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Content posted in February 2012
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MWC: Intel targets high-, low-end smartphones
News & Analysis  
2/27/2012   3 comments
A high-end Atom chip set is designed to extend the performance of smartphones up to LTE category 3 data rates. The other targets “value” smartphones costing less than $190.
Qualcomm, HiSilicon, China drive unified LTE
News & Analysis  
2/27/2012   6 comments
Qualcomm and HiSilicon announced multi-mode chips and China Mobile tipped plans for a TD/FDD LTE network, steps toward the holy grail of a unified cellular technology.
RTX launches world’s smallest fully embedded Wi-Fi Module
Product News  
2/27/2012   4 comments
RTX has launched what the company claims is the world’s smallest fully embedded Wi-Fi module, the RTX4100.
Orange launches Intel powered smartphone
News & Analysis  
2/27/2012   15 comments
Global mobile carrier Orange has announced it will be putting out its own branded Intel Atom powered cell phone, dubbed the Santa Clara.
Nokia announces camera phone with 41 megapixel sensor
News & Analysis  
2/27/2012   18 comments
A notable announcement that took those attending today's press conference by surprise was about the new Symbian camera phone that could well up the mobile phone game: Nokia's new 808 PureView, with a jaw-dropping 41 Megapixel sensor. It's expected to start shipping in May with a hefty retail price tag of 450 euro.
Elpida files for bankruptcy protection after bailout fails
News & Analysis  
2/27/2012   9 comments
Elpida Memory Inc. has filed for the nation’s biggest bankruptcy in two years after semiconductor prices plunged and it failed to win a second government bailout, according to a Bloomberg news report.
Mindspeed/Astri TD-LTE demo a first at MWC
News & Analysis  
2/27/2012   2 comments
Mindspeed Technologies, Inc. and Hong Kong Applied Science and Technology Research Institute (ASTRI) are demonstrating what they claim is the industry’s first commercial-grade, production-ready time division long-term evolution (TD-LTE) small cell reference design.
Sensor may bring touchscreen to feature phones
Product News  
2/27/2012   5 comments
Multi-touch touchscreens are standard equipment in smartphones. Cypress said its new sensor could make them cost effective enough for feature phones as well.
LSI, TI, Freescale in 28nm base station battle
News & Analysis  
2/27/2012   3 comments
Freescale, TI and LSI are gunning for lucrative sockets in high-end base stations with new integrated 28 nm SoCs as the Mobile World Congress opens here.
Silicon and IMEC to cooperate on RF R&D at 28nm
News & Analysis  
2/27/2012   Post a comment
HiSilicon, a China-based company, and European R&D consortium IMEC have signed a strategic research collaboration to develop RF transceiver architectures for next-generation mobile terminals using 28nm process technology.
NFC-based chip protects luxury goods from counterfeiters and cloners
Product News  
2/27/2012   2 comments
Inside Secure has introduced the VaultIC160, a memory-enriched NFC-based security solution designed for embedding into high-end consumer or industrial products that are often targeted by counterfeiters and cloners.
World’s first quad core Mini-ITX board
Product News  
2/27/2012   Post a comment
The EPIA-M900 and EPIA-M910 boards use the 1.2GHz VIA QuadCore E-Series processor for enhanced multi-tasking and multimedia performance on the lowest quad core power budget for next generation embedded products.
Low cost, low power single chip design for Bluetooth Smart tags and accessories
Product News  
2/27/2012   Post a comment
Sampling now, the nRF8002 extends Nordic Semiconductor's Bluetooth low energy offering with a cost-optimized, ultra-low power, and easy to design-in single chip for Bluetooth Smart (as Bluetooth low energy will now be marketed to consumers) tags and accessories.
Network auto-tester sets speed and simplicity benchmark for Ethernet connectivity test
Product News  
2/27/2012   Post a comment
With one touch of a button, the LinkRunner AT performs six essential connectivity tests and returns the results to the user in less than 10 seconds, paying for itself in about a month.
Compact second-generation NanoServer for embedded media applications
Product News  
2/27/2012   Post a comment
DSM Computer is launching the first member of its second-generation NanoServer industrial computer with Intel Core processors and the energy-saving QM67 mobile chip set.
Green Hills, Jungo bring connectivity to automotive infotainment
News & Analysis  
2/27/2012   2 comments
Green Hills Software and Jungo Ltd, have announced a strategic collaboration that focuses on the creation of a comprehensive connectivity, device media and internet management platform for next-generation automotive infotainment systems.
Energy-harvesting evaluation kit features wireless linked modules powered by sunlight, temp differences
News & Analysis  
2/27/2012   Post a comment
Called ‘The Drop’ the kit showcases components from Atmel Corporation and Linear Technology which were selected for their low-power consumption and suitability for harvesting applications.
Telecom operators successfully complete next generation Wi-Fi hotspot trials
News & Analysis  
2/27/2012   3 comments
The Wireless Broadband Alliance, the industry association focused on driving the next generation Wi-Fi experience, has announced that many of the world's largest operators and vendors have successfully participated in trials of Next Generation Hotspots that drastically simplify Wi-Fi hotspot access.
Harman demos automotive LTE connectivity platform
News & Analysis  
2/27/2012   1 comment
The platform provides the missing link in car connectivity: For the first time, it offers real broadband connection for applications residing in the vehicle.
Bluetooth low energy enabled iPhone applications for mobile health
News & Analysis  
2/27/2012   3 comments
Cambridge Consultants will demonstrate its latest Bluetooth low energy (BLE) iPhone 4S applications using CSR’s BLE devices at this year’s Mobile World Congress.
Intel's Ivy Bridge delayed, says senior executive
News & Analysis  
2/26/2012   5 comments
A senior Intel executive has admitted that its next generation Ivy Bridge microprocessor will be delayed by around eight to 10 weeks to be launched in June.
HTC unveils One series with dual and quad core phones
News & Analysis  
2/26/2012   4 comments
HTC has announced its One Series of smartphones at Mobile World Congress (MWC), including a quad core Nvidia Tegra 3 based device and another boasting Qualcomm’s dual-core Snapdragon S4.
Huawei claims quad-core chip outguns Tegra3
News & Analysis  
2/26/2012   29 comments
Huawei announced high-end smartphones and tablets using a homegrown quad-core applications processor it said outperforms the competition including Nvidia’s Tegra3.
STMicro toasts 2 billionth MEMS shipped to date
News & Analysis  
2/24/2012   1 comment
STMicroelectronics announced it has shipped two billion MEMS sensors to date which confirmed its top position in micro-electromechanical systems devices for consumer and portable applications.
Vishay TEFD4300 and TEFD4300F silicon PIN photodiodes
Product News  
2/24/2012   Post a comment
Vishay's latest devices feature high reverse photo current of 17 µA, ± 20° angle of half sensitivity, and fast switching times down to 10 ns for data transmission.
ISSCC highlights sensors and semiconductor technology in medicine
News & Analysis  
2/24/2012   4 comments
Session 17 at this year’s International Solid-State Circuits Conference focused on the diagnostic and therapeutic technologies for health, leveraging the recent advances in sensor and semiconductor technologies.
SEMI book-to-bill improves for fourth straight month
News & Analysis  
2/24/2012   2 comments
The three-month average book-to-bill ratio for North American semiconductor equipment manufacturers improved to 0.95 in January, the fourth consecutive month of improvement after six consecutive months of declines, according to the fab tool vendor trade group SEMI.
Micron increases stake in Inotera
News & Analysis  
2/24/2012   5 comments
Micron Technology is increasing its stake in Inotera Memories, its Taiwanese DRAM joint venture with Nanya Technology, according to a regulatory filing made by Inotera this week.
Qualcomm chooses MasterImage 3D for development tablet
News & Analysis  
2/24/2012   5 comments
Just ahead of Mobile World Congress in Barcelona next week, MasterImage said its glasses-free 3-D screen had been selected by the mobile chip giant for a 10-inch Mobile Development Platform based on Qualcomm’s Snapdragon S4 processor.
Microsoft begins aggressive new Windows Phone campaign
News & Analysis  
2/24/2012   14 comments
Ahead of Mobile World Congress in Barcelona, Microsoft has thrown down the ad gauntlet to its Android competition in a campaign it is calling "Smoked by Windows Phone."
ON Semiconductor NCV47700 and NCV47701 two new low dropout voltage regulator ICs
Product News  
2/23/2012   1 comment
ON Semiconductor announced two new low dropout voltage regulator ICs for use in audio and infotainment systems, instrument cluster, navigation and satellite radio.
New tablets to feature MIPS for both applications and baseband processing
News & Analysis  
2/23/2012   1 comment
Altair Semiconductor to bring its Leading LTE Chipset to MIPS-Based Android 4.0 ‘Ice Cream Sandwich’ Tablets from Ingenic
Firm cuts capex forecast
News & Analysis  
2/23/2012   6 comments
A research firm has cut its capital spending forecast for 2011 amid a sudden slowdown in DRAMs. Capital spending for foundries will fall, as TSMC has reportedly pushed out its ramp for a new fab.
Cree to hold 'iconathon' to hone energy-efficiency logo
News & Analysis  
2/23/2012   2 comments
Cree and The Noun Project, an open source visual library of symbols and icons, are holding an “iconathon” at Cree’s campus to create universally recognizable symbols for LED lighting and other energy-efficient technologies.
Genusion licenses B4-Flash to Rohm, Lapis
News & Analysis  
2/23/2012   3 comments
Genusion Ltd., a fabless Japanese memory IP company, has announced that is has licensed its B4-flash non-volatile memory technology to Rohm Group and Rohm subsidiary Lapis Semiconductor Co. Ltd.
World’s fastest 80C51 CPU @ CeBIT
Product News  
2/23/2012   4 comments
The DQ80251 is said to be more than 56 times better than a standard 8051 and more than 70% more efficient, than the nearest competition.
RFID chip lets readers talk first for use in retail apps
News & Analysis  
2/23/2012   2 comments
Researchers at Imec, Holst Centre and their partners have fabricated a radio frequency identification circuit made in low-temperature thin-film technology that allows reader-talks-first communication.
ADI, Avago see slight uptick in business
News & Analysis  
2/23/2012   Post a comment
The top executives at analog Analog Devices and Avago Technologies each sounded a note of cautious optimism, with both saying they see signs of improved business in the wake of the firms' most recent quarterly reports.
ISSCC: Pictures from a silicon exhibition
News & Analysis  
2/23/2012   7 comments
Here’s a few postcards from the International Solid-State Circuit Conference, the annual smorgasbord of innovations in silicon across everything from processors to implants.
Memory firms detail sub-20-nm NAND chips
News & Analysis  
2/23/2012   3 comments
Engineers from Samsung Electronics, Toshiba and SanDisk took to the podium to provide details of their respective 19-nm NAND flash chips in presentations at the International Solid-State Circuit Conference.
Mentor expands support for UVM
News & Analysis  
2/23/2012   Post a comment
Mentor Graphics announced the expansion of support for Universal Verification Methodology, an industry standard methodology for IC design verification.
GPU shipments had another down Q4
News & Analysis  
2/23/2012   2 comments
Shipments of graphics chips declined 10 percent sequentially in the fourth quarter of 2011, continuing a new seasonal trend that has taken shape since the financial crisis of 2008, according to analysts at Jon Peddie Research.
STMicroelectronics STM6519 and STM6524 smart reset chips
Product News  
2/23/2012   1 comment
ST recently launched a new generation of its smart reset chips, which are designed to provide an intuitive means of resetting frozen gadgets, such as mobile phones, media players, and other portable consumer devices.
Energy Micro introduces energy-friendly ARM Cortex-M4 products
Product News  
2/22/2012   Post a comment
Energy Micro has extended its EFM32 Gecko range of microcontrollers with the addition of products based on the ARM Cortex-M4F core.
Magma's Madhavan won't join Synopsys
News & Analysis  
2/22/2012   18 comments
As most expected, Magma Design Automation Chairman and CEO Rajeev Madhavan won't join Synopsys Inc. as a result of its recently closed acquisition of Magma, Synopsys said.
Powercast’s chipset and RF energy harvesting reference design enable low-cost wireless power over distance
Product News  
2/22/2012   Post a comment
Powercast Corporation has released an RF-based wireless power chipset and reference design for embedded, low-power, wireless charging applications.
Panasonic's waterproof Android Eluga smartphone unveiled
News & Analysis  
2/22/2012   10 comments
Panasonic has unveiled a new ultra-thin, waterproof, Android smartphone called Eluga, which works with the firm’s Smart Viera TVs and uses Panasonic’s display technology.
Analyst: Mobile MEMS market rising to $6bn in 2016
News & Analysis  
2/22/2012   1 comment
The annual revenues generated by MEMS components used in mobile consumer equipment, including sensors, audio, displays and RF, will exceed $6 billion in 2016, according to analysis company Juniper Research Ltd. The equipment includes phones, computers and e-readers.
ISSCC: Voltage regulators stacked in 3-D
News & Analysis  
2/22/2012   8 comments
The world's first integrated voltage regulators can be located on the bottom of a 3-D chip stack, according researchers at IBM and Columbia University, who recently demonstrated a silicon interposer containing the necessary magnetic inductors at the International Solid State Circuits Conference.
ConEd Solutions partners with Viridity on road to 'smart grid'
News & Analysis  
2/22/2012   1 comment
ConEdison Solutions has launched, together with Viridity of Philadelphia, a demand response process for its customers to generate revenue during periods other than when utilities and independent system operators send out reduction appeals.
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