Plastic Solar Cells Double Output News & Analysis 8/19/2015 6 comments Fluence--for fluid enhanced crystal engineering--used a micron-sized "rake" to mix the two different polymers needed for plastic solar cells thus doubling their output over traditional mixing methods
MediaTek Faces Eroded Smartphone Growth News & Analysis 8/19/2015 4 comments MediaTek’s rapid growth in 4G smartphones is likely to be undermined by handset makers in China who design their own chips, according to an analyst who covers the tech industry in Asia.
USB Ain't So Simple Anymore News & Analysis 8/19/2015 17 comments Cypress, TI, NXP and Lattice have all rolled out new USB Type-C chips. Loaded with new features, USB Type C offers promises to system vendors. But for consumers, it may bring potential confusions, industry analysts cautioned.
Intel CEO Sees A Bright Future For IoT, Developers News & Analysis 8/19/2015 Post a comment Tiny computers, real-time depth sensing, and breakthrough memory technology are among the innovations featured at this year's Intel Developer Forum. CEO Brian Krzanich detailed how connected devices will change the way we all do business.
Inside GlobalFoundries' Fab 8 News & Analysis 8/18/2015 5 comments We tour GlobalFoundries' Fab 8, one of the largest chip fabs in the United States, in Malta, N.Y. and a hub for innovations developed at R&D centers in Albany.
Natcore Takes Silver Out of Photovoltaics News & Analysis 8/18/2015 Post a comment Research company Natcore Technology claims its scientists have produced a low-cost all-back-contact silicon heterojunction photovoltaic structure in which silver has been completely eliminated, being replaced by aluminium.
Metamaterials Single-Out One Voice News & Analysis 8/17/2015 2 comments Duke University (Durham, North Carolina) has invented a metamaterial-based voice-locator system that can pick out an individual's voice even from a crowded, noisy room.
Rambus to Enter Fabless Chip Biz News & Analysis 8/17/2015 9 comments Seizing the opportunity in a growing market of datacenters, Rambus is unveiling a server memory interface chipset. The move is significant because the company will enter a fabless chip business for the first time, instead of IP business.
Should Altera Worry About Intel's M&A Record? News & Analysis 8/17/2015 14 comments Altera’s fate after its pending acquisition by Intel is anybody’s guess. But the big worry is if Intel squashes Altera -- pushing newly acquired talent, products and technologies into oblivion as though they had never existed.
Broadcom Tackles 5 Questions on Ethernet in Cars News & Analysis 8/14/2015 4 comments A Broadcom executive answers nagging questions on automotive Ethernet. They include its specific applications inside a car and if it has enough bandwidth to meet ADAS requirements. There’s also concern about Broadcom’s IP, and which car OEMs are already using Ethernet.
5G Expectations Soar News & Analysis 8/14/2015 Post a comment The next-generation of wireless technology is generating big-time predictions as the industry gears up for its potential benefits.
Samsung Slims Phones, Boosts Displays News & Analysis 8/13/2015 Post a comment Banking on trends toward larger screens, Samsung unveiled two new smartphones with larger displays in a smaller form factor. The Samsung S6 Edge+ and Note 5 will be available in the U.S. and Canada on Aug. 21.
Intel Preps Crosspoint Server News & Analysis 8/13/2015 6 comments Intel will debut next week a new class of high performance servers using the 3-D Crosspoint memories it recently announced with Micron, said one expert.
Wearables a Strange Fit, Says CEA News & Analysis 8/13/2015 Post a comment Wearables represent a fast growing but highly diverse and fragmented market where winners and losers are hard to call, according to the Consumer Electronics Association.
RRAM Breaks Records with Graphene News & Analysis 8/13/2015 17 comments Rice University professor James Tour and his group have developed a new type of nonvolatile resistive random access memory (RRAM) that overcomes the density limits of other designs by requiring no transistors, switches or diodes for bit cells, and it can be processed at low-temperatures for easy stacking in three dimensions (3D).
Intel Said to Unseat Q'Com in iPhone News & Analysis 8/12/2015 6 comments Speculation about Intel Corp.’s design win for next Apple iPhone has resurged with a vengeance. A Northland Capital Markets’ analyst wrote in a research note that Intel will capture roughly 50% of Apple’s modem business in the upcoming iPhones due to launch September.
IBM Watson Ready for Kick Off News & Analysis 8/12/2015 1 comment Edge-Up-Sports has contracted with IBM to use its Watson technology to provide its fantasy football managers with all the latest information about their players including commentators opinions, performance statistics, recent articles, news coverage, player tweets and official announcements about each player on their fantasy football team.
SMIC Expects First 28nm Revenue by Year End News & Analysis 8/12/2015 3 comments Semiconductor Manufacturing International Corp., China’s largest foundry, will start commercial production of 28nm -- its most advanced technology node -- in Q3 and expects its first revenue contribution from 28nm by the end of this year.
Samsung Drives Up 3-D Flash News & Analysis 8/11/2015 1 comment Samsung announced a handful of novel products using its 3-D NAND flash chips, but the mass market for such products may be more than a year away, said analysts.
IoT Networks Debated at ESC News & Analysis 8/11/2015 12 comments The Internet of Things lacks a wide area network with broad coverage and low cost, according to a panel of experts who spoke at the recent ESV SV event.
'Black Dart' Counters Drones News & Analysis 8/11/2015 2 comments Joint U.S. military "Black Dart" exercises demonstrated and tested the latest countermeasures against enemy operated drones on July 26th through August 7th at the Naval Air Station (Point Mugu, California).
Aricent Buys SmartPlay for $180M News & Analysis 8/10/2015 1 comment Aricent will create a design group focused on the semiconductor industry with the capabilities it acquired from SmartPlay for an estimated $180 million.
Google Becomes Alphabet, Silicon Valley Zaibatsu News & Analysis 8/10/2015 8 comments Perhaps it was inevitable given the myriad business interests and technology fields Google has been so eager to get its hands on. Google announced Monday it will be creating a new holding company called Alphabet Inc.
Building-Integrated Photovoltaics About to Take-off, Say Analysts News & Analysis 8/7/2015 6 comments In its latest report, industry analyst firm n-tech Research predicts the total market for building-integrated solar photovoltaic (BIPV) systems will triple from about USD 3 billion in 2015 to over USD 9 billion in 2019, and surge to USD 26 billion by 2022, as more truly "integrated" BIPV products emerge that are monolithically integrated and multifunctional.
'Inevitable' Ethernet Moving Slowly into Cars News & Analysis 8/6/2015 3 comments Driven by a growing imperative to connect cars to the outside world, the emergence of the automotive Ethernet as the dominant in-vehicle network backbone seems inevitable. But how far has the automotive Ethernet really come?
Intel's Skylake Debuts at Gamecon News & Analysis 8/5/2015 5 comments Intel unveiled its new Skylake microarchitecture, the successor to Broadwell, at the Gamescon Congress 2015. The quad-core 6th generation i5 and i7 quad-core processors target gaming and e-sport.
An Operator's View of 5G News & Analysis 8/5/2015 1 comment The Telecommunications Industry Association surveyed 58 operators globally on the future of 5G cellular, and found that the next-generation technology will begin rollout in Asia and require great effort from network operators.
CoolCube Circuit Stacking Moves to FinFET Process News & Analysis 8/5/2015 3 comments The CEA-Leti research laboratory at Grenoble France, has reported that its CoolCube 3D interconnect technology is suitable for use with FinFET manufacturing processes as well as with fully-depleted silicon-on-insulator manufacturing processes.
Semiconductor-less Transistors the Goal News & Analysis 8/5/2015 1 comment Michigan Tech is creating semiconductor-less heterojunctions using graphene and boron nitride nanotubes that they hope will supersede silicon at the end of the International Technology Roadmap for Semiconductors (ITRS) circa 2028.
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.