Newport Media gets the ISDB picture in smartphones News & Analysis 6/29/2012 5 comments Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM News & Analysis 6/28/2012 2 comments Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Marvell aims to be China chip leader News & Analysis 6/28/2012 10 comments No, Marvell Technology is not moving to China. However, the U.S. fabless chip company wants to become “the largest semiconductor company in China,” according to a Marvell executive.
Report: Qualcomm wafer fab not ruled out News & Analysis 6/28/2012 30 comments Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
Researchers report solid-state quantum leaps News & Analysis 6/27/2012 5 comments Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Silicon Laboratories Si21x8 TV tuners Product News 6/27/2012 Post a comment Silicon Laboratories launched its fourth generation TV tuner product line, which includes devices that offer greater integration, lower power consumption and the highest tolerance to Wi-Fi and LTE interference.
Wire insulation enables relaxed design rules News & Analysis 6/27/2012 1 comment The semiconductor industry is seeing increasing demand for miniaturization which necessitates changes in chip design, including larger numbers of I/O per unit space, multi-tier devices, and stacked dies that increase wire density.
Maxim pledges $200M boost for U.S. chip making News & Analysis 6/27/2012 2 comments Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
AMD rolls low-power embedded APU News & Analysis 6/27/2012 Post a comment AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
PV gross margins fell 75% in Q1 News & Analysis 6/26/2012 2 comments Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.