HiSilicon extends ARM licenses for 3G/4G comms News & Analysis 8/2/2011 2 comments HiSilicon Technologies Co. Ltd. has licensed a range of ARM technology for use across the breadth of its communications chip design activities including: 3G/4G basestations, networking infrastructure and mobile computing applications.
Dongbu aids Chinese image sensor entry News & Analysis 8/2/2011 3 comments Foundry Dongbu HiTek Co. Ltd. has announced it has begun volume production of high dynamic range CMOS image sensor chips for BYD Microelectronics, a subsidiary of BYD Co. Ltd., a Chinese manufacturer of products ranging from batteries to electric vehicles.
RF chip vendor files for $230 million IPO News & Analysis 8/1/2011 3 comments Chip and component vendor M/A-COM Technology Solutions said it filed an S-1 with the U.S. Securities and Exchange Commission for a proposed initial public offering of common stock.
Analyst: Apple had 57% of Q2 handset profits News & Analysis 8/1/2011 6 comments Despite holding only 5.4 percent share of the global handset market, Apple was responsible for a whopping 57 percent of all cellular handset operating profits in the second quarter, up from 51 percent in the first quarter and 41 percent in 2010, according to an analyst at Canaccord Genuity.
Nanocircuits that adhere to any substrate News & Analysis 8/1/2011 6 comments Researchers at Stanford University recently demonstrated a novel wafer-scale lift-off process for fabricating nanowire-based circuits on reusable silicon wafers, then transferring them to any substrate in any shape.
Nujira opens IC design center in Edinburgh News & Analysis 8/1/2011 1 comment Nujira Ltd., a provider of "envelope-tracking" technology as a power saver in cellular telephone power amplifiers, has announced it has been awarded £175,000 (about $290,000) funding from Scottish Development International to open an IC design center in Edinburgh, Scotland.
Key exec, EDA 360 author, leaving Cadence News & Analysis 8/1/2011 7 comments The sudden departure of Cadence Design Systems' chief marketing officer was hastened by a reorganization of marketing functions within the company that a longtime analyst believes could signal a coming change in CEO at the EDA vendor.
Global Q2 chip sales confirm falling market News & Analysis 8/1/2011 4 comments Global chip sales in the second quarter were down 2 percent compared to equivalent figure in the previous quarter and down 0.5 percent from the second quarter in 2010, according to the Semiconductor Industry Association.
MimoOn LTE software ported to TI chips Product News 8/1/2011 Post a comment MimoOn GmbH (Duisburg, Germany), a developer of software-defined radio technology, has said it has implemented LTE PHY software on KeyStone chips from Texas Instruments Inc. for small cell basestations.
Indian chip market to grow 15% in 2011 News & Analysis 8/1/2011 2 comments The 2011 Indian semiconductor market is going to be worth $8.2 billion, up 15.5 percent compared to $7.1 billion in 2010, according to an EE Herald report that references market research company Gartner as its source.
Tower makes Ramon rad-hard processor News & Analysis 8/1/2011 Post a comment Tower Semiconductor Ltd., a specialty foundry that trades as TowerJazz, and Ramon Chips Ltd., a fabless company that specializes in space applications, have announced they have completed a second generation of radiation-hardened processors.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.