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TDK Corp. launched the TDK-Lambda RFE1600 Series
Product News  
3/20/2013   Post a comment
TDK is offering a 1600W single-output AC-DC power supply in a low profile package for stand alone or distributed power architectures.
Cypress PSoC 4 challenges 8-, 16-, and 32-bit MCUs
Product News  
3/20/2013   Post a comment
Cypress’s PSoC 4 architecture delivers flexible, low-power ARM Cortex-M0-based devices for embedded designs.
Movea, ST team on SoC for motion-aware TV
News & Analysis  
3/20/2013   1 comment
STMicroelectronics' systems-on-chip home entertainment business integrates Movea's SmartMotion Server on set-top box SoC.
Mentor Graphics empowers 32-bit MCU development with Nucleus SmartFit binary RTOS
Product News  
3/20/2013   Post a comment
Mentor Graphics' Nucleus SmartFit is a cost-effective, binary version of the Nucleus RTOS optimized to fit the limited internal memory of 32-bit MCUs.
Analog integration and the future of factory automation
News & Analysis  
3/20/2013   1 comment
Designs are so complex now, requiring better sensing and control circuitry, that core functions have to be integrated going forward.
Educator Shu-Park Chan leaves Silicon Valley legacy
News & Analysis  
3/20/2013   Post a comment
Shu-Park Chan, a champion of electronics engineering education, passed away February 22, the same day the Silicon Valley university he founded here was officially accredited.
Xilinx unveils new Zynq-7100 All Programmable SoCs
Product News  
3/20/2013   Post a comment
Xilinx extends its Zynq-7000 All Programmable SoC family to combine the highest performance ARM processor-based analytics, control, and signal processing.
Accellera announces SystemC AMS 2.0 Standard
Product News  
3/20/2013   Post a comment
Industry drives extensions to SystemC AMS 2.0 standard for mixed-signal design of electronic systems; Language Reference Manual (LRM) now available.
Altera Cyclone V GT FPGA is compliant for PCIe Gen2 at 5 Gbps
Product News  
3/20/2013   Post a comment
Industry’s only low-power 28nm FPGA in production allows developers to reduce total system costs in PCIe Gen2 applications.
6 more sessions I’d like to see at DESIGN West
News & Analysis  
3/19/2013   3 comments
I hope to hear talks on a Google OpenFlow router, a class on the new patent laws—oh yes, and a networked trash can and a wireless beanie network.
Nvidia's road map drives graphics, ARM into the enterprise
News & Analysis  
3/19/2013   4 comments
In a shot at Intel, AMD and its mobile competitors, Nvidia showed a road map for merging graphics, ARM cores and memory using FinFETs and 3-D ICs.
TI introduces Power Factor Correction (PFC) & Digital Power Workshop kits
Product News  
3/19/2013   Post a comment
PFC engineers can develop high-voltage and advanced power metering designs and analog power supply designers can easily transition to digital with new TI kit.
China, India outspending U.S. in semiconductors
News & Analysis  
3/19/2013   23 comments
Both countries will announce plans to invest billions in semiconductors this year, moves Cadence CEO Lip-Bu Tan says he wish the U.S. would make.
Intel cuts manufacturing costs with Big Data
News & Analysis  
3/18/2013   1 comment
Processor giant uses big data to develop chips faster, identify manufacturing glitches and warn about security threats.
Spreadtrum flourishes as $50 smartphones boom
News & Analysis  
3/18/2013   16 comments
Chip suppliers like MediaTek and Spreadtrum will continue to benefit from surging demand for smartphones in developing countries in 2013.
Android certification gets hands-on at DESIGN West
News & Analysis  
3/18/2013   1 comment
Android is not just for smart phones and tablets, as attendees at DESIGN West will learn in this two-day session on everything engineers need to know to create and deploy an Android-based embedded system.
Silicon photonics to take center stage at optical event
News & Analysis  
3/18/2013   4 comments
Kotura will show a silicon photonics module, one of a wave of new products driving down 100G connections, at OFC/NFOEC this week.
Dual-interface NFC tags connects smartphones to any device
Product News  
3/15/2013   Post a comment
Inside Secure has released an innovative near field communication (NFC) tag that creates virtually limitless possibilities for interactions between NFC mobile devices like smartphones and a broad range of medical, communications, entertainment and other electronic devices.
System carries out certification testing in 2.4-GHz band
Product News  
3/15/2013   Post a comment
The TS8997 test system from Rohde & Schwarz performs ETSI EN 300 328 V1.8.1 standard-compliant certification of wireless devices operating in the 2.4-GHz band, including WLAN 802.11a/b/g/n and Bluetooth devices.
Boeing underestimated possibility of battery fire
News & Analysis  
3/14/2013   4 comments
Boeing engineers and federal regulators appear to have vastly underestimated the possibility of a lithium-ion battery fire before the 787 Dreamliner was certified.
30-W DC-DC converter complies with railway transient and EMC standards
Product News  
3/14/2013   Post a comment
XP Power's convection-cooled converters, the RDC30, comply with railway transient and EMC standards.
IGBTs designed for high power industrial applications
Product News  
3/14/2013   Post a comment
Microsemi adds multiple new devices to non-punch through IGBT product family.
Digital Core Design's tiny UART IP core – DuART
Product News  
3/14/2013   2 comments
DµART, the newest IP Core mastered by Digital Core Design, is one of the tiniest UART IP cores for ASICs/FPGAs available on the market.
Micrel Inc. announced the MIC23450 and MIC23451, two triple-output, high-efficiency synchronous buck regulators
Product News  
3/14/2013   Post a comment
Micrel's latest regulators operate at 3MHz in PWM mode, which allows the use of tiny, low-cost capacitors and inductors thereby creating one of the smallest, simplest to use triple-buck regulators in the industry.
Bluespec's new high-speed verification and hybrid prototyping solution for RTL IP
News & Analysis  
3/14/2013   Post a comment
Semu desktop emulation delivers emulation speeds at simulation prices.
Murata mulls wireless sensor networks
News & Analysis  
3/14/2013   Post a comment
Murata's Finnish subsidiary is exploring how it could add RF technologies to its MEMS to pursue markets for wireless sensor networks.
Cisco sees $14 trillion opportunity in IoT
News & Analysis  
3/14/2013   28 comments
The Internet of Things is front and center on Cisco’s technology radar, said executives at the networking giant’s annual press event.
Taiwan’s Andes brings processor cores to U.S.
News & Analysis  
3/14/2013   3 comments
Business traction in Asia and the global consolidation in processor IP cores have motivated Taiwan’s Andes Technology to enter the U.S. chip market.
Nokia forges on with low-cost Asha 310
News & Analysis  
3/13/2013   2 comments
Nokia Corp. has recently announced the newest low-end member in the Nokia Asha family: Nokia Asha 310.
Tensilica acquisition to accelerate Cadence core strategy
News & Analysis  
3/13/2013   6 comments
Analysts are giving Cadence a cautious thumbs up as it moves into a future of integrated IP and tools for EDA.
Computer graphics pioneer awarded Kyoto Prize
News & Analysis  
3/13/2013   Post a comment
Sketchpad software creator Ivan Sutherland is awarded the 2012 Kyoto Prize for Advanced Technology.
Texas Instruments SM74611 active diode
Product News  
3/12/2013   1 comment
TI has introduced a smart bypass diode with with it claims offers the industry’s lowest power dissipation.
Economical chip resistors offer resistance values up to 10G Ohms
Product News  
3/12/2013   Post a comment
Stackpole uses special high resistance inks and volume production to achieve a chip resistor that is capable of extremely high resistance values without significant cost increase.
Hirose develops halogen-free 0.5 mm pitch FPC/FFC connector
Product News  
3/12/2013   Post a comment
The unique design of Hirose’s latest connector provides the high retention force that is required in rugged environments.
DESIGN West: Mars ate my spacecraft
News & Analysis  
3/12/2013   12 comments
Software designers need to adopt hardware design methods to create a foolproof architecture from the very beginning, before writing a single line of code.
Cable operators seek migration path to IP
News & Analysis  
3/12/2013   6 comments
Transcoding from MPEG to Internet Protocol offers one route to delivering video to any device.
ST and Thingsquare team to advance easy-to-use Internet of Things (IoT)
Product News  
3/12/2013   Post a comment
Thingsquare Mist is a game-changing software system that brings true Internet-connectivity to the Internet of Things (IoT).
Tunable RF components for smaller smartphones
Product News  
3/12/2013   Post a comment
ON Semiconductor launches a new family of tunable RF components.
Quanta's growth boosted by second-tier cloud providers
News & Analysis  
3/12/2013   3 comments
Taiwan’s Quanta reported it made 1.2 million servers last year, mainly for large data centers, with growth driven in part by a new tier of cloud service providers.
Greenliant unveils industrial-temp SSDs
Product News  
3/11/2013   Post a comment
The SATA and PATA embedded drives use MLC NAND flash memory.
Lattice unveils world’s smallest FPGA for miniature systems
Product News  
3/11/2013   Post a comment
Tiny iCE40 LP384 simplifies innovation in compact, portable solutions by delivering system functionality at hardware- accelerated Speeds with 25uW power consumption.
Xilinx showcases 400G apps for optical and wired OTN Markets at OFC 2013
Product News  
3/11/2013   Post a comment
All Programmable FPGAs and highly optimized OTN SmartCORE IP portfolio enable 400G solutions for next-generation smarter networks.
Slideshow: Y Combinator hackathon's prize-winning designs
News & Analysis  
3/8/2013   24 comments
An Internet Toaster, two pair of faux Google glasses and two novel electronic gloves emerged from a hackathon organized by Upverter and hosted by Y Combinator.
U.S. seeks more manufacturing tech centers
News & Analysis  
3/8/2013   12 comments
In an effort to attract more manufacturing back to the U.S., the administration is calling for partnerships to create centers of technical excellence.
Molex HSAutoLink II system interconnect system delivers design versatility, bandwidth
Product News  
3/7/2013   Post a comment
Next-generation HSAutoLink II system meets demand for multiple high-speed media protocols and network bandwidths up to 2.0 Gbps in automotive safety and infotainment.
Renesas preps multi-format video codec hardware IP
Product News  
3/7/2013   Post a comment
This new product, which Renesas plans to start sampling in April 2013, achieves a processing delay of 1 ms minimum, making it well-suited for real-time video transmission for automotive, mobile, and industrial equipment.
ACCES I/O expands PCI-104 board line
Product News  
3/7/2013   Post a comment
These PCI-104 boards feature a selection of 8, 4, or 2-ports of field selectable RS-232, RS-422, and RS-485 asynchronous serial protocols on a port by port basis.
Moore's Law trumped by Wright's Law
News & Analysis  
3/7/2013   49 comments
Moore's Law has competition from other predictions, some of which are more accurate for long-term and others better in short term.
Patent office to open in Silicon Valley
News & Analysis  
3/7/2013   3 comments
The new office will be in Menlo Park, said acting Commerce Department Rebecca Blank, and will mainly handle patent challenges.
TI unveils three new 48-V synchronous buck regulators
Product News  
3/7/2013   Post a comment
TI says its Fly-Buck converters simplify design of a variety of power supplies, including those with isolated multi-output, or positive and negative voltage rails.
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