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Content posted in March 2002
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IR acquires power IC line from Fairchild to bolster military business
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3/28/2002   Post a comment
EL SEGUNDO, Calif. -- International Rectifier Corp. today announced it has acquired the high-reliability, power MOSFET product line from Fairchild Semiconductor International for approximately $29.6 million cash. These power management semiconductors are used extensively in aerospace and defense applications, according to International Rectifier. The El Segundo-based company expects the product line to contribute approximately $10 million in revenue in the first 12 months and to be accretive im
MEMC sees recovery in wafer markets, but posts $82 million net loss in Q4
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3/28/2002   Post a comment
ST. PETERS, Mo.--Silicon wafer supplier MEMC Electronic Materials Inc. today reported an operating loss of $61.4 million and restructuring charges of $10.1 million for the fourth quarter of 2001, but the struggle substrate maker said it is finally seeing signs of stabilization and recovery in the market.
Online component info service turns independent
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3/28/2002   Post a comment
Major Japanese electronic-component manufacturers will set up an independent company, PartsWay Corp., to take over the catalog distribution service and dictionary standardization work from the Japan Electronics and Information Technology Industries Association (JEITA).
Dell, Philips strengthen bonds
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3/28/2002   Post a comment
Agilent plans major upgrade of SoC chip testers
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3/28/2002   Post a comment
SANTA CLARA, Calif. -- During a series of presentations here this week, Agilent Technologies Inc. gave a sneak preview of plans to upgrade its IC testers for cutting-edge communications semiconductors, system-on-a-chip products and other devices.
Sun, ARM rewrite the rules for accelerating Java
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3/28/2002   Post a comment
Sun Microsystems Inc. rolled out a Java Virtual Machine at the JavaOne developers conference aimed at boosting the Java language's performance nearly tenfold on next-generation cellphones.
Centillium sees stronger demand for DSL chips in Japan
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3/28/2002   Post a comment
FREMONT, Calif.--Centillium Communications Inc. here said a strong pickup in demand for digital subscriber line (DSL) products in Japan has caused the company to re-evaluate its chip inventory, which had been previously written down in value because it was believed to be obsolete or excessive for market conditions.
U.S. head of Taiwan foundry resigns
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Microlab claims first in race to launch RF MEMS
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3/28/2002   Post a comment
Microlab, a US developer of RF micro-electromechanical systems (MEMS), claims to have stolen a march on competitors in the race to launch the first RF MEMS micro- magnetic latch switch.
JMAR to dump semiconductor products
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3/28/2002   Post a comment
X-ray lithography equipment supplier JMAR Technologies Inc. said it will discontinue its standard semiconductor product line and seek a buyer for the fabless chip operation.
UK 4G 'some way off'
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3/28/2002   Post a comment
UK mobile comms players say it is likely to be some time before they turn their attention to fourth generation (4G) systems, even though Japan's NTT DoCoMo has announced that it is already building an experimental 4G network.
Advanced Energy buys German supplier of power systems for fab tools
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3/28/2002   Post a comment
FORT COLLINS, Colo. -- In a move to strengthen its European presence in chip fabs and other manufacturing facilities, Advanced Energy Industries Inc. today announced it has purchased Dressler HF Technik GmbH in Stolberg, Germany, which is a privately-held supplier of radio-frequency power systems for plasma-based equipment and processes.
UMC's U.S. president resigns amid ongoing foundry slump
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3/28/2002   Post a comment
SUNNYVALE, Calif. -- James Kupec, president of United Microelectronics Corp.'s U.S. subsidiary, has quietly resigned from the Taiwanese silicon foundry giant, SBN has learned. Officials from UMC's U.S. subsidiary here confirmed that Kupec resigned from the company about two weeks ago. No other details were given and Kupec could not be reached for comment.
Backlighting inverter rolls
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3/28/2002   Post a comment
Endicott Research's LD series of dc/ac inverters, for 10.4- to 15-inch diagonal LCDs backlit by two to four cold-cathode fluorescent lamps, measures only 8 mm high. Powered by a regulated 12-V dc source, the inverter delivers up to 10 W.
Regulator touted as tiny
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3/28/2002   Post a comment
Analog Devices claims that its ADP3089 1.5-amp dc/dc regulator, in what the company terms an eight-pin, 3 x 3-mm chip-scale package, is the industry's smallest with the highest current density.
Dc supplies target industrial test
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3/28/2002   Post a comment
IFR Systems' line of variable-switching regulated dc power supplies, the Kikusui PAM Series, has eight models in 2-kilowatt and 4-kW versions that the company says provide a new level of price and performance to the burn-in, life testing and bulk power markets.
Reduced-latency DRAMs sample
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Infineon Technologies, here, is sampling 256-Mbit reduced-latency DRAM devices for high-speed networking and fast-cache applications.
Synthesizer ICs include E2PROM
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3/28/2002   Post a comment
Targeting fixed-frequency applications, Peregrine Semiconductor Corp. has launched a family of high-performance phase-lock loop (PLL) synthesizer chips with embedded E2PROM memory.
Stereo audio codecs include USB controller
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3/28/2002   Post a comment
Texas Instruments Inc. has introduced a family of stereo audio codecs with a built-in USB controller and an internal I/O terminal compatible with the Sony/Philips Digital Interface (S/PDIF).
Transmit signal processor rolls
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3/28/2002   Post a comment
A 104-Msample/second, four-channel transmit signal processor (TSP) from Analog Devices Inc. is designed to leverage the high-speed performance of the company's TxDAC family of digital-to-analog converters in multimode, multistandard wireless basestation architectures.
Silicon Access, ZettaCom scale back chip plans
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3/28/2002   Post a comment
ZettaCom Inc. and Silicon Access Networks Ltd. have each scaled back plans to provide network processing chips, EE Times has learned.
Optical test modules
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3/28/2002   Post a comment
The OTS9600 series of optical test modules deliver a swept wavelength measurement system to designers for analyzing the physical layer performance of passive optical components.
Walter Hewlett files suit over voting process in HP-Compaq merger
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3/28/2002   Post a comment
PALO ALTO, Calif. -- A group led by Walter B. Hewlett here today announced it has filed a suit against Hewlett-Packard Co. over the voting process in HP's $21 billion merger with Compaq Computer Corp. The suit, filed in the Delaware Chancery Court, raises issues about the process by which HP solicited votes for the approval of the proposed merger with Compaq, particularly from large institutional stockholders, such as Deutsche Bank.
802.11 indoor antenna
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3/28/2002   Post a comment
The DRWiN wireless LAN antenna operates over in the 2.4 GHz band and is targeted at indoor 802.11-compliant wireless LAN (WLAN) applications.
OC-192 transmitter family
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3/28/2002   Post a comment
The TOLD387S optical transmitter family supports OC-192 DWDM and WDM applications requiring 50 or 100 GHz spacing and transmission distances from 25 to 60 km.
Auto comm reference platform
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3/28/2002   Post a comment
The Telematics Communication Gateway reference design allows design engineers to bring communication functionality to automotive designs.
R&D tax credit is set at 20%
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3/28/2002   Post a comment
R&D tax credits should be introduced in this month's Budget at a 20% rate. This is ahead of some expectations, but will still be less of a benefit to industry than the biggest lobbyists had wanted.
Hard cores point to split in FPGA plans
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3/28/2002   Post a comment
Lattice Semiconductor and Actel, the third and fourth largest players in programmable logic, aim to carve out niches from the general-purpose SRAM-based device market dominated by their larger competitors.
Solectron snares optical contract with Lucent
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3/28/2002   Post a comment
Solectron Corp. has more optical networking equipment in its future as part of a three-year outsource agreement with Lucent Technologies Inc.
Germany's X-Fab buys Zarlink's Plymouth fab
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3/28/2002   Post a comment
Deal meets company's first quarter deadline to dispose of UK site – just.
Foundry hikes capex plans by nearly $1 billion
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3/28/2002   Post a comment
TAIPEI, Taiwan -- Taiwan Semiconductor Manufacturing Co.'s chairman said that his company will sharply increase capital spending this year, called on the government to remove restrictions on investment in China, and repeated a pledge to invest $20 billion at home. TSMC, the largest pure-play foundry house worldwide, is set to boost its capex this year to $2.57 billion, 56% more than the $1.65 billion target forecast months ago, chairman Morris Chang said during a visit today to Taiwan's Premier
Zarlink to sell U.K. plant to X-Fab and receive foundry services
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3/28/2002   Post a comment
PLYMOUTH, England -- Canada's Zarlink Semiconductor Inc. today announced it has found a buyer for its wafer fab here. X-Fab Semiconductor Foundries AG of Erfurt, Germany, has agreed to buy the facility for $30 million--$12 million in cash on closing of the transaction and $18 million in secured notes payable over three years, the two companies said.
Photodetector IC serves fast CD/DVD pickup heads
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3/28/2002   Post a comment
Sipex Corp. has launched the first member of a new family of ICs for CD/DVD pickup heads.
Motorola unveils 16-bit flash MCU duo
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3/28/2002   Post a comment
Motorola Inc.'s Semiconductor Products Sector has introduced two 16-bit flash microcontrollers, bringing to 10 the number of such devices spun from its HCS12 architecture, which is especially popular among automakers.
Tiny RF inductors pack a punch
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3/28/2002   Post a comment
What's on the minds of wireless components engineers? According to suppliers of inductors, the designers want much smaller components to meet the growing demand for portable handheld devices where pc-board space is at a premium.
Plants lined up for recycling laws
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3/28/2002   Post a comment
Two UK recycling companies are to open plants that could ultimately help local technology companies meet the demands of the Waste Electrical and Electronic Equipment (WEEE) directive.
Dense WDM transceivers hot-plug to reduce costs
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3/28/2002   Post a comment
Agilent Technologies said its AFKC-xxxx dense wavelength-division multiplexing (DWDM) transceivers are hot-pluggable parts. As such, the devices replace through-hole devices and pigtailed connections, both of which tend to increase installation time and assembly time in high-volume systems, Agilent said.
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