Europe backs FDSOI wafer fabs News & Analysis 5/21/2013 3 comments A $465 million collaborative R&D project is set to support pilot lines in Dresden and Grenoble for production of fully depleted silicon on insulator manufacturing process.
ST to deny rivals FDSOI access News & Analysis 5/20/2013 Post a comment In an interview Jean-Marc Chery, ST's CTO (shown), said his company could install its FDSOI process in multiple foundries but for now has an agreement in place that will deny certain companies access to the process.
ST's strategy is a tale of two segments News & Analysis 5/16/2013 3 comments ST tells analysts it is going to report financial results for both its digital and analog business segments for "transparency" but remains committed to exploiting manufacturing technologies it has Crolles, including its FDSOI process.
LED luminaires transmit data at high bandwidth News & Analysis 5/13/2013 1 comment The Heinrich Hertz Institute (HHI) in Berlin has further developed its broadband optical communications technology which utilizes standard commercial LEDs used for lighting purposes to transmit data.
Tiny Bluetooth low-energy and ANT+ ICs Product News 5/13/2013 Post a comment Nordic Semiconductor ASA has introduced two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.