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Content posted in September 2002
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LSI Logic takes crack at handsets
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9/30/2002   Post a comment
IQE agrees to pay Rockwell over MOCVD lawsuit
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9/30/2002   Post a comment
CARDIFF, Wales -- IQE plc, a supplier of wafers to chip makers, and Rockwell Automation Inc. have settled their disputes relating to metal-organic chemical vapor deposition (MOCVD) process patents held by Rockwell Automation, which were part of a licensing agreement between the companies, from October 1991 to January 2000, IQE has said. The settlement agreement includes a cash payment by Cardiff-based IQE and the issue of 300,000 shares of IQE shares to Rockwell Automation.
Intel draws the threads of parallelism for chips
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9/30/2002   Post a comment
Intel is looking to make its processor designs more modular. This will prevent them from drawing too much power when running on batteries, without resorting to brute-force power-saving methods such as voltage or clock speed scaling.
Xenpak successors in search for truce
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9/30/2002   Post a comment
Companies backing the competing Xpak and X2 optical module formats for 10Gbit/s networking are looking for a truce to simplify the process of deciding which standard will succeed Xenpak.
ESS Technology files suit against Taiwan's MediaTek
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9/30/2002   Post a comment
TAIPEI, Taiwan -- ESS Technology, Inc. has filed a lawsuit alleging that Taiwanese optical chip designer MediaTek Inc., has infringed copyright of DVD firmware used within ESS' Swan and Vibratto chips.
European Commission clears StarCore DSP joint venture
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9/30/2002   Post a comment
BRUSSELS, Belgium --- The European Commission, the administrative arm of the 15-nation Europrean Union, has given its permission for the formation of a proposed joint venture company, StarCore LLC, between Agere, Infineon and Motorola. StarCore is being set up to develop and license digital signal processing architecture and cores on behalf of the three companies.
Chip sales continue to rise, strength is AsiaPac, says EECA
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9/30/2002   Post a comment
Semiconductor sales in August stood at $ 11.927 billion, a 14.2% increase above the same month a year ago and up 2.2% on a monthly sequential basis, according to the European Electronic Component Manufacturers Association (EECA) reporting figures from the World Semiconductor Trade Statistics (WSTS) organization. However, the year-to-date figure is still 7.5% below where it was at this time in 2001, EECA reports.
Pace presses on with its twin scart
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9/30/2002   Post a comment
Pace Micro Technologies has unveiled the latest addition to its range of digital terrestrial TV (DTT) set-top boxes. The £350 Twin Digital TV Recorder includes a 20Gbyte hard drive for personal video recorder (PVR) functions and two decoders with individual scart outputs.
Germany closes Neuer Markt
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9/30/2002   Post a comment
Germany's answer to Nasdaq, the Neuer Markt, is to be closed, and shares listed on it will move by the end of 2003 in a shakeup at the Frankfurt Stock Exchange.
Livingston targets metropolitan area network equipment
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9/30/2002   Post a comment
Electronic equipment rental company Livingston has invested heavily in metropolitan area network (man) equipment in preparation for what the company thinks will be a relative boom in the market compared with other parts of the comms sector.
Doubts grow over DTT's second chance
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9/30/2002   Post a comment
The future of UK digital terrestrial TV (DTT) is once again in disarray, according to industry insiders, as concerns mount that the platform's potential is being wasted and that its relaunch could be postponed.
Heard on the Beat
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9/30/2002   Post a comment
Reconfiguring chip design
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9/27/2002   Post a comment
Hifn cuts 25 jobs, lowers forecast in Q3
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9/27/2002   Post a comment
Security-chip maker Hifn Inc. here today reduced its workforce by 25 jobs and lowered its forecast. The company also said it acquired certain assets and intellectual property from an undisclosed private company with operations in Framingham, Mass. and Research Triangle Park, N.C. Hifn has retained that company's Storage Business Unit design team and established a Hifn East Coast Design Center in Framingham.
Distributed objects framework aids remote device management
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9/27/2002   Post a comment
The EMIT for Distributed Objects Framework is a collection of EMIT software and services that supports remote device management.
High-definition display uses white OLED, color filters
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9/27/2002   Post a comment
Eastman Kodak Co. and Sanyo Electric Co. Ltd. have developed an organic light emitting diode (OLED) display that employs a white organic electroluminescent material and color filters that may be applied to large, high-definition displays. Sanyo will demonstrate a 14.7-inch prototype of the display at the CEATEC Japan 2002 conference which begins Tuesday (Oct. 1) in Makuhari, Japan.
Tripath to cut workforce, lowers forecast
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9/27/2002   Post a comment
SANTA CLARA, Calif.--Chip maker Tripath Technology Inc. here today announced that it has reduced its workforce and lowered its forecast. The company now expects revenues for the third quarter to be between $2.5-to-$3.0 million, down from its earlier estimate of $6.5 million.
OpenAccess API could link design, manufacturing
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9/27/2002   Post a comment
A powerful coalition of chip makers, mask makers, equipment providers and EDA vendors will gather in Monterey, Calif. on Monday (Sept. 30) to call for a single design-through-manufacturing data model based on the OpenAccess application programming interface.
Silicon retina enables electronic vision
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9/27/2002   Post a comment
A silicon retina that approximates electronic vision was described by researchers at the 15th IEEE International ASIC/SoC Conference here.
Mysticom sets watermark for 10-Gbit Ethernet over copper
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9/27/2002   Post a comment
Mysticom Inc. demonstrated a transceiver that set a new watermark for high-end Ethernet signaling over copper wires at the Communications Design Conference this week, sending 10-Gbit/second signals over 25 meter copper using Infiniband cables, and over 10 meters using Category 5 unshielded twisted pair.
Agilent, Teradyne decide to not exhibit at ITC
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9/27/2002   Post a comment
In a sign of the times for the slumping IC industry, several major chip-testing vendors have pulled out of the world's premier conference in the automatic test equipment (ATE) industry.
Kemet loses tantalum dispute with Cabot
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9/27/2002   Post a comment
Capacitor supplier Kemet Corp., Greenville, S.C., lost its court case against Cabot Corp., the Boston-based tantalum powder supplier who filed suit against Kemet in April for not honoring the terms of its long-term tantalum supply agreement negotiated several years ago during the component shortages.
AT&T exec says 3G nets cost less than 802.11 WLANs
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9/27/2002   Post a comment
Despite the industry slowdown and an unprecedented combination of new technologies, 3G cellular still holds great promise and will deliver wireless data more be a more cost-effectively than 802.11 wireless LANs, said Umesh Amin, director of new technologies and planning for AT&T Wireless, in a keynote speech at the Communications Design Conference here Wednesday (Sept. 25).
ASML expects lower litho shipments in 1H '03, says reports
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9/27/2002   Post a comment
ASML Holding N.V. here today said that its lithography-tool shipments in the first half of next year will be lower than in the second half of 2002, according to a report from the Dow Jones news service.
Consumer apps sparking 8-bit MCUs
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9/27/2002   Post a comment
Agere feels time is right
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9/27/2002   Post a comment
PACT, QuickLogic join forces on processor cores
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9/27/2002   Post a comment
The ability in software to instantly change a hardware configuration-from Bluetooth to Wi-Fi, for instance-came closer to being realized this week when PACT XPP Technologies Inc. and QuickLogic Corp. formally agreed to combine their technologies.
Rumors swirl throughout
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9/27/2002   Post a comment
Passives vendors diversify to avert commodity status
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9/27/2002   Post a comment
Fixed on capturing a larger share of key end markets and padding sagging profit margins, several passives suppliers are pouring more R&D dollars into developing integrated devices that some say will be priced too high to compete with discrete components.
The next boom will be a hummer
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9/27/2002   Post a comment
Firms warned to brace for environmental fallout
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9/27/2002   Post a comment
As more green laws are enacted across the globe, environmental experts are urging supply chain and procurement managers to learn how legislation will affect their day-to-day and strategic responsibilities. Besides the lead-free initiatives under way in Europe and Japan, legislative bodies in the United States and abroad are crafting regulations that deal with recycling, product take-back, design for the environment, and other hazardous-substance restrictions that in most cases will hold the OE
Russia's chip industry faces long climb
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9/27/2002   Post a comment
Despite its position as one the world's highest-growth regions in terms of gross domestic product, Russia has made scant headway in semiconductors, an analyst told the 10th annual SEMI ExpoCIS 2002.
Chip makers mull SOI for RF, other mainstream apps
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9/27/2002   Post a comment
Silicon-on-insulator technology has gained a toehold in the semiconductor industry, as microprocessor vendors — first IBM and Motorola, and this year AMD — tap into SOI for performance gains. The question now is whether this nascent process technology will make the leap into ASICs and systems-on-chip, to RF and power devices, even to silicon-on-glass displays integrated with on-panel logic.
Ziatech sale puts CompactPCI under the scope
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9/27/2002   Post a comment
Intel Corp.'s impending sale of its Ziatech unit for less than one-fiftieth of the unit's purchase price has sent jaws dropping as industry players and analysts divine whether the move signals a telecom migration away from the CompactPCI platform Ziatech pioneered.
Ad Index
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9/27/2002   Post a comment
AMD to roll out new processors on October 1
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9/27/2002   Post a comment
Advanced Micro Devices is slated to unveil its 2700+ and 2800+ top-of-the-line Athlon XP processors on Oct. 1 to combat archrival Intel Corp.'s 2.8-GHz Pentium 4.
Graphics standard for DDR-II expected
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9/27/2002   Post a comment
The JEDEC Solid State Technology Association, as expected, is formally working to adopt a DDR-II "look alike" standard for frame buffer memory of graphics cards.
Two-stage WLAN PA
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9/27/2002   Post a comment
The LX5503E two-stage power amplifier covers the 4.8- to 5.85-GHz band, making it a nice solution for emerging 5-GHz wireless LAN (WLAN) designs.
PICMG 2.16-compliant GigE switch
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9/27/2002   Post a comment
Sabre 2000 is a 6U CompactPCI switch fabric board aimed at PICMG 2.16-complant backplane designs.
China foundry ASMC to ramp up 8-in. fab by mid-2003
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9/27/2002   Post a comment
China's Advanced Semiconductor Manufacturing Corp. (ASMC) disclosed it will move the chip equipment into its new and initial 8-inch wafer fab in March of 2003, with plans to enter into IC production as early as next summer.
Sharp display shows 3-D images
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9/27/2002   Post a comment
Sharp Corp. has developed an LCD that can display images in 3-D, and is forming an industry consortium to promote the inclusion of 3-D effects in videogames, PDAs, TVs and other applications.
SoCs optimized for power yield better performance
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9/27/2002   Post a comment
Academic researchers suggested novel strategies for system-level power reduction in presentations at the 15th IEEE International ASIC/SoC Conference here this week, which showed that optimizing a system-on-chip (SoC) design for energy is starting to resemble optimizing for performance.
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