Memscap completes sale of its industrial site to Soitec News & Analysis 8/1/2006 Post a comment Looking to annul its financial debts, French MEMS (micro-electro-mechanical systems) specialist Memscap SA, concluded early July a sale agreement of its Bernin manufacturing site, near Grenoble (France), with Soitec SA, producer and supplier of Silicon-on-Insulator wafers. The two companies have now signed the official sale of property act.
Epcos profitiert von hohem Auftragseingang News & Analysis 8/1/2006 Post a comment Steigerungen bei Gewinn, Umsatz und Auftragseingang meldet der Komponentenhersteller Epcos für sein abgelaufenes drittes Quartal. Der Umsatz kletterte im Jahresvergleich um 15 Prozent auf 330 Millionen Euro, der Verlust des Vergleichsquartals 2005 verwandelte sich in einen Gewinn von 13,9 Millionen Euro.
Grenoble se fait l'hôte de la conférence EMLC News & Analysis 8/1/2006 Post a comment Pour la première fois en 2007, la conférence EMLC (European Mask and Lithography Conference) quittera le sol allemand pour s’installer au Centre de Conférence Minatec de Grenoble. Dédiée aux ingénieurs, chercheurs et scientifiques dans les domaines de la photolithographie et des photomasques, la conférence traitera des technologies associées telles que la métrologie, l’inspection, l’OPC et la photorésistance.
Epcos reports a high order intake News & Analysis 8/1/2006 Post a comment Passive-component vendor Epcos reports good Q3 results. Sales grew 15 percent year-over-year to €330 million (about $420 million). Net swung from a loss in last year's third quarter to a profit of €13.9 million.
Best Practices in Facilities and Design News & Analysis 8/1/2006 Post a comment We mined ICMI's Queue Tips for some best practices in facilities design and found some great advice. The questions come from real call center practitioners with genuine problems; answers come from peers and expert consultants.
Brochure features automotive multimedia interconnects News & Analysis 8/1/2006 Post a comment A product brochure specifically focused on the automotive info- and entertainment market is available from FCI. Highlighting major product families and typical applications, the brochure provides an overview of the supplier’s full range of interconnect products:
10-Gbits/s dual clock data recovery PHY aimed at short-reach XFP apps Product News 8/1/2006 Post a comment AMCC has developed the S19256 dual clock data recovery PHY chip for use in short-reach and intermediate reach XFP modules. The S19256 is approximately 30% lower in cost than its sister device, the S19233, which is tailored for long-haul applications. It is also designed with a built-in equalizer to mitigate data-dependent jitter generated during the transmission of signals in FR-4 material.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.