Wi-LAN settles suits with Intel, others News & Analysis 4/26/2011 Post a comment Canada's Wi-LAN Inc. has confirmed that four litigations that were scheduled for trial in early 2011 have been dismissed as a result of agreements signed with major semiconductor and product vendors.
Broadcom down, Altera up after Q1 earnings News & Analysis 4/26/2011 Post a comment Broadcom's stock declined more than 7 percent in after hours trading after the company reported first quarter profits and second quarter guidance that disappointed analysts. Altera's shares rose despite narrowly missing consensus analysts' expectations.
Silver Lake buys Smart Modular News & Analysis 4/26/2011 Post a comment Smart Modular Technologies Inc., a manufacturer of memory modules and solid-state storage products, has entered into a definitive agreement to be acquired by Silver Lake Partners and Silver Lake Sumeru for $9.25 per share in cash. The transaction is valued at approximately $645 million.
M/A-COM buys Optomai amid suit News & Analysis 4/26/2011 1 comment M/A-COM Technology Solutions Inc. has acquired Optomai Inc., a fabless semiconductor company that develops integrated circuits and modules for next-generation 40- and 100-Gbps fiber optic networks.
Hynix sale scheduled for May News & Analysis 4/26/2011 4 comments A group of creditor banks that turned Hynix debts into shareholding back in 2001 have announced plans to sell off as early as May, their 15 percent stake in the world's second largest DRAM maker, according to reports.
Si2 to form 3-D IC standards group News & Analysis 4/26/2011 3 comments The Silicon Integration Initiative (Si2), an organization focused on the development and adoption of standards to improve IC design, is quietly forming a standards group for 3-D chips.
Apple moves to No. 1 in handset revenue News & Analysis 4/26/2011 39 comments Apple overtook Nokia to become No. 1 in revenue among the world's handset vendors during the first quarter, when Apple racked up record iPhone sales according to Strategy Analytics.
Cadence introduces latest version of Allegro News & Analysis 4/25/2011 Post a comment Cadence Design Systems introduced the latest version of its Allegro PCB and IC packaging technology, delivering new capabilities that the company says provide increases in productivity and predictability across silicon, SoC and system development.
Firm lowers MOCVD forecast News & Analysis 4/25/2011 Post a comment Investment banking firm Barclays Capital has lowered its forecast in the metal organic chemical vapor deposition (MOCVD) equipment arena.
Three indicted for PC exports to Iran News & Analysis 4/25/2011 10 comments Three individuals have been recently indicted on charges of illegally exporting millions of dollars worth of computer-related equipment from the United States to Iran via the United Arab Emirates (UAE), according to the U.S. Department of Justice.
Mentor dismisses Icahn's board nominees News & Analysis 4/25/2011 Post a comment Mentor Graphics CEO Walden Rhines fired back at billionaire financier Carl Icahn, saying that Icahn is distorting the qualifications of his three nominees to Mentor's board of directors.
Touch controller now offers haptic feedback Product News 4/24/2011 Post a comment Atmel has introduced capacitive touch application-specific microcontrollers for implementing touch button, slider and wheel functionality, that integrate Immersion's haptic intellectual property to create a more intuitive and powerful user experience.
FRAM customers mad over IBM foundry delays News & Analysis 4/22/2011 11 comments Amid ongoing problems with its foundry ramp with IBM Corp., Ramtron International Corp., a supplier of ferroelectric-based memory, reported total revenue of $10.6 million for the first quarter of 2011, compared with $15.8 million for the same quarter last year.
Renesas begins with foundries, restarts Naka News & Analysis 4/22/2011 Post a comment Renesas Electronics Corp. has announced that it plans to run test production at the 200-mm wafer fabrication line at its Naka wafer fabrication factory on Saturday (April 23) with mass production scheduled to start on June 15. The company stated it has also begun transferring some chip production to foundries.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.