MEMS wafer maker Okmetic outsources amid SOI push
News & Analysis 5/28/2012 1 comment
Okmetic Oyj a manufacturer of silicon wafers for sensor, semiconductor and solar applications, has begun outsourcing wafer manufacture even as it is expanding its factory at its Finland headquarters to make more silicon-on-insulator wafers.
Intel confirms Ireland for 14-nm silicon
News & Analysis 5/27/2012 24 comments
The Intel wafer fab complex in Leixlip Ireland is set to receive investment to allow it to manufacture 14-nm silicon and beyond, the company revealed in a presentation to analysts on May 10. The investment is expected to be more than $1 billion.
Video: Indy 500 pit boss talks tires
News & Analysis 5/27/2012 Post a comment
We get down and dirty in the pits at the Indy 500, where we learn how 0.5 increments of tire pressure can make or break a race, how many laps a driver can go on one set of wheels, and how far rival tire makers will go to steal another firm's secrets.
Renesas cuts 14,000 jobs; fab sale to TSMC
News & Analysis 5/26/2012 10 comments
Renesas Electronics Corp. plans to eliminate up to 14,000 jobs, while selling the company’s leading system-chip fab in Yamagata to TSMC, according to a report in Nikkei, Japan’s economic newspaper.
ST's priorities: Sustain analog, expand into digital
News & Analysis 5/25/2012 3 comments
The loss a key customer Nokia resulted in a $1 billion loss for STMicroelectronics. ST executives explained this week how they plan to make up for the setback.
If it wasn’t for the pesky $1 billion loss of business from a “significant customer” recently ST Microelectronics might be a much better financial and strategic shape.
High-G MEMS help detect concussions
News & Analysis 5/24/2012 8 comments
Analog Devices has crafted a MEMS sensor that is says can help detect concussion symptoms when they happen, giving doctors time to administer preventative therapies.
Inertial measurement unit integrates accelerometer, gyro
News & Analysis 5/24/2012 10 comments
Bosch Sensortec said it has integrated an inertial measurement unit with a three-axis accelerometer and a three-axis gyroscope into the smallest package yet available for consumer-grade applications such as mobile phones, tablets and digital cameras.
ARM CTO looks at architecture scaling for 2020 solutions
News & Analysis 5/24/2012 11 comments
Anticipating the propagation of the Internet of things, Mike Muller, chief technology officer at ARM Ltd., discussed the needs for architecture scaling at the annual IMEC Technology Forum this week at the Square meeting center in Brussels, Belgium.
Renesas to tie up with TSMC, cut jobs, say report
News & Analysis 5/24/2012 2 comments
Renesas Electronics Corp., Japan's largest maker of logic chips, is expected to announce a business partnership with foundry Taiwan Semiconductor Manufacturing Co. Ltd. for the production of chips on Monday (May 28), according to reports.
Slideshow: Sun shines on UMC's new fab
News & Analysis 5/24/2012 6 comments
It was a warm, sunny day in Tainan as UMC officially broke ground on its latest and largest fab to date, but there were distant clouds on the horizon for the foundry.
Intersil to cut 11% of workforce
News & Analysis 5/23/2012 4 comments
Analog chip vendor Intersil said it would cut about 11 percent of its workforce as part of a plan to reduce operating expenses by about $40 million per year.
TI rolls high data rate CAN transceivers
Product News 5/23/2012 4 comments
Texas Instruments introduced a pair of turbo CAN transceivers designed for data rates in excess of 1 Mbps, meeting the growing demand for more nodes and greater data transmission length in today's industrial CAN networks.
IndyCar safety harnesses MEMS
News & Analysis 5/23/2012 9 comments
IndyCar designers are improving safety using MEMS sensors fitted in a driver's ear piece to record crash data. The resulting analytics could help reduce injuries like concussions for astronauts as well as race drivers.
Dell's results seen as bad news for Intel
News & Analysis 5/23/2012 10 comments
Disappointing first quarter results and a lower-than-expected second quarter sales target by PC supplier Dell is bad news for Intel, which has forecast growth above the seasonal average for the rest of the year, according to a Wall Street analyst.
TI says copper wire bonding momentum growing
News & Analysis 5/23/2012 3 comments
Texas Instruments said it has shipped nearly 6.5 billion analog, embedded processing and wireless chips using copper wire bonding technology, a milestone that the firm says underscores the semiconductor industry's growing confidence in copper packaging technology as a viable replacement for gold.