SPIE: EUV sources behind schedule News & Analysis 2/28/2011 4 comments Extreme ultraviolet (EUV) lithography is making progress, but the power source for the technology is behind schedule, warned keynote speakers at the SPIE Advanced Lithography conference here.
CUDA 4.0 aims to ease parallel programming News & Analysis 2/28/2011 Post a comment Version 4.0 of Nvidia's CUDA toolkit for developing parallel applications using the company's graphics processors includes new features designed to make parallel programming easier and enable more developers to port their applications to graphics processor units.
Synopsys says IP supports PCIe 3.0 News & Analysis 2/28/2011 Post a comment EDA and IP vendor Synopsys its DesignWare IP supports the final version of the PCI Express 3.0 base specification recently released by the PCI Special Interest Group.
ISS: ST's Bozotti cheers for European chips News & Analysis 2/28/2011 10 comments Carlo Bozotti, president and chief executive officer of STMicroelectronics, provided a keynote address to the Industry Strategy Symposium (ISS Europe) held here by industry body SEMI, which contained a commitment to European chip making – but only just.
The case against Thunderbolt News & Analysis 2/28/2011 21 comments Intel's Thunderbolt is leaving some people feeling burned the chip giant is launching a new interface rather than giving its full attention to an existing one—USB.
IEEE-USA, others challenge patent reform News & Analysis 2/28/2011 5 comments Claiming it disadvantages small and startup companies, the IEEE-USA and other groups have fired off letters opposing a draft patent reform bill the U.S. Senate will debate.
IMEC installs pre-production EUV litho News & Analysis 2/28/2011 5 comments Belgian research institute IMEC has announced it has installed an NXE:3100 pre-production extreme ultra-violet lithography machine from ASML at its Leuven facility.
Startup rolls complementary litho News & Analysis 2/28/2011 6 comments At the SPIE Advanced Lithography conference here, maskless startup Multibeam Corp. will outline more details about its ongoing efforts to commercialize its so-called Complementary E-Beam Lithography (CEBL) technology in the market.
ST boosts bipolar power transistor current by 50 Percent Product News 2/27/2011 Post a comment The 3STR1630 NPN transistor from STMicroelectronics is the first member in a new family of high-performance bipolar power transistors manufactured using a new low-voltage planar technology. This technology incorporates a double-metal process that allows the cell density to be almost doubled without requiring the use of sophisticated photolithography equipment. In addition to increasing the current capability by about 50 percent for the same die size, the double-metal process enables transistors
SYSGO's SSV RTOS PikeOS offers Android Personality Product News 2/26/2011 Post a comment SYSGO has announced that its Safe and Secure Virtualization (SSV) product PikeOS now supports the Android operating system as a guest OS, or 'Personality'. PikeOS technology enables Android apps to run concurrently with other executive environments having more real-time, safety and/or security constraints on the same hardware device, and allows strict partitioning between critical and non-critical applications.
Nvidia, Atmel, STMicro found in Motorola Xoom News & Analysis 2/26/2011 19 comments In addition to a dual-core Tegra 2 applications processor from Nvidia, Motorola Mobility's Xoom media tablet includes a four-chip touch screen controller solution from Atmel and MEMS sensors from AKM Semiconductor, Kionx, STMicroelectronics and Bosch Sensortec, according to IHS iSuppli.
Change shuffles PCB EDA vendor rankings News & Analysis 2/25/2011 8 comments Zuken vaulted to the No. 2 position in sales among providers of printed circuit board EDA tools as the result of a clarification of the firm's revenues, according to Gary Smith EDA.
Security penetrates the clouds News & Analysis 2/25/2011 9 comments Information technology security provider SafeNet recently adapted its encryption, authentication and virtualization security suites to run on cloud computers.
IR to buy CHiL for $75 million News & Analysis 2/25/2011 Post a comment International Rectifier Corp. has agreed to acquire CHiL Semiconductor Corp. (CHiL) for $75 million in cash, subject to working capital adjustments.
On Semi to expand Oregon fab News & Analysis 2/24/2011 8 comments On Semiconductor Corp. plans to invest more than $30 million to expand capacity and capabilities at its 8-inch wafer manufacturing facility in Gresham, Oregon.
Mentor beats estimates, eyes $1 billion mark News & Analysis 2/24/2011 5 comments EDA vendors Mentor Graphics and Magma Design Automation reported quarterly results that beat consensus analysts' expectations, with Mentor posting record annual revenue and saying it expects to become a $1 billion company in the current fiscal year.
Applied beats Street News & Analysis 2/24/2011 Post a comment Applied Materials Inc. reported sales of $2.69 billion for the first quarter, compared to $2.89 billion in the previous quarter and $1.85 billion a year ago.
CEA-Leti, spinoff form maskless lab News & Analysis 2/24/2011 Post a comment CEA-Leti and a spinoff, Aselta Nanographics, are creating a joint lab to develop e-beam proximity effects correction solutions for both mask writing and maskless lithography applications.
Firm: Kick out Zoran's board News & Analysis 2/24/2011 4 comments Hedge fund Ramius LLC has recommended that shareholders of Zoran Corp. consent on Ramius' proxy move to remove three incumbent directors and elect Ramius nominees to the Zoran board.
Entegris, IBM form partnership News & Analysis 2/24/2011 Post a comment Entegris Inc. has announced a joint development agreement with IBM to develop and test new filtration techniques for use in advanced semiconductor manufacturing.
JEDEC announces standard for flash storage News & Analysis 2/24/2011 3 comments JEDEC Solid State Technology Association, formerly known as the Joint Electron Devices Engineering Council, has published a standard on the use of flash memory for solid-state storage in mobile devices such as smart phones and tablet computers.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.