Atmel completes sale of fab in France News & Analysis 6/24/2010 Post a comment Germany's LFoundry GmbH, an analog and mixed-signal foundry, has completed its previously-announced acquisition of Atmel Corp.’s wafer fabrication operation in Rousset, France.
First look inside iPhone 4 Teardown 6/24/2010 6 comments You could call the new Apple iPhone 4 an iPad Nano because it uses at least six chips from the popular Apple tablet, according to analysts from UBM TechInsights that have done a teardown of the new smartphone, revealing it uses a MEMS gyro from STMicroelectronics.
Aeroflex rolls single-box multi-RAT tester Product News 6/24/2010 Post a comment Aeroflex's 7100 tester now supports multiple Radio Access Technologies (RAT) including CDMA EV-DO and eHRPD as well as LTE to accelerate multi-mode cellular terminal device development for new LTE deployments.
China's $25 billion to boost domestic production, says analyst News & Analysis 6/24/2010 2 comments LONDON — The Chinese government is preparing to spend $25 billion on wafer fabs to boost domestic chip manufacturing over the next five years, according to market research company The Information Network. This is set to boost the proportion of local demand met by domestic wafer fabs and diminish Chinese chip imports, the analysis firm said
Premo rolls closed-loop effect sensor Product News 6/24/2010 Post a comment The Spanish inductive component maker Premo Group has introduced the HCT-1000-SH series, a high current Closed Loop Hall Effect Sensor that is claimed to test and measure accurately current levels up to 1000 Amps.
MIPS to restructure, align with Android News & Analysis 6/24/2010 Post a comment Processor IP licensor MIPS Technologies Inc. has announced a restructuring plan that will see it reduce headcount and incur a $1 million restructuring charge. The changes are expected to save company between $2 million and $2.4 million in annual expense, including the current financial year.
PCI Express 3.0 delayed until 2011 News & Analysis 6/24/2010 3 comments The PCI SIG has released an interim 0.71 version of the PCI Express 3.0 specification that supports up to 8 GigaTransfers/second and aims to start testing products for compliance in early 2011, about a year later than originally anticipated.
AMD x86 cores at Hot Chips News & Analysis 6/24/2010 Post a comment AMD is expected to steal the limelight at the annual Hot Chips conference when it describes two new x86 cores that mark the first major architectural advance for the company in several years.
Mentor Graphics Linux Freescale Product News 6/23/2010 Post a comment Mentor Graphics has brought out its Linux platform supporting Freescale Semiconductor, which enables applications for Freescale’s QorIQ and PowerQUICC processors.
Nikon's 'stagnant' EUV litho is a risk, says analyst News & Analysis 6/23/2010 3 comments Nikon is continuing to conduct basic research into extreme ultraviolet lithography but is falling behind its rival ASML, according to an analyst's note from Nomura. The author considers that Nikon might be worthy of Japanese government support.
EV battery subsystem taps Maxim News & Analysis 6/23/2010 2 comments A team competing for $2.5 million in the Automotive X Prize is in the final stages of developing a battery management system for their entry that they hope someday will power a range of commercial electric vehicles.
Freescale CEO: 'Connected intelligence' beating recession News & Analysis 6/22/2010 Post a comment Freescale Semiconductor revealed its vision of the future of semiconductor technology at the Freescale Technology Forum, where CEO Richard Beyer predicted that the recession will continue to fade by virtue of the commercial success of what he called "connected intelligence."
Tilera, Quanta roll low power server News & Analysis 6/22/2010 3 comments Multicore processor designer Tilera Corp. announced it plans to ship a 200-core device in 2013 and demonstrated a 512-core server made by partner Quanta Computer Inc. using Tilera's current 64-core chip.
Sensors integrate ColdFire processor, MEMS accelerometer Product News 6/22/2010 1 comment Freescale Semiconductor new Xtrinsic family of smart MEMS sensors combine a 32-bit ColdFire microcontroller with on-chip algorithms for all the common operations like tap, touch, tilt and orientation, thereby streamlining designs and offloading the application processor, the company said.
Freescale ARM-based microcontroller Product News 6/22/2010 4 comments Freescale Semiconductor introduced a new ARM-based microcontroller family, Kinetis, expanding its push into consumer and industrial markets with a 32-bit reduced instruction set computer architecture licensed from ARM Holdings.
Class-D amps with AGC, DRC advance portable audio Product News 6/22/2010 Post a comment Two Class-D amplifiers from Texas Instruments featuring automatic gain control and programmable dynamic range compression allow designers to compress the dynamic range of the audio to match the dynamic range of the speaker in portable applications.
Freescale's 64-bit Power core News & Analysis 6/22/2010 2 comments Freescale Semiconductor has designed its first 64-bit Power core and two integrated communications processors using it, likely outrunning Mips-based competitors such as Cavium and NetLogic, but still slightly behind in raw performance Intel's Xeon which is gaining market momentum.
Motorola Droid Design News & Analysis 6/22/2010 Post a comment The smartphone is the platform for embedded computing and the PC is no longer the center of gravity. Designing the Droid helped Motorola address this shift in the marketplace.
SmartFusion tool eases power management design Product News 6/22/2010 Post a comment Actel Corp. has added a power management design kit for its SmartFusion intelligent mixed signal FPGAs which includes a complete reference design with graphical configurator to enter power sequencing and trimming requirements.
Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.