Still Rambus, but less rambunctious News & Analysis 3/29/2010 3 comments Rambus is seeking to cast a kinder and gentler light on the company's feisty reputation. Heretofore, Rambus has been largely known as a litigious memory technology company. Rambus now wants to be viewed as more conciliatory, as it diversifies its IP portfolio far beyond memories.
IBM demos graphene optical link News & Analysis 3/29/2010 Post a comment IBM has fabricated an optical receiver using a graphene photodetector fabricated on silicon-on-insulator substrate consisting of a metal-graphene-metal field-effect transistor with an asymmetrical interdigitated source and drain using palladium and titanium, respectively.
RF firm completes IPO News & Analysis 3/29/2010 Post a comment MaxLinear Inc. (Carlsbad, Calif.), a provider of radio frequency (RF) and mixed-signal IC solutions for broadband communications applications, has closed its previously announced initial public offering of 6,444,100 shares of Class A common stock at a price to the public of $14.00 per share.
Analyst, reviewers cool on Nvidia Fermi News & Analysis 3/29/2010 Post a comment Nvidia Corp. has officially rolled out adapter cards using its latest high-end graphics processor, code-named Fermi, to a cool reception from analysts and reviewers who say the chip does not have a dramatic performance advantage over graphics processors rolled out last fall from archrival Advanced Micro Devices, although Fermi could make deeper in-roads into supercomputers than AMD's offerings.
8-bit MCUs support energy efficient designs Product News 3/29/2010 Post a comment Infineon Technologies recently expanded its XC800 microcontroller (MCU) portfolio with two powerful 8-bit device seriesthe XC82x and XC83xwhich reduce system cost and allow for improved energy efficiency of a wide range of industrial applications.
700-day payment blights European medical electronics, says group News & Analysis 3/29/2010 Post a comment Medical electronics companies are often dependent on public authority contracts, particularly in Europe with its use of nationalized health services. However, those authorities are making suppliers wait many months, even close to two years, for payment, according to Eucomed, an industry body that represents European medical suppliers.
Avnet to pay $594M for Bell Micro News & Analysis 3/29/2010 Post a comment Avnet Inc. said it will pay almost $600 million for Bell Microproducts Inc., its largest acquisition on a revenue basis, as the electronic component and IT equipment distributor strengthens its position in the storage and computing markets in various parts of the globe.
NXP is planning billion-dollar IPO, say reports News & Analysis 3/29/2010 Post a comment NXP BV, the chip company that resulted from a buy out from Koninklijke Philips Electronics NV (Amsterdam, The Netherlands) by a private equity consortium, is planning to list its shares, according to Reuters and Bloomberg reports that cite unnamed sources.
DesignArt launches 4G basestation chip family Product News 3/29/2010 Post a comment DesignArt Networks Ltd. (Ra'anana, Israel) has announced its DAN3000 family of ICs for use in 4G LTE and IMT-Advanced basestations. The company said its chips would allow the deployment of multi-gigabit mobile radio access networks (RANs).
TSMC applies to take 10% stake in SMIC News & Analysis 3/29/2010 Post a comment Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has applied to the Taiwan government for approval to acquire a 10 percent stake in China's Semiconductor Manufacturing International Corp., according to reports.
AMD debuts 12-core server processors News & Analysis 3/29/2010 1 comment Advanced Micro Devices has officially rolled out its latest Magny Cours sever processors a day before archrival Intel Corp. is expected to announce its competing Nehalem-EX CPUs with Hewlett-Packard and SGI among companies announcing plans to use the AMD chips in servers.
ESC helps drive Android beyond cellphone Product News 3/29/2010 5 comments The ESC-Silicon Valley Conference will add fuel to the effort driving Google's Android software into a wide range of embedded systems beyond the smartphone by hosting three presentations on using Android in embedded systems.
Comment: For Apple, litigation or innovation? News & Analysis 3/26/2010 2 comments What is Apple up to? The company is viewed as an innovator inside the circle of Apple aficionados. But does the company's litigious behavior deflect corporate attention or dilute the pipeline of product innovation?
ESC: Microchip simplifies access to embedded wireless Product News 3/26/2010 9 comments Recent moves regarding ZigBee, Wi-Fi and Google have greatly increased the opportunities for designers of embedded systems, once they overcome the many issues associated with embedded wireless, from determinism to FCC regulations to rising concerns regarding security.
IDT signs up to use Samplify compression News & Analysis 3/26/2010 Post a comment Integrated Device Technology Inc. (San Jose, Calif.), a developer of mixed-signal ICs for communications, has announced a joint development program with Samplify Systems Inc. (Santa Clara, Calif.), a maker of data converter designs and ICs.
Synopsys completes CoWare acquisition News & Analysis 3/26/2010 Post a comment EDA and IP vendor Synopsys Inc. (Mountain View, Calif.) announced it has completed the acquisition of electronic system-level design software vendor CoWare Inc. Financial terms of the agreement remained undisclosed.
Femtocell maker opts for Lime's radio News & Analysis 3/26/2010 Post a comment AirWalk Communications Inc. (Richardson, Texas) has said it has used an configurable broadband radio transceiver from Lime Microsystems Ltd. (Guildford, England) in its EdgePointe femtocell.
Bosch opens billion-dollar wafer fab News & Analysis 3/26/2010 1 comment As expected, automotive chip maker Robert Bosch GmbH (Reutlingen, Germany) has opened formally a 200-mm wafer fab at the Bosch location in Reutlingen. At a total cost of 600 million euros (about $1.1 billion) the fab, which will make a variety of ICs and microelectromechanical systems (MEMS), is the largest single investment in Bosch's history.
Toshiba fab portends more NAND capacity adds News & Analysis 3/26/2010 Post a comment In the wake of Toshiba's announcement that it will move forward with construction of a previously delayed NAND flash fab in Yokkaichi, Japan, analysts expect other NAND vendors to ratchet up capacity in light of favorable pricing conditions that have persisted for the past year.
Letter to the Editor: TI defends analog strategy News & Analysis 3/25/2010 1 comment Texas Instruments Inc. in response to a recent EE Times report on the analog IC market said it has increased investments in manufacturing facilities and boosted production as part of plans to improve lead times for its products.
Femtocells set for explosive growth, says iSuppli News & Analysis 3/25/2010 Post a comment The ecosystem around the cellular basestations that improve indoor wireless coverage will experience explosive growth in 2010 and several years thereafter, according to market research company iSuppli Corp. (El Segundo, Calif.).
Silver Lake invests in China's Spreadtrum News & Analysis 3/25/2010 Post a comment Private equity firm Silver Lake (Menlo Park, Calif.) has acquired a minority stake in Spreadtrum Communications Inc. (Shanghai, China), a NASDAQ-traded fabless chip company that makes chips for GSM and TD-SCDMA mobile communications.
Report: India plans wafer fab for LED lighting News & Analysis 3/25/2010 Post a comment De Core Nanosemiconductors Ltd. is planning to spend about 900 crore rupees (about $200 million) building a wafer fab for LEDs in Gandhinagar, Gujurat in the west of India, according to a Business Standard report.
Analysts intrigued by Nintendo's 3-D handheld News & Analysis 3/24/2010 Post a comment U.S. analysts were intrigued and curious following the overnight release of a brief statement by Nintendo saying the company plans to launch within the next year a handheld video gaming system that offers 3-D effects without requiring the use of special glasses.
BOARDS - Fanless, ultra low-profile Intel Atom system uses minimal power News & Analysis 3/24/2010 Post a comment The SolidLogic Atom JT01 from Logic Supply is an ultra-slim, fanless Intel Atom system housed in a ruggedized, small-footprint enclosure targeted for use in industrial environments, public access areas, or remote locations. The SolidLogic Atom JT01 is designed for reliable, stable operation while consuming minimal power.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.