AMS Acquires Sensor Company News & Analysis 12/8/2014 3 comments Analog chipmaker ams now will acquire acam-messelectronic, a vendor of highly accurate time-based measurement technology and related sensor solutions.
Ethernet for Drive-by-Wire? News & Analysis 12/8/2014 22 comments Ethernet is gaining momentum as an in-vehicle network. But beyond being the A/V network for in-vehicle infotainment systems, what’s the potential impact of Ethernet on the whole car? Opinions vary.
Hot Technologies: Looking Ahead to 2015 News & Analysis 12/3/2014 3 comments EDN and EE Times explore some of the hot technologies in 2014 that will shape technology trends for next year and beyond as engineers bring even more innovative ideas to reality.
Startup Tackles Color Blindness News & Analysis 12/3/2014 1 comment Eyeteq, an image fusion technology, can now be added to set-top boxes to improve 3D TV image viewing for people with color blindness.
Megachips to Launch DSP-Based Sensor Fusion IC News & Analysis 11/25/2014 2 comments The growing sensor-fusion controller market for smartphones and wearable devices is about to meet a new competitor – this time from Japan. Megachips is rolling out a motion engine and sensor hub chip, dubbed Frizz.
Megachips: Japan's Best Kept Secret News & Analysis 11/21/2014 22 comments In a recent interview with EE Times, Megachips’ president and CEO Akira Takata laid out a plan to commit the company’s future growth, not on ASICs for the domestic market, but ASSPs for the global market.
Automotive Industry Drives Chip Demand News & Analysis 11/20/2014 9 comments Among all major end use-applications for integrated circuits, the automotive market exposes the strongest growth, finds market researcher IC Insight in a study to be released later this month.
Jaguar Land Rover Tours Its Cars News & Analysis 11/19/2014 36 comments Jaguar Land Rover detailed the complexity of electronics in its latest cars and gave a look at its ideas for features coming in the future in a keynote.
Spansion’s Foray Into e.MMC Market News & Analysis 11/11/2014 Post a comment Spansion has rolled out a family of “industrial-grade” embedded MultiMediaCard memory products by using its high-density MLC NAND flash. The company is playing catchup with Micron and Toshiba.
TSMC Predicts Next Big Thing News & Analysis 11/10/2014 5 comments With MEMS and CMOS on same chip, sourced from a single well-oiled supply chain offering dirt-cheap prices, innovators will create the "next big thing." One-stop shopping at a semiconductor manufacturer is the future, says TSMC.
3D Prints World's Best Inverter News & Analysis 10/29/2014 15 comments Oak Ridge National Laboratory wants to become the world leader in operational 3D device printing and has already started its patent portfolio.
Freescale CEO: 'IoT Isn't Just Buzz' News & Analysis 10/29/2014 13 comments Two factors rejuvenating Freescale are the "explosion of connected devices" and "cars so aware of their surroundings that they can't get into accidents," says its CEO.
Some Memories Never Die News & Analysis 10/28/2014 16 comments When a major memory producer decides a product has hit end of life, there are often customers who still have long-term use for it and there are companies willing to step up to keep those memories alive.
Canceling Noise When Rubber Meets Road News & Analysis 10/24/2014 19 comments An infotainment system vendor has applied noise cancellation technology, known mostly from headphones, to car interiors. The system, jointly developed with Lotus Engineering, minimizes noise generated when the rubber meets the road.
TI’s Rosy Outlook Defies Microchip's Gloom News & Analysis 10/21/2014 6 comments TI reported third-quarter results above expectations, indicating no industry corrections in sight. The solid results came 10 days after Microchip made a downward revision in its revenue forecast.
TI Beefs Up Driver Assist, Digital Cockpit News & Analysis 10/21/2014 9 comments Car OEMs’ growing desire to meet or exceed higher NCAP ratings is driving chip suppliers to develop more sophisticated ADAS SoCs. TI is rolling out two types of solutions: “safety critical” and “informational” ADAS processors.
First 2D Atomic Piezoelectric Discovered News & Analysis 10/20/2014 6 comments The world's first 2D monolayer material has been shown to be piezoelectric, enabling a new era of super-sensitive sensors, and when stacked, a new power source for wearables and IoT.
TSMC Capex to Exceed $10B in FinFET Ramp-Up News & Analysis 10/16/2014 6 comments Taiwan Semiconductor said Thursday that it aims to increase its capital expenditures next year to more than US$10 billion as it accelerates its ramp-up to commercial production of 16 nm FinFET chips.
IC Industry Slowdown: True or False? News & Analysis 10/15/2014 10 comments Did Microchip Technology get ahead of itself by suggesting that its downward revenue forecast was a negative bellwether for the whole semiconductor market? Or is there a macro-economic weakness that bodes ill for the chip industry?
In $2.5B Deal, Qualcomm & CSR Mesh News & Analysis 10/15/2014 15 comments Qualcomm Inc., the world's largest cellphone chip vendor, has agreed to buy CSR for $2.5 billion to strengthen its presence in the Internet of Things market.