Europe backs FDSOI wafer fabs News & Analysis 5/21/2013 3 comments A $465 million collaborative R&D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.
ST to deny rivals FDSOI access News & Analysis 5/20/2013 Post a comment In an interview Jean-Marc Chery, ST's CTO (shown), said his company could install its FDSOI process in multiple foundries but for now has an agreement in place that will deny certain companies access to the process.
ST's strategy is a tale of two segments News & Analysis 5/16/2013 3 comments ST tells analysts it is going to report financial results for both its digital and analog business segments for "transparency" but remains committed to exploiting manufacturing technologies it has Crolles, including its FDSOI process.
LED luminaires transmit data at high bandwidth News & Analysis 5/13/2013 1 comment The Heinrich Hertz Institute (HHI) in Berlin has further developed its broadband optical communications technology which utilizes standard commercial LEDs used for lighting purposes to transmit data.
Tiny Bluetooth low-energy and ANT+ ICs Product News 5/13/2013 Post a comment Nordic Semiconductor ASA has introduced two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.