Anadigics enters new wireless net arena, invests in Embedded Wireless News & Analysis 8/30/2000 Post a comment Warren, N.J. -- Anadigics Inc. here entered the emerging personal area networking market, announcing that it has made an undisclosed equity investment in Embedded Wireless Devices Inc. of Pleasanton, Calif. Anadigics and Embedded Wireless plan to co-develop a range of chips, based on several new-but-incompatible 2.4-GHz wireless standards, such as Bluetooth, 802.11, and others.
High demand means 'open season' for designers News & Analysis 8/30/2000 Post a comment High demand has bumped salaries up handsomely for design engineers. With five to 10 years of experience, one can easily command $80,000 in most parts of the country, and well more in hotbeds like Silicon Valley, Austin and Boston.
TSMC foundry capacity sold out for 2000 and 2001 News & Analysis 8/30/2000 Post a comment Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) disclosed Tuesday (Aug. 29) that it is already sold out of its worldwide wafer-foundry capacity for both 2000 and 2001, and expects demand to remain robust at least until 2003.
Terawave details its passive optical network system
News & Analysis 8/30/2000 Post a comment Terawave Communications Inc., a supplier of passive optical networking equipment, gave an expanded description of its ASICs at the National Fiber Optics Engineers Conference this week, and demonstrated a unified software suite called PON Navigator that integrates an element-management system and a planning tool for working with passive optical networks (PONs).
Corning increases efforts in glass for EUV lithography News & Analysis 8/30/2000 Post a comment CORNING, N.Y.--Corning Inc. today said it was increasing its emphasis on ultra-low expansion glass for next-generation lithography applications. The company believes its ULE glass substrate material will enable extreme ultraviolet (EUV) technology to become a viable replacement for optical lithography in wafer fabs.
Intel accuses Broadcom of building business on its patents News & Analysis 8/30/2000 Post a comment SANTA CLARA, Calif. -- Intel Corp. today expanded its legal assault against Broadcom Corp., charging the Irvine, Calif.-based company with patent infringement and misappropriation of trade secrets. The suit, filed in the U.S. District Court of Delaware, also alleges that Broadcom is involved in a "carefully crafted plan" to base its business around Intel's communications-chip technology.
Gel-Pak to acquire supplier of prototype plastic packages News & Analysis 8/30/2000 Post a comment SUNNYVALE, Calif.--Gel-Pak LCC today announced plans to acquire Silicon Packaging Technology Inc., a San Diego supplier of prototype plastic packages for integrated circuits. The acquired company will be renamed Quik-Pak and will continue to offer plastic packages for new IC designs that have the same mechanical and electrical performance as chips housed in production packages, Gel-Pak said.
Sony to build 300-mm wafer fab for LCDs, CCDs News & Analysis 8/30/2000 Post a comment In another sign that Japanese electronics companies are loosening their purse strings for capital expenditures, Sony Corp. said it will spend about $943 million to build its first 300-mm wafer fabrication facility.
Alliance to invest $75M in planned Tower fab News & Analysis 8/30/2000 Post a comment Alliance Semiconductor Corp. today announced it will invest $75 million in an 8-inch wafer fab that silicon foundry Tower Semiconductor Ltd. plans to build. Alliance (Santa Clara, Calif.) joins SanDisk Corp. as an investment partner in the fab, which will be Tower's second.
Alliance to invest $75 million in Tower's new foundry fab in Israel News & Analysis 8/30/2000 Post a comment MIGDAL HAEMEK, Israel -- U.S. memory supplier Alliance Semiconductor Corp. today announced it will invest $75 million in a planned 8-inch wafer fab planned by silicon foundry supplier Tower Semiconductor Ltd. here. Alliance, based in Santa Clara, Calif., joins SanDisk Corp. in nearby Sunnyvale as investment partners in Tower's planned second fab. Tower expects to start construction on the long-planned fab this year after securing government funding.
Dense-Pac applies chip-stacking packaging to DSPs News & Analysis 8/30/2000 Post a comment GARDEN GROVE, Calif.--Dense-Pac Microsystems Inc. here today introduced a new three-dimensional chip packaging technology for digital signal processors--enabling up to four DSP chips to be stacked on top of each other in a single package.
AMD aims 32-Mbit simultaneous read/write flash at portable systems News & Analysis 8/30/2000 Post a comment SUNNYVALE, Calif.--Advanced Micro Devices Inc. today launched a new 32-megabit flash memory chip, which combines low-voltage technology with a simultaneous read/write architecture for portable systems applications. The 1.8-volt flash is capable of read-access times as fast as 110 nanoseconds with up to 60% less power consumption, compared to 3-V devices, said AMD.
inSilicon licenses Arm's system-on-chip peripherals News & Analysis 8/29/2000 Post a comment SAN JOSE -- inSilicon Corp. today announced it has licensed Arm Ltd.'s MicroPack design kit and PrimeCell peripherals for use in system-on-chip (SoC) development. The San Jose company plans to offer Arm's peripheral functions in sub-licensing agreements with customers, who are designing SoC chips using inSilicon's communications intellectual property.
Philips aims analog frontend ICs at range of CCD camera segments News & Analysis 8/29/2000 Post a comment EINDHOVEN, the Netherlands -- Philips Semiconductors today announced a new family of analog frontend (AFE) chips that provide 10- and 12-bit resolution for digital still cameras and camcorders. The new integrated analog chips are aimed at a range of professional and consumer camera market segments, supporting charge-couple device (CCD) applications with speeds of 18-to-40 million samples per second (MSPS).