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Content posted in March 2010
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Still Rambus, but less rambunctious
News & Analysis  
3/29/2010   3 comments
Rambus is seeking to cast a kinder and gentler light on the company's feisty reputation. Heretofore, Rambus has been largely known as a litigious memory technology company. Rambus now wants to be viewed as more conciliatory, as it diversifies its IP portfolio far beyond memories.
Analyst: Applied testing LED tool
News & Analysis  
3/29/2010   Post a comment
Applied Materials Inc. is in beta-site testing with a new LED tool that is said to compete against MOCVD technology, according to an analyst.
IBM demos graphene optical link
News & Analysis  
3/29/2010   Post a comment
IBM has fabricated an optical receiver using a graphene photodetector fabricated on silicon-on-insulator substrate consisting of a metal-graphene-metal field-effect transistor with an asymmetrical interdigitated source and drain using palladium and titanium, respectively.
ABB buys IC unit from Czech firm
News & Analysis  
3/29/2010   Post a comment
Switzerland's ABB, a power and automation technology vendor, has acquired the semiconductor business of Polovodice a.s. in the Czech Republic.
RF firm completes IPO
News & Analysis  
3/29/2010   Post a comment
MaxLinear Inc. (Carlsbad, Calif.), a provider of radio frequency (RF) and mixed-signal IC solutions for broadband communications applications, has closed its previously announced initial public offering of 6,444,100 shares of Class A common stock at a price to the public of $14.00 per share.
Analyst, reviewers cool on Nvidia Fermi
News & Analysis  
3/29/2010   Post a comment
Nvidia Corp. has officially rolled out adapter cards using its latest high-end graphics processor, code-named Fermi, to a cool reception from analysts and reviewers who say the chip does not have a dramatic performance advantage over graphics processors rolled out last fall from archrival Advanced Micro Devices, although Fermi could make deeper in-roads into supercomputers than AMD's offerings.
Ultra FRFET MOSFETs reduce component count in LCD TVs
Product News  
3/29/2010   Post a comment
Fairchild Semiconductor's solutions for LCD TV power applications provide designers with significant advantages when compared to traditional methodologies in use today.
8-bit MCUs support energy efficient designs
Product News  
3/29/2010   Post a comment
Infineon Technologies recently expanded its XC800 microcontroller (MCU) portfolio with two powerful 8-bit device series—the XC82x and XC83x—which reduce system cost and allow for improved energy efficiency of a wide range of industrial applications.
Synopsys adds physical guidance to topographical technology
Product News  
3/29/2010   Post a comment
EDA and IP vendor Synopsys Inc. has introduced Design Compiler 2010, an RTL synthesis solution that is claimed to achieve a two-fold speedup in the synthesis and physical implementation flow.
Applied rolls tool for 3-D chips
News & Analysis  
3/29/2010   Post a comment
Continuing to make a renewed push on the fab tool front, Applied Materials Inc. has rolled out a trio of systems.
700-day payment blights European medical electronics, says group
News & Analysis  
3/29/2010   Post a comment
Medical electronics companies are often dependent on public authority contracts, particularly in Europe with its use of nationalized health services. However, those authorities are making suppliers wait many months, even close to two years, for payment, according to Eucomed, an industry body that represents European medical suppliers.
Tough 2009 creates winners, losers in chip vendor ranking
News & Analysis  
3/29/2010   Post a comment
Qualcomm, Hynix and Advanced Micro Devices each managed to climb two places in a top ten ranking of chip vendors by 2009 revenue provided by market research company Gartner Inc. (Stamford, Conn.).
Avnet to pay $594M for Bell Micro
News & Analysis  
3/29/2010   Post a comment
Avnet Inc. said it will pay almost $600 million for Bell Microproducts Inc., its largest acquisition on a revenue basis, as the electronic component and IT equipment distributor strengthens its position in the storage and computing markets in various parts of the globe.
Public voting begins for "Pete' Conrad innovation awards
News & Analysis  
3/29/2010   Post a comment
Voting has begun to select the winners from among high school teams competing for technology innovation awards in aerospace, renewable energy and clean technology along with a space nutrition category.
Renesas licenses Synopsys' OPC software for 28nm node
Product News  
3/29/2010   Post a comment
Japan's Renesas Technology Corp. announced it has selected Synopsys' Proteus optical proximity correction (OPC) software for 28nm development.
NXP is planning billion-dollar IPO, say reports
News & Analysis  
3/29/2010   Post a comment
NXP BV, the chip company that resulted from a buy out from Koninklijke Philips Electronics NV (Amsterdam, The Netherlands) by a private equity consortium, is planning to list its shares, according to Reuters and Bloomberg reports that cite unnamed sources.
DesignArt launches 4G basestation chip family
Product News  
3/29/2010   Post a comment
DesignArt Networks Ltd. (Ra'anana, Israel) has announced its DAN3000 family of ICs for use in 4G LTE and IMT-Advanced basestations. The company said its chips would allow the deployment of multi-gigabit mobile radio access networks (RANs).
TSMC applies to take 10% stake in SMIC
News & Analysis  
3/29/2010   Post a comment
Leading foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has applied to the Taiwan government for approval to acquire a 10 percent stake in China's Semiconductor Manufacturing International Corp., according to reports.
AMD debuts 12-core server processors
News & Analysis  
3/29/2010   1 comment
Advanced Micro Devices has officially rolled out its latest Magny Cours sever processors a day before archrival Intel Corp. is expected to announce its competing Nehalem-EX CPUs with Hewlett-Packard and SGI among companies announcing plans to use the AMD chips in servers.
ESC helps drive Android beyond cellphone
Product News  
3/29/2010   5 comments
The ESC-Silicon Valley Conference will add fuel to the effort driving Google's Android software into a wide range of embedded systems beyond the smartphone by hosting three presentations on using Android in embedded systems.
Comment: For Apple, litigation or innovation?
News & Analysis  
3/26/2010   2 comments
What is Apple up to? The company is viewed as an innovator inside the circle of Apple aficionados. But does the company's litigious behavior deflect corporate attention or dilute the pipeline of product innovation?
ESC: Microchip simplifies access to embedded wireless
Product News  
3/26/2010   9 comments
Recent moves regarding ZigBee, Wi-Fi and Google have greatly increased the opportunities for designers of embedded systems, once they overcome the many issues associated with embedded wireless, from determinism to FCC regulations to rising concerns regarding security.
Intel solar spin-off raises $41.4 million
News & Analysis  
3/26/2010   Post a comment
SpectraWatt Inc. (Hopewell Junction, NY), a manufacturer of photovoltaic cells for the solar industry, has received $41.4 million in investor funding in the form of convertible debt.
IDT signs up to use Samplify compression
News & Analysis  
3/26/2010   Post a comment
Integrated Device Technology Inc. (San Jose, Calif.), a developer of mixed-signal ICs for communications, has announced a joint development program with Samplify Systems Inc. (Santa Clara, Calif.), a maker of data converter designs and ICs.
Report has microntrollers grow to $12 billion this year
News & Analysis  
3/26/2010   Post a comment
The microcontrollers market will likely exceed a value of $12 billion for 2010, according to a market research firm.
Synopsys completes CoWare acquisition
News & Analysis  
3/26/2010   Post a comment
EDA and IP vendor Synopsys Inc. (Mountain View, Calif.) announced it has completed the acquisition of electronic system-level design software vendor CoWare Inc. Financial terms of the agreement remained undisclosed.
Femtocell maker opts for Lime's radio
News & Analysis  
3/26/2010   Post a comment
AirWalk Communications Inc. (Richardson, Texas) has said it has used an configurable broadband radio transceiver from Lime Microsystems Ltd. (Guildford, England) in its EdgePointe femtocell.
Bosch opens billion-dollar wafer fab
News & Analysis  
3/26/2010   1 comment
As expected, automotive chip maker Robert Bosch GmbH (Reutlingen, Germany) has opened formally a 200-mm wafer fab at the Bosch location in Reutlingen. At a total cost of 600 million euros (about $1.1 billion) the fab, which will make a variety of ICs and microelectromechanical systems (MEMS), is the largest single investment in Bosch's history.
SMIC asks TI to take over fab management, says report
News & Analysis  
3/26/2010   1 comment
Foundry Semiconductor Manufacturing International Corp. (Shanghai, China), is planning to end an agreement to manage a 200-mm wafer fab in Chengdu, according to a Reuters report.
Toshiba fab portends more NAND capacity adds
News & Analysis  
3/26/2010   Post a comment
In the wake of Toshiba's announcement that it will move forward with construction of a previously delayed NAND flash fab in Yokkaichi, Japan, analysts expect other NAND vendors to ratchet up capacity in light of favorable pricing conditions that have persisted for the past year.
Letter to the Editor: TI defends analog strategy
News & Analysis  
3/25/2010   1 comment
Texas Instruments Inc. in response to a recent EE Times report on the analog IC market said it has increased investments in manufacturing facilities and boosted production as part of plans to improve lead times for its products.
Intel-backed research yields spintronic breakthrough
News & Analysis  
3/25/2010   1 comment
Room temperature electric field"controlled ferromagnetism in germanium quantum dots was demonstrated in silicon transistors to create a dilute magnetic semiconductor.
Google and Microchip partner to enable easy development of Google PowerMeter designs for smart energy monitoring
Product News  
3/25/2010   Post a comment
Microchip has announced the result of its strategic partnership with Google PowerMeter.
Ascent Solar, Kirloskar form alliance on PV modules
News & Analysis  
3/25/2010   Post a comment
Ascent Solar Technologies, Inc. and Kirloskar Integrated Technologies Limited have signed an agreement to start integration, marketing and distribution of Ascent Solar's flexible CIGS PV modules.
Vortex Engg rolls out solar-powered ATMs for India
News & Analysis  
3/25/2010   Post a comment
Vortex Engineering bags an order from State Bank of India to roll out 300 solar ATMs in India.
Is Intel inking distributors to push Atom in Japan?
News & Analysis  
3/25/2010   1 comment
Intel declined to comment on reports that the world's No. 1 chip vendor is seeking to expand its presence in the Japanese market by engaging three chip distributors in the country.
Qualcomm raises on licensing, chipset strength
News & Analysis  
3/25/2010   Post a comment
Wireless chip vendor Qualcomm lifted its sales and profit targets for the quarter ending March 28, citing strength in licensing revenue and favorable volume and product mix in its chipset business.
Femtocells set for explosive growth, says iSuppli
News & Analysis  
3/25/2010   Post a comment
The ecosystem around the cellular basestations that improve indoor wireless coverage will experience explosive growth in 2010 and several years thereafter, according to market research company iSuppli Corp. (El Segundo, Calif.).
Dolphin Integration rolls stem optimized for low leakage
Product News  
3/25/2010   Post a comment
EDA and IP company Dolphin Integration SA (Meylan, France) has introduced an additional stem optimized for low leakage, LL-BTF.
New tool allows simulation of FlexRay, CAN
Product News  
3/25/2010   Post a comment
A new version of a cluster emulation tool from Elektrobit Corp. allows automotive designers to use the same tool for both FlexRay and CAN simulations.
Wavesat, PicoChip agree to joint testing, marketing of LTE chips
News & Analysis  
3/25/2010   Post a comment
PicoChip Designs Ltd. (Bath, England) and Wavesat Inc. (Montreal, Canada) have agreed to conduct end-to-end LTE interoperability testing, leading to the availability of proven 4G network solutions.
Silver Lake invests in China's Spreadtrum
News & Analysis  
3/25/2010   Post a comment
Private equity firm Silver Lake (Menlo Park, Calif.) has acquired a minority stake in Spreadtrum Communications Inc. (Shanghai, China), a NASDAQ-traded fabless chip company that makes chips for GSM and TD-SCDMA mobile communications.
Tanner EDA, Dongbu deliver foundry-certified PDKs
Product News  
3/25/2010   Post a comment
Tanner EDA, a division of Tanner Research Inc. (Monrovia, Calif.), and analog foundry specialist Dongbu HiTek of South Korea have teamed to develop foundry-certified process development kits (PDKs) for critical process nodes.
Report: India plans wafer fab for LED lighting
News & Analysis  
3/25/2010   Post a comment
De Core Nanosemiconductors Ltd. is planning to spend about 900 crore rupees (about $200 million) building a wafer fab for LEDs in Gandhinagar, Gujurat in the west of India, according to a Business Standard report.
February chip sales were steady, says analyst
News & Analysis  
3/25/2010   2 comments
The three-month average of global chip sales for February is set to be $22.15 billion compared with $22.49 billion, according to Bruce Diesen, an analyst at Carnegie Group (Oslo, Norway).
TSMC breaks ground on LED lighting wafer fab
News & Analysis  
3/25/2010   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has held a groundbreaking ceremony for an R&D center and wafer fab to develop and make light emitting diodes for lighting applications.
Microtune makes deal with activist hedge fund
News & Analysis  
3/25/2010   Post a comment
Microtune Inc. reached a deal with activist hedge fund Ramius LLC on nominees to the Microtune's board of directors, the company said Wednesday (March 24).
Analysts intrigued by Nintendo's 3-D handheld
News & Analysis  
3/24/2010   Post a comment
U.S. analysts were intrigued and curious following the overnight release of a brief statement by Nintendo saying the company plans to launch within the next year a handheld video gaming system that offers 3-D effects without requiring the use of special glasses.
BOARDS - Fanless, ultra low-profile Intel Atom system uses minimal power
News & Analysis  
3/24/2010   Post a comment
The SolidLogic Atom JT01 from Logic Supply is an ultra-slim, fanless Intel Atom system housed in a ruggedized, small-footprint enclosure targeted for use in industrial environments, public access areas, or remote locations. The SolidLogic Atom JT01 is designed for reliable, stable operation while consuming minimal power.
NASA awards contract for hypersonic vehicle R&D
News & Analysis  
3/24/2010   Post a comment
NASA is beginning to look at new technologies that could be used to design "hypervelocity vehicles."
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