Celeritek quits handset amplifier business News & Analysis 9/30/2003 Post a comment Celeritek Inc (Santa Clara, Calif.) is pulling out of the increasingly competitive handset power amplifier business to focus on standard GaAs semiconductors for the communications and defence markets and GaAs subsystems targeting military applications.
Agere crée un centre de développement 3G en Australie News & Analysis 9/30/2003 Post a comment Agere Systems est occupé à établir un centre de conception en Australie destiné au développement de la technologie sans fil de prochaine génération. Les premiers projets concerneront des jeux de composants et des logiciels intégrés pour les téléphones portables 3G bimode.
Proper Layout and Component Selection Controls EMI News & Analysis 9/30/2003 Post a comment Understanding the physics of voltage-regulator topologies is important when designing power systems for EMI and EMC compliance. In particular, the physical principles behind switching regulators (buck, boost, flyback, and SEPIC topologies) guide component choice, magnetics design, and PC board layout. Parasitic elements such as leakage inductance, ESR, and ESL are significant when optimizing circuit performance.
Garmin GPSMap 76S: Sensory overload Teardown 9/29/2003 Post a comment Besides a GPS longitude-latitude position indicator, the GPSMAP from Garmin is an altimeter electronic compass. It has specialized magnetic sensors, and a variety of ICs from suppliers like Cirrus Logic, Fairchild, Linear Technology, and Maxim. David Carey opens the case to show what's inside.
National studies low-power WiFi for handsets News & Analysis 9/29/2003 Post a comment Researchers at National Semiconductor are studying the feasibility of a low-power version of 802.11 that would be suitable for cellphones and PDAs. The company is not sure whether it will field such products, but executives at an informal roundtable discussion here said the need is real.
Solving the equations for a merger News & Analysis 9/29/2003 Post a comment Employing his mathematics background, Duane Zitzner has led the effort to smoothly integrate Compaq into Hewlett-Packard's supply chain. Crista Souza has this exclusive.
Sun sets plan for IC design at India center News & Analysis 9/29/2003 Post a comment Sun Microsystems Inc. (San Jose, Calif.) plans to expand the small team working at its India Engineering Center (IEC) here to take on full chip designs eventually. At present, the 10-member team is assigned to Sun's processor group, working on validation technologies, including those for the Niagara processor slated for launch in 2005.
Digital car radio poised to show up in 2005 models News & Analysis 9/29/2003 Post a comment The move toward CD-quality car radios is gaining momentum with Kenwood Corp.'s delivery of the first HD Radio tuner and Philips Semiconductors' announcement that it is ready to roll out a new chip that could help cut the cost of entry into the fledgling market. Chuck Murray has this scoop.
China bashing News & Analysis 9/29/2003 Post a comment The China bashers have been out in force, with both U.S. political parties accusing the Chinese of everything from currency manipulation to the theft of U.S. jobs.
NEC crafts speedy nanotube transistors News & Analysis 9/29/2003 Post a comment NEC Corp. engineers say they have developed a "stable" technology for the fabrication of carbon nanotube transistors with 10 times greater transconductance than silicon MOS transistors.
Tool models substrate noise on SoCs News & Analysis 9/29/2003 Post a comment The Interuniversity Micrelectronics Center (IMEC; Leuven, Belgium) has developed a tool that models and analyzes substrate noise generated in deep-submicron CMOS technologies.
FSA, VSIA form quality IP team News & Analysis 9/29/2003 Post a comment In an indication of the growing importance of reusable intellectual property to fabless chip makers, the Fabless Semiconductor Association (FSA) and the Virtual Socket Interface Alliance (VSIA) announced last week that they have agreed to pool resources to develop and roll out a quality metric for IP cores.
Motorola SPS may be headed for a spinoff News & Analysis 9/29/2003 Post a comment The resignation last week of Christopher B. Galvin as chief executive of Motorola Inc. makes a spinoff of the company's Semiconductor Products Sector more likely, according to a number of analysts.<
Jaco's sales improve in fiscal 2003 News & Analysis 9/29/2003 Post a comment Jaco Electronics Inc. today reported that sales for fiscal 2003, ended June 30, reached $217.9 million, up from $194.1 million in the prior year. The distributor's net loss declined to $2.9 million, or 52 cents per diluted share, compared with a net loss last year of $5 million, or 88 cents per diluted share.
Samsung, Toshiba merge optical disk operations News & Analysis 9/29/2003 Post a comment By agreeing last week to combine their optical disk businesses into a joint venture, Korea's Samsung Electronics Co. Ltd. and Japan's Toshiba Corp. hope to cut their operating costs and maintain a competitive edge in a market saddled with severe pricing pressures.
Bookham plays a doubleheader News & Analysis 9/29/2003 Post a comment Bookham Technology plc last week improved its chances of surviving the optical telecommunications market's downturn. The British company made two acquisitions that are expected to expand its product lines, add a low-cost manufacturing plant, and better its cash balance.
Tools to warn of variations in copper thickness News & Analysis 9/29/2003 Post a comment Seeking to head off a looming problem for sub-100-nanometer ICs, startup Praesagus Inc. is preparing a suite of tools that will provide manufacturing data to help designers predict thickness variations in copper interconnect.
Good-bye to the bar codes? News & Analysis 9/29/2003 Post a comment Soon the consumer may not notice that an extra silicon chip has entered his life, as part of the new product-tracking system called radio frequency identification.
Multimedia phone deal News & Analysis 9/29/2003 Post a comment Wireless communications design group TTPCom (Cambridge, England) has teamed with Emblaze Semiconductor (Ra'anana, Israel) to develop reference designs for full-featured multimedia mobile phones.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.