Data Centers Hit the Accelerator News & Analysis 4/15/2016 13 comments Engineers need to re-invent the server to better handle emerging jobs such as machine learning, said an executive with Microsoft’s cloud computing group.
Spiraling Data Costs Imperil IoT News & Analysis 4/14/2016 3 comments IoT system designers and service providers often don’t realize until much too late in the design cycle that their data costs are “quickly spiraling out of control,” Windspring CEO observed.
FD-SOI Expands, But Is It Disruptive? News & Analysis 4/14/2016 5 comments The ecosystem for fully-depleted silicon on insulator (FD-SOI) process technology has tipped from a too-late technology to a viable alternative to finFETs for the Internet of Things and automotive markets. To many, the presence of officials from major companies at an industry event signaled a coalescing around the technology.
Micron Makes More Moves Toward Storage News & Analysis 4/14/2016 Post a comment The memory company outlined a lot of its intentions for the future, including a bigger emphasis on software, but it doesn't change the realities of the DRAM and NAND flash business
TSMC Expects Second Half Surge News & Analysis 4/14/2016 Post a comment TSMC expects that it will emerge from an industry slowdown sometime during the second half of this year. The company faces overall sales growth in its business segment that slowed to 4.4% in 2015 from 16% in 2014.
5G Work Starts in Earnest News & Analysis 4/13/2016 1 comment This week engineers started hearing proposals on everything from radio access technologies to network architectures for 5G cellular standards expected before 2020.
VC Veteran Joins EDA Group News & Analysis 4/13/2016 Post a comment Veteran venture capitalist Lucio Lanza joined the recently renamed Electronics Systems Design Alliance as another step in the rejuvenation of the EDA trade group.
Foundry Sales Growth Slows News & Analysis 4/13/2016 Post a comment Foundry sales grew by a meager 4.4% in 2015 amid a slowdown in the overall semiconductor market, according to market research firm Gartner.
Autonomous Cars Navigate in the Dark: Lights off News & Analysis 4/13/2016 2 comments Ford Motor company has tested how autonomous vehicles get their bearings during the night without any lights. The vehicles coped with the challenge pretty well – they used LIDAR sensors instead of headlights and cameras.
Superconductor Nearing Room Temp News & Analysis 4/12/2016 1 comment Superconductors are getting closer and closer to room-temperature operation now that University of Houston has found errors in its theory and Universidad del País Vasco has uncovered its quantum-wave nature.
Broadcom Drives Enterprise Wi-Fi to 2 Lanes News & Analysis 4/12/2016 Post a comment To handle an ever-increasing number of devices connecting in public, Broadcom announced a new dual-channel 5 GHz Wi-Fi access point platform for enterprise. Broadcom’s 5G-HD platform is based on a quad-core 64-bit Cortex A-53 CPU and a flexible architecture for routing different kinds of mobile traffic.
Sayonara, Japan Semiconductor Inc. News & Analysis 4/12/2016 20 comments The Japanese semiconductor industry’s downfall is undeniable. EE Times went back to Japan and explored what remains of Japanese chip vendors, how Japan Inc. has crumbled and if we grade recent restructuring programs, who comes out on top.
Winbond Stacks NOR, NAND Flash News & Analysis 4/11/2016 1 comment SpiStack W25M Series stacks homogeneous or heterogeneous flash to provide memories of varying densities for code and data storage for smaller M2M and IoT devices.
Renesas to Hire Kure, 3rd CEO in a Year News & Analysis 4/8/2016 Post a comment Renesas Electronics Corp. will appoint Bunsei Kure, a former CEO of Calsonic Kansai, a large Japanese automotive component supplier, as its new president and CEO, Nikkei, Japan’s economic newspaper, reported Saturday
Semiconductor Forecast Slumps News & Analysis 4/8/2016 4 comments A veteran market watcher lowered his semiconductor market forecast expecting a decline of 2.13% in 2016 amid a sluggish start to the year.
Machine Learning Routes Chips News & Analysis 4/8/2016 Post a comment The last day of the International Symposium of Physical Design 2016 (ISPD, 2016, April 3-6, Santa Rosa, Calif.) with the annual design contest and best paper awards.
China Facing Long-Term Memory Gap News & Analysis 4/8/2016 1 comment China, Inc.’s rush to build its own memory business is real. But just how — and how soon — remains a complete mystery. But XMC claims its first 3D NAND flash memory test chip “passed the electrical verification” a year ago.
High-Speed CAN Transceivers Eliminate Chokes, Withstand EMC News & Analysis 4/8/2016 Post a comment Texas Instruments has added two families of controller area network (CAN) transceivers that meet all industry requirements for electromagnetic compatibility (EMC) from U.S. and European automotive manufacturers; and that offer high bus-fault protection, fast CAN flexible data rate (FD) speeds and shortest loop delay.
10nm DDR4 DRAM Could Defy Moore News & Analysis 4/7/2016 5 comments Samsung said it has overcome scaling challenges to address scaling challenges that were previously thought to mean the end of Moore's Law.
Chip Market Decline Deepens News & Analysis 4/7/2016 3 comments A chip market decline that began mid-2015 looks set to continue through the first quarter of 2016 at least, with falling markets on an annual basis in all geographies except China.
MEMS Energy Exchange Shows PV Promise News & Analysis 4/7/2016 2 comments An academic team reported building a nanoscale MEMS device that transfers heat radiatively at 100 times the theoretical level and that could impact electricity generation.
Organic and Printed Electronics Industry is Hiring News & Analysis 4/7/2016 Post a comment According to the latest business climate survey conducted by the Organic and Printed Electronics Association, 80% of survey participants expect the industry to continue its positive development in the coming year with a projected growth in sales revenue of 11% for 2016.
Fab-in-a-Box: Flexible Electronics Scale Up News & Analysis 4/6/2016 Post a comment The first FlexLogIC system to be commissioned from Deutch contract manufacturing partner VDL Enabling Technologies Group (VDL ETG) and expected in 2017, will transfer PragmatIC's flexIC production process into a self-contained, fully automated, modular design, with capacity for billions of flexICs at a capital cost between 100 and 1000 times lower than a silicon fab.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.