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Content posted in May 2012
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Arizona display center develops 7.4-inch protoype OLED
News & Analysis  
5/31/2012   3 comments
An Arizona State University display center working with Army researchers have developed a 7.4-inch OLED prototype device using mixed oxide thin film transistors.
JST PNI series crimp-style connectors
Product News  
5/31/2012   Post a comment
JST's crimp-style connectors offer both wire-to-board and wire-to-wire applications on a 2mm pitch.
Cortus APS5 32-bit MCU IP core has high max frequency
Product News  
5/31/2012   Post a comment
Cortus has launched the high performance, high throughput 32-bit APS5 RISC microcontroller IP core, which combines good integer computational performance with a high maximum clock frequency.
Vishay VJ5301M868MXBSR, VJ5601M868MXBSR, VJ5301M915MXBSR and VJ5601M915MXBSR multilayer ceramic chip antennas
Product News  
5/31/2012   Post a comment
Vishay's surface-mount multilayer ceramic chip antennas for operation at 868 MHz and 915 MHz offer small 35 mm x 5 mm x 1.2 mm and 15.5 mm x 10.5 mm x 1.2 mm outlines.
Texas Instruments TPS92550 and TPS92551 DC/DC LED driver modules
Product News  
5/31/2012   2 comments
TI's latest DC/DC LED driver modules incorporate all the required power and passive circuitry into a single IC package to deliver up to 23W of power to the LED.
Asahi Glass to demo 0.1mm glass laminate at SID
News & Analysis  
5/31/2012   4 comments
At next week’s Society for Information Display exhibition manufacturer of glass, chemicals and high-tech materials AGC will showcase carrier glass on which to laminate its 0.1 mm-thick ultra-thin glass for next-generation displays and various other applications.
4-channel, 16-bit, 125-MSPS A/D converter for lowest power and package size
Product News  
5/31/2012   Post a comment
Analog Devices has a new 4-channel high-speed A/D converter in its data converter portfolio.
Multiprotocol router for 3G connectivity to ZigBee, Wi-Fi and Bluetooth sensors
Product News  
5/31/2012   Post a comment
A multiprotocol router by Libelium, the Meshlium Xtreme, enables the connection of any sensor or actuator to the cloud via high-speed 3G networks
OmniVision ultra-compact camera module for low-light performance
Product News  
5/31/2012   Post a comment
OmniVision unveiled the latest addition to OmniVision’s CameraCubeChip family of ultra-compact camera modules--the OVM7675.
EE Times Live Stream
News & Analysis  
5/31/2012   1 comment
EE Times Live Stream @ DAC 2012
Slideshow: Pinpoint splashdown ends first visit to space station
News & Analysis  
5/31/2012   27 comments
The Dragon cargo ship returned to Earth on May 31 after completing a nearly flawless first mission to the International Space Station. We present a mission summary.
Cadence tools out 20nm SoC test chip for STMicro
News & Analysis  
5/31/2012   2 comments
Cadence Design Systems has announced it has helped tape out STMicroelectronics’ 20nm test SoC chip, an industry milestone for Cadence delivering an end-to-end mixed-signal design flow for 20 nm.
Snapped up before DAC – there will be no Missing Link
News & Analysis  
5/31/2012   1 comment
One of the new exhibitors for DAC this year has been snapped up before the show begins….
Andes Takes Embedded Cores to Japan, Korea
News & Analysis  
5/31/2012   Post a comment
Emboldened by reports of an uncertain future for MIPS Technologies, Andes Technology will take its embedded cores to the Japan market this fall. Andes CEO Frankwell Lin says its a "small move for us."
Nissan turns auto/home power-sharing into reality
News & Analysis  
5/31/2012   13 comments
Nissan launched here what it calls its “Leaf-to-home” power supply system, designed to turn Nissan’s electric vehicle Leaf into a backup electricity supply for residential homes.
Samsung, LG lead on tablet displays
News & Analysis  
5/31/2012   4 comments
Thanks to continued strong sales of Apple iPad and Amazon Kindle Fire, Korean display makers Samsung Electronics Co. Ltd. and LG Electronics Inc. remained the top suppliers of tablet screens in 2011, with more than 80 percent of all shipments combined, according to IHS iSuppli.
Intel phone debuts in China
News & Analysis  
5/31/2012   11 comments
Intel has released another Atom-powered smartphone, this time by Chinese electronics vendor Lenovo Group, which said it will put out an Intel Inside device at CES 2012 back in January.
Freescale pushes wireless recharge
News & Analysis  
5/31/2012   15 comments
Freescale Semiconductor's reference designs for recharging tablets and smartphones allow automobiles, airports, coffee shops and other public areas to supply almost invisible recharging stations built into tables, kiosks or nearly any horizontal surface.
Meshlium Xtreme enables 3G connectivity to ZigBee, Wifi, and Bluetooth sensors
Product News  
5/30/2012   Post a comment
Meshlium Xtreme is the new multiprotocol router for wireless sensor networks designed to connect ZigBee, Wifi and Bluetooth sensors to the Internet through 3G connectivity, opening a wide range of possibilities for Internet of Things development.
TSMC to use Mentor YieldEnhancer SmartFill at 20-nm
Product News  
5/30/2012   Post a comment
Mentor Graphics said TSMC would use the SmartFill capability in its Calibre YieldEnhancer product in 20-nm semiconductor manufacturing.
Insufficient baseband chip supply hurting LTE smartphone sales
News & Analysis  
5/30/2012   9 comments
Since there has been greater than originally expected demand for LTE smartphones and tablets, international vendors are worried that their shipments are not enough to meet demand due to short supply of LTE solution chips from Qualcomm, currently the only provider of integrated multimode 3G/4G LTE baseband chips.
Teledyne acquires LeCroy
News & Analysis  
5/30/2012   4 comments
Military and aerospace specialist Teledyne Electronic Technologies has acquired Lecroy Corp., expanding its portfolio of analytical instrumentation products.
Breakthrough automatic partitioning tool from Flexras Technologies
Product News  
5/30/2012   Post a comment
New automatic partitioning tool boosts FPGA-based prototyping performance by 10X.
HP cuts data center power in lab tests
News & Analysis  
5/30/2012   13 comments
Engineers at HP Labs claim they have demonstrated software in a research setting that significantly lowers power consumption for large data centers.
Xilinx ships the world’s first heterogeneous 3D FPGA
Product News  
5/30/2012   5 comments
The 3D integration of 28 Gbps transceivers enables breakthrough bandwidth and signal integrity for Nx100G and 400G line card solutions.
Globalfoundries selects Synopsys' tool for yield management
News & Analysis  
5/30/2012   Post a comment
Globalfoundries has selected Synopsys' Yield Explorer tool for use as part of its next-generation yield management system for faster yield ramp based on volume diagnostics, Synopsys said.
Next growth market for EMS providers: renewable energy
News & Analysis  
5/30/2012   3 comments
OEMs are looking for help in entering the emerging renewable energy and smart grid markets. With the right strategy, electronic manufacturing services providers could cash in on the opportunity.
Invisible bike helmet protects with air-bag shell
News & Analysis  
5/30/2012   31 comments
Motion sensors and microcontrollers from STMicroelectronics enable the operation of the airbag bicycle helmet invented by Hövding, a Swedish design house.
R&S interlock unit ensures safe operation of ATE
Product News  
5/30/2012   Post a comment
The unit can be customized to meet specific requirements.
UIS turnkey service automates leak-testing operations
Product News  
5/30/2012   Post a comment
UIS offers a single-source turnkey service for both semiautomated and fully automated leak-testing applications.
Tektronix optical analyzer teams with sampling scope
Product News  
5/30/2012   Post a comment
Analyzer is compatible with both real-time and equivalent-time oscilloscopes.
Marvell wins as Dell starts shipping ARM-based servers
News & Analysis  
5/30/2012   7 comments
Dell Inc. said it has started shipping server computers called Copper based on the ARM processor architecture to selected customers. The servers are based on Marvell's quad-core Armada XP SoC products.
ASTC, Tanner EDA to deliver ASIC design services
News & Analysis  
5/30/2012   Post a comment
Australian Semiconductor Technology Co. and Tanner EDA have reached an agreement to deliver analog/mixed signal IP and custom ASIC design services.
Xilinx ships loaded FPGA for linecard applications
News & Analysis  
5/30/2012   Post a comment
Xilinx Inc. has begun initial shipments of the Virtex-7 H580T FPGA, a single-chip solution for addressing key Nx100G and 400G line card applications and functions.
3U form-factor PSU claims increased power benefits
Product News  
5/30/2012   Post a comment
Pulse Electronics' 3U form-factor PSU for VPX applications is now available with optimized Positronic P47 connections and can be configured to deliver more than 400 W of power plus provide an additional high power 28 V protected output.
Industrial RJ45 module features robust design and rapid assembly
Product News  
5/30/2012   1 comment
A new modular plug for industrial Ethernet applications reduces assembly time and minimizes connector replacement costs while providing highly reliable connections.
NLT and Renesas expand wide-aspect ratio display
Product News  
5/30/2012   1 comment
NLT Technologies and Renesas Electronics America unveiled two new color thin film transistor (TFT) LCD modules, expanding its industrial wide aspect ratio display modules.
Hand-gesture recognition ‘sees’ position, shape and motion via camera-recorded image
Product News  
5/30/2012   1 comment
OMRON Corporation developed a new hand gesture recognition technology capable of simultaneously recognizing the position, shape, and motion of a person's hand or finger by referencing a camera-recorded image.
InvenSense proprietary MEMS fab process offers limited licensing
Product News  
5/30/2012   Post a comment
The InvenSense NF-Shuttle offering is a silicon CMOS-MEMS platform where mask costs are split between multiple users—they can purchase ‘seats’ on the same mask.
Industrial apps go multi-platform
News & Analysis  
5/30/2012   3 comments
Motorola Solutions has crafted a universal app platform for its developers, enabling a single HTML5 app to be deployed on iOS, Android, Windows Phone, Windows Mobile, Windows CE and Blackberry mobile devices.
Ansys to acquire embedded software firm
News & Analysis  
5/29/2012   2 comments
Simulation software provider Ansys said it signed a definitive agreement to acquire France-based Esterel Technologies, a provider of embedded software simulation tools for mission critical applications, for about $53 million in cash.
U.S. manufacturing effort targets regional clusters
News & Analysis  
5/29/2012   10 comments
The Obama administration wants to foster the creation of regional manufacturing clusters under a $26 million program.
Globalfoundries to use Mentor's SmartFill at 20-nm
News & Analysis  
5/29/2012   Post a comment
EDA vendor Mentor Graphics said Globalfoundries would use the SmartFill facilities of its Calibre YieldEnhancer product to enable advanced fill techniques for 20-nm manufacturing processes.
Slideshow: MEMS in the midnight sun
News & Analysis  
5/29/2012   3 comments
A trip to Finland to find out more about MEMS has been captured in pictures.
LG Display ups HD panel for smartphones to 5 inches
News & Analysis  
5/29/2012   2 comments
LG Display has introduced a 5 in. full high definition LCD panel for smartphones, which the company claims provides the same quality as on TVs and monitors.
Black solar cells have lowest reflectance for silicon solar cells
News & Analysis  
5/29/2012   4 comments
Scientists at Natcore Technology using simple liquid bath processes said they have created a black surface on a silicon wafer with an average reflectance in the visible and near-infrared region of the solar spectrum of 0.3 percent.
AMI/AMR smart energy transmit/receive front end modules
Product News  
5/29/2012   Post a comment
The RF65x9 series of transmit/receive modules from RFMD integrate a complete solution in a single front-end module for AMI/AMR and smart grid solutions.
Lfoundry announces 110-nm PDK with embedded flash
News & Analysis  
5/29/2012   Post a comment
Lfoundry Rousset SAS has announced the availability of its physical design kit (PDK) for 110-nm aluminum process. The PDK includes options including an embedded flash memory which is proposed in 90-nm resolution.
Intel invests in Dnote audio for use in ultrabooks
News & Analysis  
5/29/2012   14 comments
Intel Capital has invested an undisclosed sum of money in Trigence Semiconductor Inc. to help expand use of its Dnote audio technology in computers based on Intel processors.
Cortus APS3R 32-bit MCU IP core targets low energy embedded apps
Product News  
5/28/2012   Post a comment
Cortus has extended its family of 32-bit modern RISC microcontroller IP cores with the energy efficient APS3R, which is targeted for low power embedded applications.
Page 1 / 8   >   >>


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