Design Con 2015
Breaking News
News Analysis
Content posted in March 2011
<<   <   Page 10 / 10
IBM, JSR roll out self-assembly litho
News & Analysis  
3/1/2011   2 comments
JSR Corp., along with its U.S. operations, JSR Micro Inc., have rolled out a new directed self-assembly (DSA) technology for the sub-20-nm half-pitch node.
Fusion-io ratchets up server speeds for IBM, others
News & Analysis  
3/1/2011   3 comments
Fusion-io has scored a couple of OEM deals that take the IOPS (Input/Output Operations Per Second), a common benchmark for hard disks, solid state drives, and other computer storage devices, into the Terabytes per second region.
TI’s new DaVinci processors to feature HD video accelerators
News & Analysis  
3/1/2011   6 comments
Texas Instruments is unveiling two new DaVinci media processors featuring what the company proclaims the industry’s highest performing video engine.
D/A converter synthesizes entire cable spectrum into a single RF port
Product News  
3/1/2011   Post a comment
Analog Devices has introduced a 14-bit D/A converter that enables cable television and broadband operators to synthesize the entire cable spectrum up to 1 GHz into a single RF port, while consuming a maximum of 1.1 W of power.
Mentor joins Leti's program on maskless lithography
News & Analysis  
3/1/2011   Post a comment
Mentor Graphics Corp. and CEA-Leti have signed an agreement for Mentor Graphics to join IMAGINE, a CEA-Leti program focused on electron-beam direct write lithography for IC manufacturing for 22-nm and beyond.
Freescale crypto protects cars from hackers
News & Analysis  
3/1/2011   3 comments
Freescale Semiconductor introduced the first automotive security module compliant with a secure hardware extension supported by European automobile makers.
ADI ups ante in high-precision MEMS gyros
News & Analysis  
3/1/2011   6 comments
Analog Devices has invented a quad-differential MEMS gyroscope sensor that harness four separate MEMS elements to cancel out the effects or noise, vibration and excessive linear acceleration.
Australian fab obtains U.S. accreditation
News & Analysis  
3/1/2011   Post a comment
The U.S. Defense MicroElectronics Activity (DMEA)-a unit of the Pentagon's Office of the Director of Defense Research and Engineering-has awarded Australia's Silanna Semiconductor with the Accreditation of Trust.
Intel: EUV late for 10-nm milestone
News & Analysis  
3/1/2011   9 comments
Sam Sivakumar, Intel's lithography director, said extreme ultraviolet lithography is in danger of missing a key milestone.
Fiber optics boosted by crystalline core
News & Analysis  
3/1/2011   Post a comment
Penn State researchers led by professor John Badding demonstrated what they said are the world's first optical fibers to harbor a compound semiconductor core.
ITC judge finds for Samsung over Spansion
News & Analysis  
3/1/2011   5 comments
A preliminary ruling by a U.S. International Trade Commission administrative law judge found that Spansion infringes on one patent held by Samsung Electronics.
<<   <   Page 10 / 10


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
I tell you, I need more hours in each day. If I was having any more fun, there would have to be two of me to handle it all. For example, I just heard that I'm going to be both a speaker ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
12 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).