Soitec plans to park workers, cut wages, stop bonuses News & Analysis 4/2/2009 Post a comment Silicon-on-insulator (SOI) wafer and substrates supplier Soitec SA (Bernin, France) has announced that it is planning to cut its workforce by roughly 10 percent, although this could include transferring some workers to a local R&D initiative.
Beru writes loss, outlook negative News & Analysis 4/2/2009 Post a comment While profitable on operating basis, automotive tier one Beru AG under the bottom line wrote red figures in FY2008. For the current year, the company does not see any recovery.
Continental expands R&D in China News & Analysis 4/2/2009 1 comment Automotive tier one Continental AG has launched a Technology Center in Jading, China. There, the Hannover (Germany) based company plans to develop electronic and hydraulic brake systems, motor management systems and electronic controls for the Chinese automotive market.
Video: Engineers lack voice in patent debate News & Analysis 4/2/2009 Post a comment The current debate on patent reform is out of touch with the needs of working inventors, in part because engineers lack a strong voice in Washington D.C., said Steve Perlman, a serial entrepreneur and keynoter at the Intellectual Property Symposium.
Intel gained MPU share in each quarter of '08 News & Analysis 4/1/2009 1 comment Intel in the fourth quarter of 2008 accounted for 81.8 percent of global microprocessor revenue, topping a year when it gained market share in microprocessors during every quarter, according to market research firm iSuppli.
Infineon claims first SDR chipset for sky and ground Product News 4/1/2009 Post a comment Infineon Technologies AG, has announced that a multi-standard mobile platform has been created based on Infineon-developed software-defined-radio technology. The SDR-enabled satellite-terrestrial handsets will operate with multiple cellular and satellite-based communications technologies including GSM, GPRS, EDGE, WCDMA, HSDPA, HSUPA and GMR1-2G/3G.
Qimonda insolvency proceedings launched News & Analysis 4/1/2009 Post a comment At the Munich district court, the insolvency proceedings for DRAM maker officially have begun. The lights at the Campeon R&D campus and the production sites in Dresden however have not gone out completely yet.
EVG, Leti partner to push TSV for 3-D integration News & Analysis 4/1/2009 Post a comment EV Group (St. Florian, Austria), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has entered a joint development program with CEA/Leti (Grenoble, France) on 3-D integration.
Macrovision Connected Platform Enable Multi-Room Digital Video Recorder Applications with Tru2Way Product News 4/1/2009 Post a comment A multi-room digital video recorded (DVR) is something that I am quite interested in, and anxious to really penetrate the industry. With a multi-room DVR, content can be stored in one location and viewed in another room in the home, freeing up users from being tied to one location, or having to purchase and recording content in multiple rooms. While it is possible to have this type of functionality from media center PCs, it is not a quick and easy thing to set up, while multi-room DVRs promise
Latest news from ESC Silicon Valley News & Analysis 4/1/2009 Post a comment The tone for this year's Embedded Systems Conference Silicon Valley was set by former Apollo astronaut Ken Mattingly, who reminded a spellbound audience of the power of teamwork and selflessness.
u-blox acquires NXP geotagging company News & Analysis 4/1/2009 Post a comment GPS chip-set provider u-Blox Holding AG (Thalwil, Switzerland) has said it has acquired Geotate BV, a joint venture between Road Group Holding AG and NXP BV for a total of 5.5 million euros (about $7.3 million).
Congatec expands Czech design activities News & Analysis 4/1/2009 Post a comment Congatec AG, a supplier of embedded computer modules, has said it plans to extend its design activities in the Czech Republic by taking over the design team of a business partner with effect from May 1.
RFID Tomorrow: Tight With A Tag News & Analysis 4/1/2009 Post a comment Mark Pollock is someone who might actually know. He spent thirty-six years at Kraft/General Foods. For the last few years, he headed the RFID initiative at Kraft.
Senators strike deal on patent reform News & Analysis 4/1/2009 Post a comment Three U.S. senators struck a compromise deal on patent reform including the controversial issue of patent infringement damages, but whether the rest of Congress—and the industry--will back it remains to be seen.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.