Activist investor Icahn chastises Mentor again News & Analysis 5/2/2012 1 comment Billionaire financier Carl Ichan wrote a new letter to Mentor Graphics' board of directors criticizing the decision not to re-nominate two directors he supported to the company's board for another term.
Broadcom tops Q1 estimates as profit tumbles News & Analysis 5/1/2012 2 comments Fabless semiconductor provider Broadcom reported sales and profit that exceeded analysts' expectations, even as its net income in accordance with generally accepted accounting principles tumbled compared with the previous and year-ago quarters.
HGST, LSI, PMC-Sierra demo 12G SAS News & Analysis 5/1/2012 Post a comment The HGST division of Western Digital demonstrated a solid-state disk drive with a 12 Gbit/second Serial Attached SCSI interface working with chips from LSI and PMC-Sierra.
Fujitsu to transfer Iwate fab to Denso News & Analysis 5/1/2012 Post a comment Fujitsu Semiconductor will transfer ownership of an older fab that produces microcontrollers to Japanese automotive parts supplier Denso under the terms of an agreement announced last week.
TriQuint wins $12.3 million DARPA contract News & Analysis 5/1/2012 Post a comment RF chip supplier TriQuint Semiconductor said it was selected by the the U.S. Defense Advanced Research Projects Agency to lead a $12.3 million development program focused on ultra-fast gallium nitride switch technology for DARPA's Microscale Power Conversion program.
che updates Redhawk for sub 20-nm and 3-D designs News & Analysis 5/1/2012 Post a comment Ansys subsidiary Apache Design has developed its fourth-generation power sign-off EDA software package which addresses sub-20-nm designs that operate at 3 GHz. The RedHawk-3DX package also supports simulation of multi-die 3-D ICs.
GlobalFoundries, Infineon, IBM, ST linked to Indian fab plan News & Analysis 5/1/2012 20 comments More companies are being linked to the Indian government's plan to get one or more semiconductor wafer fabs constructed on the sub-continent. At least five chip companies have expressed an interest in supporting the project, according to a Hindu Business Line report.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.