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Megachips: Japan's Best Kept Secret
News & Analysis  
11/21/2014   4 comments
In a recent interview with EE Times, Megachips’ president and CEO Akira Takata laid out a plan to commit the company’s future growth, not on ASICs for the domestic market, but ASSPs for the global market.
Automotive Industry Drives Chip Demand
News & Analysis  
11/20/2014   7 comments
Among all major end use-applications for integrated circuits, the automotive market exposes the strongest growth, finds market researcher IC Insight in a study to be released later this month.
Jaguar Land Rover Tours Its Cars
News & Analysis  
11/19/2014   25 comments
Jaguar Land Rover detailed the complexity of electronics in its latest cars and gave a look at its ideas for features coming in the future in a keynote.
Low-Cost MCUs Cover Audio to Industrial
News & Analysis  
11/18/2014   17 comments
Microchip's new PIC32 series provides a rich feature set to cover a wide range of applications.
Infotainment Systems Drive Automotive SSD Adoption
News & Analysis  
11/18/2014   1 comment
In-vehicle entertainment and navigation systems are becoming more mainstream and sophisticated, so data storage demands must keep up, not just with capacity, but with reliability and endurance as well.
Flexible OLEDs Clear Last Hurdle
News & Analysis  
11/18/2014   2 comments
Kateeva Inc. claims to solve last remaining hurdle to flexible, bendable, rollable OLED displays: keep moisture and oxygen away.
Renesas Shifts Automotive Center of Gravity to Europe
News & Analysis  
11/14/2014   Post a comment
Europe gets automotive, US gets industrial: Chipmaker Renesas will open its Global ADAS Solution Group in Düsseldorf, Germany.
Auto-Grade Photovoltaic MOSFET Driver Debuts at Electronica
News & Analysis  
11/11/2014   Post a comment
Avago launches a photovoltaic MOSFET driver qualified to AEC-Q100 Grade 1 test guidelines, making it the first such device usable in "under-the-hood" high-temperature automotive applications.
New FPGA-based USB 3.0 SuperSpeed Device Controller From SLS
News & Analysis  
11/11/2014   1 comment
By taking advantage of the FPGA's integrated transceivers, this new USB 3.0 SuperSpeed Device Controller IP from System Level Solutions removes the need for an external USB PHY chip.
Spansion’s Foray Into e.MMC Market
News & Analysis  
11/11/2014   Post a comment
Spansion has rolled out a family of “industrial-grade” embedded MultiMediaCard memory products by using its high-density MLC NAND flash. The company is playing catchup with Micron and Toshiba.
CogniVue, Fraunhofer Debut Supersmall Camera at Electronica
News & Analysis  
11/11/2014   3 comments
Fraunhofer's driver-assist microcamera, exhibited this week at Electronica in Munich, uses CogniVue's image processing technology and a Freescale Semiconductor image cognition processor based on CogniVue's IP.
Vehicle-to-X Tech: 1,300km Drive Starts at Electronica
News & Analysis  
11/10/2014   Post a comment
A large practical test of the Vehicle-to-X (V2X) communication technology in the form of a European road trip starts on Nov. 11 from electronica conference in Europe.
TSMC Predicts Next Big Thing
News & Analysis  
11/10/2014   5 comments
With MEMS and CMOS on same chip, sourced from a single well-oiled supply chain offering dirt-cheap prices, innovators will create the "next big thing." One-stop shopping at a semiconductor manufacturer is the future, says TSMC.
TI to Open 300mm Wafer Bumping Facility in Chengdu
News & Analysis  
11/6/2014   2 comments
TI will open a 300mm wafer bumping facility in Chengdu, China. The company described the move as the third leg of a “long-term China strategy,” unveiled in 2010, to establish production facilities in China.
Japan's MegaChips to Buy MEMS Timing Leader SiTime
News & Analysis  
10/29/2014   4 comments
MegaChips, Japan's fast-growing fabless, will buy SiTime Corp. for $200 million in cash to leverage SiTime's MEMS timing devices to enhance its own SoCs and ASSPs for wearable and mobile devices.
3D Prints World's Best Inverter
News & Analysis  
10/29/2014   14 comments
Oak Ridge National Laboratory wants to become the world leader in operational 3D device printing and has already started its patent portfolio.
Freescale CEO: 'IoT Isn't Just Buzz'
News & Analysis  
10/29/2014   13 comments
Two factors rejuvenating Freescale are the "explosion of connected devices" and "cars so aware of their surroundings that they can't get into accidents," says its CEO.
Lattice & Forza Announce Fully Reconfigurable Image Sensor
News & Analysis  
10/29/2014   6 comments
Smart sensors open a wealth of application possibilities in automobiles, homes, and factories, to name but a few -- anywhere sensors are to be found, in fact.
Some Memories Never Die
News & Analysis  
10/28/2014   16 comments
When a major memory producer decides a product has hit end of life, there are often customers who still have long-term use for it and there are companies willing to step up to keep those memories alive.
Canceling Noise When Rubber Meets Road
News & Analysis  
10/24/2014   19 comments
An infotainment system vendor has applied noise cancellation technology, known mostly from headphones, to car interiors. The system, jointly developed with Lotus Engineering, minimizes noise generated when the rubber meets the road.
Murata Cheerleaders Show Off Sensor & Swarm Smarts
News & Analysis  
10/23/2014   2 comments
The Murata cheerleaders are a team of small robots that use both sensing and communications to achieve stability and group synchronization.
Sensors for Wearables Market to Double in 2015
News & Analysis  
10/22/2014   3 comments
Market analysis and forecast organization IHS thinks that Apple's Watch will stimulate and set a standard for fitness and health monitoring features on wearable electronics devices.
TI’s Rosy Outlook Defies Microchip's Gloom
News & Analysis  
10/21/2014   6 comments
TI reported third-quarter results above expectations, indicating no industry corrections in sight. The solid results came 10 days after Microchip made a downward revision in its revenue forecast.
TI Beefs Up Driver Assist, Digital Cockpit
News & Analysis  
10/21/2014   9 comments
Car OEMs’ growing desire to meet or exceed higher NCAP ratings is driving chip suppliers to develop more sophisticated ADAS SoCs. TI is rolling out two types of solutions: “safety critical” and “informational” ADAS processors.
First 2D Atomic Piezoelectric Discovered
News & Analysis  
10/20/2014   6 comments
The world's first 2D monolayer material has been shown to be piezoelectric, enabling a new era of super-sensitive sensors, and when stacked, a new power source for wearables and IoT.
Mega MATLAB Release From MathWorks
News & Analysis  
10/17/2014   3 comments
R2014b is an extremely compelling release for both existing MATLAB users and new members of the MATLAB community.
TSMC Capex to Exceed $10B in FinFET Ramp-Up
News & Analysis  
10/16/2014   6 comments
Taiwan Semiconductor said Thursday that it aims to increase its capital expenditures next year to more than US$10 billion as it accelerates its ramp-up to commercial production of 16 nm FinFET chips.
IC Industry Slowdown: True or False?
News & Analysis  
10/15/2014   10 comments
Did Microchip Technology get ahead of itself by suggesting that its downward revenue forecast was a negative bellwether for the whole semiconductor market? Or is there a macro-economic weakness that bodes ill for the chip industry?
In $2.5B Deal, Qualcomm & CSR Mesh
News & Analysis  
10/15/2014   15 comments
Qualcomm Inc., the world's largest cellphone chip vendor, has agreed to buy CSR for $2.5 billion to strengthen its presence in the Internet of Things market.
Microchip Forecast Dip Triggers Debate
News & Analysis  
10/13/2014   16 comments
Microchip's downward revision in its September quarter revenue forecast spooked flocks of investors, driving down stock prices, not only for Microchip, but also for Intel and TI. The news appears to have caught semiconductor industry analysts by surprise.
Despite 'D' Disappointment, Tesla Still Matters
News & Analysis  
10/10/2014   27 comments
The long, speculation-drenched week that followed Elon Musk’s “unveil the D” tweet is finally over. Tesla Motors Thursday night announced an all-wheel-drive (awd) Model S with semi-autopilot features.
Will Infineon's Power IC Gambit Pay Off?
News & Analysis  
10/8/2014   16 comments
Against several of the financial community's shibboleths (get out of manufacturing, get rid of fabs), Infineon not only kept its fabs but upgraded them. The company is staking its power-chip future in Dresden fab.
Test & Measurement Calendar of Events
News & Analysis  
10/7/2014   2 comments
Autumn is a busy time for engineering events, shows, conferences, and seminars. Here are some. Did we miss any?
Spansion to Launch 3D-Embedded Automotive MCU
News & Analysis  
10/1/2014   1 comment
Spansion will launch a new microcontroller designed to offer high-performance human machine interface (HMI) for automobile dash and clusters. It comes with HyberBus interface and 2D or 3D graphics cores (or both) embedded inside the MCU.
Robots Confront Safety Standards
News & Analysis  
9/30/2014   7 comments
An emerging crop of industrial robots will be more user-friendly tools for novice users in a wide variety of small companies, but they may bump up against safety standards, experts say.
Altera Announces Non-Volatile MAX 10 FPGAs & Eval Kits
News & Analysis  
9/30/2014   8 comments
MAX 10 FPGAs are of interest for a broad range of application areas, including industrial control systems, automotive systems, communications, computing, and storage.
Fairchild Reinvents Itself
News & Analysis  
9/26/2014   11 comments
Fairchild is transforming itself from a discrete component supplier for everyone into a smart-module provider to just the fastest-growing industries, says president and chief operating officer Vijay Ullal.
Smartphone Shifts Automotive Processor Demand
News & Analysis  
9/26/2014   7 comments
As the most disruptive trend in the automotive infotainment industry has market researcher HIS identified the use of smartphones in cars. The reason: Since smartphones are as ubiquitous as they are in today's vehicles, consequences for the design of head units and telematics portals in the vehicles are necessary, leading to a shift in microprocessor demand in these components.
MEMS Pioneer Raises $25M, Including Debt
News & Analysis  
9/26/2014   4 comments
SiTime Corp., a pioneer of MEMS resonator devices as replacements for quartz timing devices, has closed a $25 million round of financing that includes a $15 million debt facility provided by Capital IP Investments Partners.
Infineon's Secret Weapon: Dresden Fab, 48V Car Battery
News & Analysis  
9/25/2014   41 comments
Infineon is banking on its power semiconductors to expand its presence in the global automotive market while its 300mm "thin" wafers and 48V battery will help meet the CO2 emission target for EU cars.
Tire Sensor for Industrial Trucks Solves a Burning Problem
News & Analysis  
9/25/2014   2 comments
A research project of the Hannover University is currently developing a sensor system that enables operators to monitor the conditions of the tires on industrial trucks.
All Aboard the ARM Cortex-M7 MCU Express
News & Analysis  
9/24/2014   Post a comment
ARM's new Cortex-M7 processor is highest performance member of the energy-efficient Cortex-M processor family.
Centralized Architecture: Apps as Driver-Assistance Systems
News & Analysis  
9/24/2014   6 comments
Is centralizing the dozens of ECUs and control units in a car into one powerful computing hub a good idea? Siemens says it means essential functions such as driver-assistance systems could be implemented as apps.
NXP Beats Qualcomm, Gets First V2V Design Win
News & Analysis  
9/23/2014   4 comments
The future of car-to-car communication in the United States is getting more real, now that Delphi Automotive has become the first Tier 1 to supply car-to-car communications modules to General Motors' 2017 Cadillac models.
Startup's Piezoelectric MEMS Mics May Take Over
News & Analysis  
9/22/2014   Post a comment
Vesper Claims Top Spot with 70dB Signal-to-Noise Ratio
Cars Made to Order at Retail
News & Analysis  
9/19/2014   11 comments
Local Motors’sporty 3D printed car looks like licorice on wheels and cruised around a rocket playground while eager adults looked on. The vehicle innovation company – not car manufacturing, not motorcycle manufacturing – bills itself as a necessary alternative for consumers who want more choice.
Backlash Coming on Car-to-Car Talk?
News & Analysis  
9/18/2014   49 comments
Vehicle-to-vehicle communications will be mandated in the US, but public comments show concerns about V2V's security and privacy.
Sensor Hubs Aided by IEEE-2700-2014 Datasheets
News & Analysis  
9/17/2014   3 comments
The first MEMS standard, the IEEE 2700-2014, will standardize data sheets making it easier to compare models as well as build interoperable sensor hubs.
Consumers Expect Full In-Car Connectivity
News & Analysis  
9/17/2014   20 comments
Drivers worldwide increasingly expect their cars to be “the next connected space,” a seamless extension to their already connected homes and offices, according to a global consumer study conducted by GfK.
Lemoptix Pico-Projector Excels
News & Analysis  
9/16/2014   10 comments
Claims brightest, smallest MEMS projector solution
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Max Maxfield

Want to Present a Paper at ESC Boston 2015?
Max Maxfield
8 comments
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No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
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Rich Quinnell
12 comments
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Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).