Gartner: Fab tool revenue grew 143% in 2010 News & Analysis 4/4/2011 Post a comment Worldwide semiconductor equipment sales grew 143 percent in 2010 to nearly $41 billion as the market recovered from the industry slowdown of the previous two years, according market research firm Gartner.
GSI: Hit by Cypress suit News & Analysis 4/4/2011 2 comments GSI Technology Inc. said on March 30, 2011, Cypress Semiconductor filed suit against GSI in the U.S. District Court for the District of Minnesota.
Global averaged chip sales dip in February News & Analysis 4/4/2011 7 comments The three-month average of worldwide sales of semiconductors was $25.19 billion for the month of February 2011, a decline of 1.1 percent from the prior month when averaged sales were $25.52 billion, according to the Semiconductor Industry Association (SIA).
E-field sensing startup raises $4 million News & Analysis 4/4/2011 3 comments Ident Technology AG, a developer of proximity sensing and gesture recognition ICs, has received 2.9 million euro (about $4.1 million) to fund the development of its GestIC three-dimensional (3-D) gesture control chip using a fabless semiconductor business model.
Hynix announces DDR4 DRAM and module Product News 4/4/2011 2 comments Hynix Semiconductor Inc. has announced that it has developed a 2-Gbit DDR4 DRAM IC and 2-Gbyte memory module based on the IC. The IC has been implanted using a 30-nm class (somewhere between 30 and 39-nm) manufacturing process technology.
UK startup unveils LTE transceiver IC News & Analysis 4/4/2011 1 comment Genasic Design Systems Ltd., a privately-held RF design company formed in 2009, has announced the availability of its first chip, a 65-nm CMOS transceiver IC for HSPA and LTE applications.
Globalfoundries joins IMEC's CMOS club News & Analysis 4/4/2011 1 comment Abu Dhabi owned foundry chipmaker Globalfoundries Inc. has signed a "strategic, long-term" partnership with European research institute IMEC on sub-22nm CMOS scaling and GaN-on-Si technology.
Tower offers $140 million for Micron fab News & Analysis 4/4/2011 6 comments Tower Semiconductor Ltd., a specialty foundry chipmaker which trades under the name TowerJazz, has announced it is proposing to buy a wafer fab belonging to Micron Technology Inc. in Nishiwaki City, Hyogo prefecture, Japan, for $140 million.
Casio G-SHOCK features Bluetooth low energy News & Analysis 4/3/2011 2 comments Casio has revealed a Bluetooth LE watch that employs Nordic µBlue nRF8001 single-chip-connectivity to wirelessly link to smartphones, enabling incoming call, email and SMS alert notifications, and a Finder Function that enables users to locate a misplaced phone.
System-on-Module added to line-up Product News 4/3/2011 Post a comment A system-on-module based on TI's Sitara AM3517/05 system-on-chip is targeted at high-visibility, space-constrained industrial and retail products like shelf-edge advertising, kiosks, dispensing machines, ticketing machines or elevator controllers.
Media processor SoC for multimedia display products Product News 4/3/2011 Post a comment Conexant Systems announced a single-chip media processor for multimedia display products including connected Web devices and interactive video displays, and applications such as digital signage, home automation/security, and user interface (UI) control.
Momentum builds for 3-D chips News & Analysis 4/2/2011 26 comments Many wonder if mainstream 3-D chips based on through-silicon-via (TSV) technology is feasible-or will even fly-amid ongoing problems in the arena.
Do parts from Japan pose radiation risk? News & Analysis 4/1/2011 15 comments Questions have arisen about contamination and radiation levels of electronics parts from Japan, though no dangerous radiation levels have been detected in any cargo, according to a trade group.
Atomic superconductor one-ups squid News & Analysis 4/1/2011 6 comments Circulating ultra-cold atoms around a ring exhibits superfluidity—the atomic version of superconductivity—potentially enabling sensors capable of tracking rotational motion in gyroscopes of unparalleled accuracy, according to the National Institute of Standards and Technology and Technology.
IHS: Chip revenue dipped in fourth quarter News & Analysis 4/1/2011 1 comment Global semiconductor revenue in the fourth quarter of 2010 dipped by 3.7 percent compared with the previous quarter, the first sequential decline in chip revenue since the first quarter of 2009, according to market research firm IHS iSuppli.
IBM's Watson piques university students' interest News & Analysis 4/1/2011 4 comments A symposium held at Carnegie Mellon University this week brought together academic minds to share ideas with students about what's possible with IBM's Watson OAQA technology in such areas as medicine, law, business, computer science, and engineering.
Venture capital exit market ticks up in Q1 News & Analysis 4/1/2011 Post a comment Venture-backed company exit activity jumped in the first quarter of 2011 showing an improvement over 1Q10 in both mergers and acquisitions and in companies making an initial public offerings of shares, according to a report from by Thomson Reuters and the National Venture Capital Association (NVCA).
BT resin in full production in May, says maker News & Analysis 4/1/2011 4 comments Mitsubishi Gas Chemical Company Inc. has said it now expects to achieve pre-earthquake production levels for bismaleimide triazine (BT) resin for semiconductor package substrates from the beginning of May.
Xilinx buys optical transport chip vendor News & Analysis 4/1/2011 2 comments FPGA vendor Xilinx Inc. has acquired Omiino Ltd. a Belfast telecommunications startup for an undisclosed amount, according to local reports. Xilinx follows AppliedMicro and Altera as an acquirer of companies that developed optical transport IP and implemented it in FPGAs.
Android remains processor neutral, says MIPS News & Analysis 4/1/2011 5 comments Processor intellectual property licensor MIPS Technologies Inc. is fully involved in Android antifragmentation efforts and is one of many companies invited to participate by Google, according to Art Swift, vice president of business development and marketing at MIPS.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.