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Content posted in June 2009
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TSMC adds analog to 0.13-micron process
News & Analysis  
6/29/2009   Post a comment
Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) continues to move down the analog and mixed-signal path.
Virage Logic joins Power.org
News & Analysis  
6/29/2009   Post a comment
IP vendor Virage Logic has joined Power.org, the organization that promotes and develops standards for Power Architecture.
New Dual White-LED Flash Driver Maximizes Picture Quality in Cell Phone Cameras
Product News  
6/29/2009   Post a comment
ADI's ADP1655 LED flash driver incorporates advances in transmit masking, current accuracy and LED grounding to ensure brighter flash, more reliable operation and smaller form factors
Wolfson new DACs make high-quality audio more affordable
Product News  
6/29/2009   Post a comment
New DACs dramatically cut cost of bringing high quality audio to digital TV, Blu-ray, set-top box and games consoles
Delkin Releases Fastest microSD with Extended Temperature Rating in Its Class
Product News  
6/29/2009   Post a comment
The new industrial-grade cards from Delkin read and write at speeds never before seen from the microSD platform, and are built to excel in extreme temperature conditions.
Genoa Pixcale Reduces Power Consumption by 40% for Smartphone Displays, Improves Color Quality
Product News  
6/29/2009   Post a comment
Genoa Color Technologies announced Pixcale technology to address the twin challenge of delivering longer battery life and vivid TV-quality color on high-resolution mobile phone displays.
Congatec : XTX module has a total TDP of 8 W
Product News  
6/29/2009   Post a comment
Congatec announces the conga-XA945 module as the latest addition to the companies ETX/XTX product family.
ASE gains $365 million syndicated loan
News & Analysis  
6/29/2009   1 comment
Taiwan's Advanced Semiconductor Engineering Inc. (ASE) has signed a syndicated loan agreement with 17 banks. The five-year loan is worth NT$12 billion ($364.7 million).
CSR and SiRF combine to launch a new era of connectivity and location
News & Analysis  
6/29/2009   Post a comment
CSR and SiRF on Friday June 26 completed the merger between SiRF and a wholly owned subsidiary of CSR.
STMicroelectronics : Surge protection IC targets Power-over-Ethernet
Product News  
6/29/2009   Post a comment
Power over Ethernet (PoE), or IEEE 802.3at, is the industry standard enabling devices such as Voice-over-IP (VoIP) phones, wireless-LAN access points, RFID tag readers, sensors, or cameras to connect into a network without also requiring a nearby wall outlet for power.
ON Semiconductor Introduces 10 A Supercapacitor-Based LED Flash Driver for Ultra-Slim Camera Phones and Digital Cameras
Product News  
6/29/2009   Post a comment
The NCP5680 is an integrated LED flash and power management solution offered in a 0.55 mm low-profile package that extends battery life and improves digital photo quality
HuberSuhner : HDTV connectors have good VSWR up to 3 GHz
Product News  
6/29/2009   Post a comment
Huber+Suhner BNC 75 connectors can be used for all coaxial interconnect solutions where HDTV (High definition television) signals have to be transmitted.
Telecom firms back standard phone charger in Europe
News & Analysis  
6/29/2009   Post a comment
Top mobile telephone suppliers have agreed to back an EU-wide harmonization of phone chargers, the European Commission said on Monday, hailing the pact as good news for consumers and the environment.
SMIC raises Q2 outlook
News & Analysis  
6/29/2009   Post a comment
Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) has raised its forecast.
Management buys out Sarnoff Europe
News & Analysis  
6/29/2009   Post a comment
A management group has acquired Sarnoff Europe and its ESD protection technology from Sarnoff Corp.
Altera rolls low power, anti-tamper FPGAs
Product News  
6/29/2009   Post a comment
Altera this week is rolling out a new product family, Cyclone III LS, billed by the company as the industry's first low power FPGAs with anti-tamper, design-security and design-separation features.
Mentor adds support for control logic to Catapult C
Product News  
6/29/2009   Post a comment
EDA vendor Mentor Graphics announced extensions to its Catapult C Synthesis tool to support full-chip high-level synthesis, a move billed by company executives as the most significant enhancements to Catapult C since the tool was introduced in 2004.
Industrie verständigt sich auf Einheits-Ladegerät für Handys
News & Analysis  
6/29/2009   Post a comment
Die Mitglieder der Industrieorganisation Digitaleurope haben ein Absichtserklärung zur Entwicklung eines einheitlichen Ladegeräts für Handys unterzeichnet. Damit kommt die Branchenorganisation einer entsprechenden Zwangsregelung durch die EU zuvor.
Samsung using 45-nm process for ARM-11 based processor
News & Analysis  
6/29/2009   Post a comment
Samsung Electronics Ltd has started sampling its ARM11-based application processor that will be made on its 45-nm CMOS process technology.
Industry agrees on unified cellphone chargers
News & Analysis  
6/29/2009   Post a comment
The members of industry association Digitaleurope have signed a memorandum of understanding aiming at developing a common charging solution for mobile phones. The move dangles the availability of a charger that can be used across all almost brands.
Semico projects five-fold netbook growth
News & Analysis  
6/29/2009   Post a comment
As many as 59 million netbooks will ship in 2013, nearly 22 percent of the mobile PC market and up almost five-fold from 2008, according to a new report by Semico Research that profiles the major chip contenders in the sector.
Green shoots start to sprout in green sector
News & Analysis  
6/29/2009   Post a comment
Canada's alternative energy sector is showing signs of a budding recovery, as companies resurrect financing deals and public offerings that withered with the recession, but that revival remains very fragile.
Altera enhances security in extended Cyclone-III FPGA family
Product News  
6/29/2009   Post a comment
Altera Corp. (San Jose, Calif.) has introduced the Cyclone-III LS family of FPGAs with enhanced security features. The devices are made on a 60-nm process technology from TSMC and offer 0.25W of static power consumption for 200,000 logic elements.
16Bit Octal DAC suits open-loop and closed-loop systems
Product News  
6/29/2009   Post a comment
Linear Technology Corp. has introduced the LTC2656, a 16bit octal DAC with 4LSB INL maximum over temperature - a significant performance gain over Linear's existing LTC2600 16bit octal DAC, and those of its competitors.
Heuermann introduces an autocalibration box for network analyzers
News & Analysis  
6/29/2009   Post a comment
Easy calibration of one to n-port vector network analyzers (VNAs) can be performed with Heuermann HF Technik’s RapACal NA-RC1.
Stantum, Sitronix team for multi-touch controllers
News & Analysis  
6/29/2009   Post a comment
Stantum Technologies, the French multi-touch sensing technologies specialist, has teamed with Taiwanese group Sitronix (Hsinchu), which focuses on LCD driver and SoC design, to develop voltage matrix multi-touch single-chip solutions.
Schurter : Piezo keypads resist extreme conditions
Product News  
6/29/2009   Post a comment
With a range of piezo keypads, Schurter provides key panels that are impervious to all kinds of dirt and fluids. The keypads are particularly suitable for use in outdoor applications due to their ability to resist extreme ambient conditions such as negative temperatures, ice and snow.
Siemens platform addresses Hi-Mix Low-Volume production
News & Analysis  
6/29/2009   Post a comment
After several months of field testing, Siemens Electronics Assembly Systems GmbH (Munich) has launched sales for its Siplace SX component insertion machine platform. With a high degree of flexibility, the platform particularly addresses production environments characterized by frequent product changes and low volumes.
TV tuner IC captures analog, digital standards, features LNA and tracking filters for superior performance
Product News  
6/29/2009   Post a comment
Silicon Labs CMOS Si217 has low-IF architecture, minimizes external passives, reduces BOM, increases in-field performance consistency
MODULES - Dajac launches USB-controlled I/O module for PC-based automation
News & Analysis  
6/28/2009   Post a comment
Expert I/O 1000 simplifies automation projects for testing, process control, industrial, distribution, medical, home and hobby applications
Advantest reshuffles management amid losses
News & Analysis  
6/27/2009   Post a comment
Amid losses and layoffs, ATE giant Advantest Corp. has reshuffled its management ranks.
Cascadable 4-channel, 24-Bit ADC simplifies system design
Product News  
6/27/2009   Post a comment
Maxim Integrated Products (Sunnyvale, CA) has introduced a 4-channel, 24-bit simultaneous-sampling ADC that can be daisy-chained to provide a sampling capacity for up to 32 channels.
ADC suits image-processing functions in medical imaging and radar
Product News  
6/27/2009   Post a comment
Murata Power Solutions (Mansfield, MA) has introduced a quad sampling analog to digital converter (ADC) for image processing applications where low noise performance and a high conversion rate are required.
Five enablers for future chip scaling
News & Analysis  
6/26/2009   Post a comment
Here are some of the proposed options for transistor-level scaling.
Sematech addresses EUV inspection gap
News & Analysis  
6/26/2009   Post a comment
Following recent warning shots from Intel Corp., Sematech on Friday (June 26) sounded the alarm bells--again. The chip-making consortium warned that there is still a major funding shortfall and a lack of mask inspection gear to enable extreme ultraviolet (EUV) lithography.
10-A supercapacitor-based LED flash driver focuses ultra-slim camera phones and digital cameras
Product News  
6/26/2009   Post a comment
ON Semiconductor has introduced a new supercapacitor-optimized LED flash driver capable of delivering up to 10 A for photo flash and video light in ultra-slim camera phones and compact digital cameras.
Sematech to set up 'test bed' for TSV production
News & Analysis  
6/26/2009   Post a comment
Chip-making consortium Sematech disclosed plans to set up a 300-mm R&D ''test bed'' for the production of 3-D devices based on through-silicon-via technology.
Robust growth predicted for 193-nm resist
News & Analysis  
6/26/2009   Post a comment
The market for 193-nm photoresist is expected to grow at a compound annual rate of 27 percent over the next five years, reaching nearly $1.2 billion in 2013, according to a report by an electronic materials consulting firm.
Online lab lets designers try Cadence tools
News & Analysis  
6/26/2009   Post a comment
Xuropa Inc. is opening an online lab for evaluators of verification tools from Cadence Design Systems.
Upbeat on April, Qimonda, XMOS lead weekly story ranking
News & Analysis  
6/26/2009   Post a comment
Here are the top five online stories for the week beginning Sunday, June 21, as ranked by EE Times Europe readers, up to and including Friday, June 26. The ranking is based on the number of reader "views" or "hits" on a particular article.
Top five products for week 26
News & Analysis  
6/26/2009   Post a comment
The editorial team of EETimes Europe has selected the following five products as products of the week ending June 26th.
QuasarBrite narrow beam LEDs provide decrease in light angle
Product News  
6/26/2009   Post a comment
Lumex announces the global launch of their QuasarBrite Narrow Beam SMT LEDs providing users with a tight beam of high-intensity red, green or blue light.
Imagination sales, profits up as PowerVR pays off
News & Analysis  
6/26/2009   Post a comment
Graphics IP core licensor Imagination Technologies Group plc (Kings Langley, England) made a net profit of £8.24 million (about $13.6 million) on revenue of £64.09 million (about $105.7 million) for the year to April 30, 2009.
Q-Cells strengthens its CIGS leg
News & Analysis  
6/26/2009   Post a comment
Solar cell manufacturer Q-Cells SE (Wolfen-Bitterfeld, Germany) has bought the remaining shares of thin film module manufacturer Solibro GmbH. With the move, Q-Cells emphasizes its commitment to the CIGS (Copper, Indium, Gallium, Sulphur/Selen) technology.
Apple follows Intel, tops up stake in U.K. graphics provider
News & Analysis  
6/26/2009   Post a comment
Apple Inc., the developer of digital consumer goods that range from computers to mobile phones, has increased its stake in Imagination Technologies Group plc (Kings Langley, England) to 9.5 percent.
French asynchronous design startup raises $6.9 million
News & Analysis  
6/26/2009   Post a comment
Tiempo AS, French startup specializing in the design of asynchronous ICs, announced it has raised 5 million euros ($6.9 million) in a Series B financing round with venture capital firms Viveris Management and Oddo Private Equity and existing investors Emertec Gestion, Schneider Electric Ventures, INPG Entreprise SA and Alma Capital Finances.
Micron fiscal Q3 loss widens on lower sales, price pressure
News & Analysis  
6/25/2009   Post a comment
Micron Technology Inc. lost money for the tenth consecutive quarter in its latest reporting period as sales fell on a year-over-year basis although unit shipment continued to rise and the company made gains in efforts to trim operating costs.
Exec: Memory business model is broken
News & Analysis  
6/25/2009   2 comments
The business model in the memory sector is broken, prompting the need for more rational behavior and consolidation in the industry, according to an executive at the Memcon technology event here.
SMSC to outsource test operations
News & Analysis  
6/25/2009   Post a comment
Chip vendor SMSC said it plans to outsource some of its production test operations to Asian suppliers. The affected operations are currently handled in New York State.
Leti hosts Presto Engineering, IPdia startups
News & Analysis  
6/25/2009   Post a comment
In line with its open innovation culture, Leti has expanded its vision and opened its doors to entrepreneurs coming from outside so as to help them bring their technology to maturity.
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