semiconductor Ltd. (CamSemi), a privately held power semiconductor startup founded by two academics from the University of Cambridge.
STATS puts pop in PoP packages News & Analysis 2/27/2006 Post a comment Singapore’s STATS ChipPAC Ltd. said that it has increased the performance of its package-on-package (PoP) technology with a two-die stack capability in the bottom package.
Shockley Labs marks 50th anniversary News & Analysis 2/27/2006 Post a comment Civic and industry leaders gathered at a produce market to commemorate the 50th anniversary of Shockley Semiconductor Laboratory -- sometimes considered the birthplace of Silicon Valley.
Halbleiter meets Auto-Elektronik News & Analysis 2/27/2006 Post a comment Um die Beziehungen zwischen Halbleitern und der Fahrzeugektronik in allen Bereichen der Wertschöpfungskette geht es, wenn sich am 29. und 30. März Fachleute aus beiden Bereichen zur Euroforum-Konferenz 'Halbleiter in der Automobilelektronik' treffen.
16-bit MCU boasts 1.8 mW/MIPS power consumption Product News 2/27/2006 Post a comment NEC Electronics America’s 16-bit 78KOR series flash microcontrollers boasts low power consumption of 1.8 milliwatts per million instructions per second and six times the power/performance ratio of NEC Electronics' 8-bit 78K0 MCUs.
PCI-X board runs parallel TI DSPs Product News 2/27/2006 Post a comment Designed for high-speed I/O and processing, here's news of a board-level PCI-X drop-in that harnesses the power of up to nine TI TMS320C6414T DSPs. With that you can get over 2000-Mbytes/s of concurrent I/O, and the ability to combine any number of customer-specific channels of data for up to 500-Mbytes/s of continuous data input from an external source.
Entwickeln mit Xignal-ADCs News & Analysis 2/27/2006 Post a comment Für Entwicklungen mit seinen stromsparenden Analog-Digital-Wandlern stellt der Münchner Chiphersteller Xignal Technologies jetzt ein Development-Tool zur Verfügung.
NetLogic, Broadcom team on packet processing News & Analysis 2/27/2006 Post a comment NetLogic Microsystems Inc. is collaborating with Broadcom Corp. to provide Ethernet routing solutions to the carrier market, enabling carriers to launch services based on Ethernet communications technology.
Panel mulls do-it-yourself EDA News & Analysis 2/27/2006 Post a comment Despite the number of arguments against in-house EDA tool development, is seems to be occurring at an increasing pace. But what types of tools are being developed internally?
Amkor begins wafer operations in Singapore News & Analysis 2/27/2006 Post a comment Semiconductor assembly and test services company Amkor Technology Inc. has established wafer bumping operations in Singapore using the same processes employed by the company’s Unitive subsidiary in Taiwan.
Intel's Presler built at 65 nm Teardown 2/27/2006 Post a comment
The recent launch of Intel Corp.'s Presler architecture coincided almost perfectly with the release of the 2005 edition of the International Technology Roadmap for Semiconductors. The new road map philosophy is quite evident in the Presler (officially, the Pentium D 900 series). The ITRS committees want to avoid the term "technology node," which focuses so much on lithography, and instead use unambiguous references to specific feature pitches, in hopes that
Be aware of the trade-offs News & Analysis 2/27/2006 Post a comment
Despite the virtues of the various forms of programmable analog components, primarily in flexibility, they do have their shortcomings in particular applications. They are, after all, compromises in some ways and will generally not be "best in class" in any single performance factor, such as speed, accuracy or power consumption. Consider:
Panel mulls do-it-yourself EDA News & Analysis 2/27/2006 Post a comment
At a "build or buy" panel discussion at the recent DesignCon, vendor representatives predictably raised a number of arguments against in-house tool development. If you write your own tools, they said, it takes a lot of time, you'll have bugs and it probably isn't your area of expertise. It may be a more-difficult and expensive proposition than you envision.
FPGAs consumed by power issues News & Analysis 2/27/2006 Post a comment
Monterey, Calif. -- Power issues charged up the FPGA 2006 symposium here last week, and for good reason--many observers see high power consumption as perhaps the biggest factor limiting wider usage of the devices.
Endless energy is harvesting's promise News & Analysis 2/27/2006 Post a comment
During its brief flight, the outer skin of a missile can reach 300° Fahrenheit, creating an ideal source for thermophotovoltaic conversion cells that can be used to power guidance electronics. Piezoelectric materials can be built into smart ammo shells, so that recoil forces become a power source. And electronics in a foot soldier's clothing can be powered by "heel strike" electromechanical systems built into the boot.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.