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Wolfson wins audio slot in Samsung smartphone
News & Analysis  
6/26/2012   6 comments
Wolfson Microelectronics, a Scottish mixed-signal fabless chip company, has announced that its WM1811 audio hub IC is being used within the Galaxy S III smartphone from Samsung.
TS12001 combines voltage detector/comparator
Product News  
6/26/2012   1 comment
Touchstone Semiconductor announced TS12001 voltage detector combining a 0.58V reference and a resettable latched comparator in a single package.
ST starts sampling STM32 F3 microcontroller range
Product News  
6/26/2012   Post a comment
STMicroelectronics NV (Geneva, Switzerland) has announced it has started delivering samples of its STM32 F3 series of microcontrollers which include a variety of analog peripherals and DSP capability.
Virtual jobs fair offers engineers work in Singapore
News & Analysis  
6/26/2012   21 comments
Engineers with experience in the consumer electronics and semiconductor sectors and who are prepared to continue their careers in Singapore could benefit from the first ever online recruitment event being organized by Contact Singapore.
Dow Corning and Suss cooperate on making 3-D TSV chips
News & Analysis  
6/26/2012   Post a comment
Dow Corning and SUSS MicroTec are collaborating on developing a material and equipment system solution for high volume manufacturing of 3-D TSV packaged devices.
Quantum film firm InVisage appoints Madavi chairman
News & Analysis  
6/26/2012   2 comments
InVisage, a California startup developing a novel form of image sensor, has appointed industry veteran Syrus Madavi as chairman of the board.
Imec, Murata team on reconfigurable radio IC design
News & Analysis  
6/26/2012   1 comment
Next generation wireless access asks for reconfigurable radios. Imec and Murata Manufacturing Co. Ltd. said they have sealed a three-year R&D collaboration to work on cognitive reconfigurable radio front-end.
Slideshow: Scenes from the FTF 2012 Tech Lab
News & Analysis  
6/26/2012   3 comments
Snapshots from the hundreds of cool exhibits at the Freescale Technology Forum 2012 Tech Lab.
Why TI does MCU designs in Shanghai
News & Analysis  
6/26/2012   32 comments
Multinational chip companies who’ve consigned some of their design work to China tend to do so quietly; but a few leading companies are clearly making deeper inroads in China, and they’re not especially shy about it.
Dow Corning, SUSS MicroTec team on TSV chip packaging
News & Analysis  
6/26/2012   Post a comment
Materials vendor Dow Corning and semiconductor manufacturing equipment provider SUSS MicroTec said they would collaborate on a temporary bonding solution for 3-D through-silicon via semiconductor packaging.
ADATA launches two mSATA SSDs
Product News  
6/25/2012   Post a comment
The XPG SX300 and Premier Pro find a home on select motherboards with built-in mSATA sockets.
Fab tool spending to fall 9% in 2012, says Gartner
News & Analysis  
6/25/2012   Post a comment
Worldwide wafer fab equipment spending is on pace to total $33 billion in 2012, a decline of 9 percent from $36.2 billion in 2011, according to market research firm Gartner.
Rambus names Ronald Black CEO
News & Analysis  
6/25/2012   Post a comment
Rambus named Ronald Black, a 20-year veteran of the semiconductor and mobile industries, to the position of CEO, replacing Howard Hughes, who announced earlier this year he would retire.
Renesas seeks $620 million from KKR, says report
News & Analysis  
6/25/2012   13 comments
Struggling Japanese chip company Renesas Electronics Corp. is to seek a 50 billion yen (about $620 million) investment from private equity firm Kohlberg Kravis Roberts & Co., according to a Nikkei report.
Nexus 5001 expands test debug interfaces
News & Analysis  
6/25/2012   Post a comment
The Nexus 5001 Forum has added two new interfaces and ratified IEEE-ISTO 5001-2012 Standard as a global embedded processor debug interface.
Video: '7 minutes of terror' for next Mars probe
News & Analysis  
6/25/2012   58 comments
Curiosity, the Mars rover scheduled to land in August, will rely on a rocket-powered sky crane to slow its velocity from 13,000 mph to zero in seven minutes. A NASA video explains the unprecedented landing sequence.
Sony, Panasonic join hands to print OLED displays
News & Analysis  
6/25/2012   10 comments
Sony and Panasonic have said they will collaborate in the development of organic light emitting diode (OLED) panels and modules for TVs and large-sized displays and, at the same time, consider the oossibility of collaboration in mass production of OLED displays.
Milan startup offers radiation hardened SRAM
Product News  
6/25/2012   3 comments
A radiation hardened 512-kbit SRAM designed by Italian fabless chip startup RedCat Devices srl withstands a 15-Mrad total ionization dose. The chip was manufactured for RedCat by foundry Tower Semiconductor Ltd. in its 180-nm CMOS manufacturing process.
Patent snafus could delay new video codec
News & Analysis  
6/25/2012   10 comments
The upcoming H.265 EVC video codec promises big gains in video compression, but chip makers are afraid to design products using it due to the lack of a patent pool.
Former Movidius executive joins haptic startup as CEO
News & Analysis  
6/25/2012   1 comment
Paul Costigan has become CEO of Senseg, a Finnish startup company that has developed touch interface technology that generates the feeling of virtual buttons on smooth surfaces. The technology has potential in smartphones, tablet computers and many other consumer and industrial applications.
Intel may see $2B growth beyond PCs in 2013
News & Analysis  
6/25/2012   13 comments
Next year, Intel is poised to generate $2 billion in revenues—half its expected revenue growth—from chips outside its traditional x86 PC processors, said an analyst.
Freescale takes shotgun approach to base station SoCS
News & Analysis  
6/22/2012   4 comments
Freescale Semiconductor is casting a wide net in its pursuit of sockets in the nascent market for small cell base stations, according to Scott Aylor, general manager of Freescale's wireless access division.
Look Ma, no network: Group drives LTE Direct
News & Analysis  
6/22/2012   4 comments
More than a dozen companies are supporting a proposed standard called LTE Direct for device-to-device links among Long Term Evolution handsets.
DP5-A: An Altera FPGA video development platform
Product News  
6/22/2012   Post a comment
SingMai Electronics has introduced a range of low cost boards targeted at SD and HD video development.
Spansion's new HMI voice coprocessor
Product News  
6/22/2012   1 comment
Spansion's acoustic coprocessor leverages Nuance's voice technology to improve performance of voice applications.
Small cells still not ready for mobile prime time
News & Analysis  
6/22/2012   9 comments
Engineers still have significant work ahead to deliver small cell base stations to ease heavily loaded mobile data networks, according to talks at a recent mobile event.
GainSpan showcases expanded Wi-Fi connectivity capabilities
Product News  
6/22/2012   Post a comment
While at the Freescale Technology Forum 2012, GainSpan showcased extended capabilities, including serial to Wi-Fi, limited access point, and sensor apps.
Sony to spend $1-billion on CMOS sensor production
News & Analysis  
6/22/2012   8 comments
Sony has announced that it plans to spend about 80 billion yen (about $1 billion) by September 2013 to expand its manufacturing capacity for stacked CMOS image sensors.
SymTA/S supports ECU S/W dev on AURIX automotive MCUs
Product News  
6/22/2012   Post a comment
Infineon and Symtavision extend their partnership for model-based timing design and verification of multicore Engine Control Unit (ECU) software.
Reports: Olympus-Sony partnership
News & Analysis  
6/22/2012   6 comments
Olympus Corp. is negotiating a roughly 50 billion yen investment from Sony Corp. The move, if materialized, will make Sony a partner in Olympus’ efforts to rebuild itself from last year’s accounting scandal.
Freescale, Vivante, Rightware team on automotive display
News & Analysis  
6/22/2012   3 comments
Automotive displays have been getting a lot more dynamic and flexible and long gone are the days of a physical needle twitching in front of circular dial. That trend is set to continue thanks to Rightware, a developer of user interface graphics, Freescale and Vivante. The three companies have joined forces to create an automotive infotainment and instrumentation display platform.
Dial 'M' for MediaTek
News & Analysis  
6/22/2012   12 comments
MediaTek’s bid to buy Mstar is likely to cement the supremacy of the combined power of the two Taiwan-based companies -- often described as the “M brothers” -- in the digital consumer market,
Leti codevelops sun-powered roller shutter
News & Analysis  
6/22/2012   9 comments
Transferring technological value to SMEs is an objective per se for France-based CEA-Leti research center. One illustration is the co-development of a solar-powered roller shutter with France-based Bubendorff SAS.
Reports: MediaTek bids to buy rival MStar
News & Analysis  
6/22/2012   2 comments
Fabless consumer chip company Mediatek Inc. has announced it has offered to buy local Taiwan rival MStar Semiconductor Inc., according to a Reuters report that cited a statement from MediaTek as its source.
Switching to smart lighting
News & Analysis  
6/22/2012   9 comments
Lighting is becoming the largest consumer of electricity in buildings, accounting for 25 percent or more of total costs. At the 14th Leti Annual Review, the CEA-Leti research center demonstrated its engagement in research leading to smart lighting systems with adaptive and controllable properties.
Fab tool book-to-bill slipped in May
News & Analysis  
6/22/2012   Post a comment
The three-month rolling average book-to-bill ratio for North American semiconductor manufacturing equipment declined to 1.05 in May, down from 1.10 in April, according to the fab tool vendor trade group SEMI.
Facebook likes wimpy cores, CPU subscriptions
News & Analysis  
6/21/2012   20 comments
Facebook could be running at least in part on so-called wimpy server CPU cores by the second half of 2013 and long term wants to buy CPUs on a subscription model.
Micron recasts Intel JV, includes emerging memory
News & Analysis  
6/21/2012   4 comments
Micron has announced the reorganized of production arrangements within its IM Flash Technologies joint venture with Intel and the scope has been expanded to include certain emerging memory technologies.
Cypress ups offer for Ramtron
News & Analysis  
6/21/2012   1 comment
Cypress Semiconductor said it commenced a tender off to acquire all outstanding shares of Ramtron International for $2.68 per share, or about $95 million.
How long for China to sort out fabless strategy?
News & Analysis  
6/21/2012   14 comments
With reportedly 450-plus fabless chip companies in China,it’s fair to ask how many more years can they survive in this business.
AVX thin and thick film resistive product series optimized for 4W to 800W
Product News  
6/21/2012   Post a comment
AVX's series of thin- and thick-film resistive products is optimized for maximum power handling and low voltage standing wave ratio (VSWR).
Harwin 2mm pitch connectors offer 3A on all contacts simultaneously, operate from -55 to +125ºC
Product News  
6/21/2012   1 comment
Harwin has added an extra-small bore crimp contact to its Datamate family of high reliability 2mm pitch connectors, designed for use in challenging applications.
Linux base station platform for next generation radio access networks
Product News  
6/21/2012   Post a comment
Enea has launched a Linux Base Station Platform targeting multi-standard Radio Access Networks based on Freescale's next generation multi-core processors.
AMS AS3421 and AS3422, single chip ANC solutions
Product News  
6/21/2012   Post a comment
ams has introduced single-chip ANC solutions with integrated speaker driver ICs, which make it easier for manufacturers of Bluetooth headsets, headphones and earpieces to implement Active Noise Cancellation (ANC).
Broadcom BCM43242 WiFi chip
Product News  
6/21/2012   Post a comment
Broadcom has launched two new WiFi devices to enable a consumer video experience that spans mobile devices, smart TVs and other consumer electronics (CE).
Toshiba Electronics Europe's TLP2355 and TLP2358 photocouplers
Product News  
6/21/2012   1 comment
Toshiba's latest photocouplers will support data rates up to 5Mbps while saving board space and reducing power consumption in industrial designs.
Micron still interested in Elpida despite more losses
News & Analysis  
6/21/2012   7 comments
Micron made a net loss of $320 million on net sales of $2.2 billion in the third quarter of fiscal 2012, which ended May 31 due to continuing softness in the memory markets, the company said.
Report: Renesas closes in on cash for cuts
News & Analysis  
6/21/2012   8 comments
Hitachi and Mitsubishi Electric, two of the three major shareholders in struggling Japanese chip company Renesas Electronics Corp., have agreed in principle to provide a support package worth 50 billion yen (about $630 million), according to a Reuters report that referenced unnamed sources.
Freescale grapples with auto safety mandates
News & Analysis  
6/21/2012   3 comments
While automobile makers worldwide grapple with meeting the safety standards set by the International Standards Organization, Freescale Semiconductor aims to help auto makers meet the emerging safety mandate with a new system basic chip thatworks hand-in-hand with its Power Architecture.
Cellular grapples with spectrum scarcity
News & Analysis  
6/21/2012   3 comments
The industry urgently needs to rally around an effort to find more spectrum and set standards for emerging broadband antennas, said speakers in the overheated mobile data market.
<<   <   Page 2 / 7   >   >>


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Max Maxfield

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Max Maxfield
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I just received a rather interesting email from a member of the EETimes community who prefers to remain anonymous. This message was as follows:

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1 Comment
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