Create a Cardboard Energy Harvester News & Analysis 1/26/2016 26 comments École Polytechnique Fédérale de Lausanne, Switzerland has invented a cardboard energy harvester suitable for wireless push-button switches and other similar applications.
High-Temperature Electronics Operate at 300°C News & Analysis 1/25/2016 2 comments Sensors and actuators in industrial applications are increasingly deployed in environments with high temperatures. In the joint R&D project HOT 300, five Fraunhofer institutes have developed a number of basic technology components for high-temperature microsystems.
Qualcomm, TDK Prep $3bn RF Joint Venture News & Analysis 1/25/2016 Post a comment Qualcomm Inc. (San Diego, Calif.) and TDK Corp. (Tokyo, Japan) have agreed to form a joint venture – RF360 Holdings Singapore Pte. Ltd. – to deliver radio frequency modules and filters for multiple applications, including IoT, drones, robotics and automotive electronics.
Chip Stacks Take New Tacks News & Analysis 1/25/2016 4 comments Chip stacks will be key to advances in semiconductors, but in logic TSVs are waning while fan-out techniques and SiPs are on the rise.
Philips' $3 billion Lumileds Deal Blocked by US News & Analysis 1/25/2016 Post a comment Royal Philips (Amsterdam, The Netherlands) has announced that a deal to sell an 80.1 percent interest in Lumileds, a vendor of LED-based lighting, has been terminated, because of concerns within the Committee on Foreign Investment in the United States (CFIUS).
Toshiba to Gut Chip Biz Sans NAND News & Analysis 1/22/2016 2 comments Toshiba Corp. has decided to gut the company’s semiconductor business—except for its NAND flash memory products, Japan’s economic newspaper Nikkei reported Saturday morning.
Security Outlook Bleak, Improving News & Analysis 1/22/2016 1 comment The rise of the Internet of Things with more devices and data means many more security breaches are ahead but so are more secure SoCs, said an expert at DesignCon.
IoT Shoots for the Stars News & Analysis 1/21/2016 1 comment Arrayent, the inventor of the Connect Platform for Internet of Things brands such as Whirlpool, Pentair, Maytag Commercial Laundry, LiftMaster, and more just landed $15 million in Series C funding.
Sony To Use FD-SOI in Stacked Image Sensors News & Analysis 1/21/2016 4 comments At the FD-SOI Forum held here Thursday, the biggest FD-SOI news, which surfaced as chatter during coffee breaks at the Forum, is that Sony is looking to use FD-SOI for image signal processor on chip stack CMOS Image Sensors.
Over-The-Air Charging Is The Future News & Analysis 1/21/2016 9 comments The future of wireless charging doesn’t lie in current coil-based systems, which aren't "really revolutionary." Further, standardization won’t drive wireless charging adoption among consumers.
Microchip Signs to Buy Atmel News & Analysis 1/20/2016 2 comments Microcontroller, analog and flash memory IC vendor Microchip Technology Inc. (Chandler, Ariz.) has agreed to buy Atmel Corp. (San Jose, Calif.) for about $3.56 billion and Dialog Semiconductor, previously set to buy Atmel, has been paid a $137.3 million termination fee.
Intel Protege Pitches Wireless SoC for IoT News & Analysis 1/20/2016 Post a comment Fabless chip company Telink Semiconductor Co. Ltd. (Shanghai, China) has launched the TLSR8269 a system-on-chip intended to provide low power wireless connection for the Internet of Things applications in the smart home.
Wireless Brain Sensor Monitors Then Dissolves News & Analysis 1/19/2016 Post a comment A team of researchers from Washington University School of Medicine in St. Louis and the University of Illinois at Urbana-Champaign has created implantable electronic sensors that can measure intracranial pressure and temperature before being absorbed into the body.
Intel Thwarts Hackers News & Analysis 1/19/2016 4 comments Intel has secretly built hardware into its 6th Generation vPro Core processors that it claims guarantee uncrackable authentication plus the ability up to share your screen with any WiDi equipped display in the world.
V-Nova Preps UHD/4K Silicon IP for Licensing News & Analysis 1/19/2016 Post a comment V-Nova Ltd., the startup creator of a proprietary video codec and compression technology called Perseus, has said it is preparing to provide its technology as UHD/4K video silicon IP for licensing and inclusion in customers' SoCs.
NXP Embraces 28nm FDSOI for MCUs News & Analysis 1/18/2016 Post a comment NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.
Has Samsung Snagged Qualcomm Business with New Process? News & Analysis 1/15/2016 2 comments Samsung Electronics, which has been in a nip-and-tuck race with Taiwan Semiconductor Manufacturing Co. (TSMC) to win foundry orders with the world’s most advanced fabrication technology, may have grabbed all of Qualcomm’s business with a second-generation version of its 14nm FinFET process.
Little Pharm Born News & Analysis 1/15/2016 13 comments Small drug companies (Little Pharm) may now have a tool with which to compete with Big Pharm thanks to National Taiwan University (NTU) professor Yufeng Jane Tseng's program that eliminates the costly animal-trials bottleneck.
Microchip Wins Atmel Bidding War News & Analysis 1/15/2016 1 comment Atmel announced that its board of directors favors an acquisition proposal by Microchip Technology and cancel an existing agreement to be acquired by Dialog Semiconductor.
TSMC Boosts 2016 Capex to About $9.5 Billion News & Analysis 1/14/2016 2 comments Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips.
Consumers Feel Perils of Connectivity News & Analysis 1/14/2016 7 comments Connectivity is the main thing in the Internet of Things . But what if software updates, unbeknownst to users, go haywire, leaving people -- especially seniors, the ill and babies – inside in the cold?
Al Gore on China, Mobile Web News & Analysis 1/14/2016 4 comments The warming relationship between China and the U.S. is important for continued development of the mobile Internet, according to former vice president Al Gore. Yet new tech companies also play an important role in shaping the future world.
Qualcomm, TDK Prep $3bn RF Joint Venture News & Analysis 1/14/2016 Post a comment Qualcomm Inc. (San Diego, Calif.) and TDK Corp. (Tokyo, Japan) have agreed to form a joint venture – RF360 Holdings Singapore Pte. Ltd. – to deliver radio frequency modules and filters for multiple applications, including IoT, drones, robotics and automotive electronics.
3D XPoint Steps Into the Light News & Analysis 1/14/2016 8 comments With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
AMD’s ARM SoC Seeks Sockets News & Analysis 1/14/2016 1 comment AMD announced production availability for its first 64-bit ARM-based server processor, but it lacks customers and is not competitive with Intel’s Xeon.
6 Things to Know About HDR, 4K TV News & Analysis 1/14/2016 3 comments The consumer electronics world has just got some much-needed clarity on 4K Ultra High Definition TV. In parallel, the industry now faces a fresh format battle brewing over High Dynamic Range technology. Here are the six things you need to know about 4K, HDR.
All Aboard the Hardware Startup Train News & Analysis 1/13/2016 2 comments After years of software-based funding and tedious development, the crowdfunding tide is turning toward hardware. At International CES, held Jan. 6- 9, officials from Indiegogo said companies throughout the chip and gadget ecosystem are getting on board.
Patent Awards Down, IBM Still No. 1 News & Analysis 1/13/2016 Post a comment 2015 saw a 1% downturn in U.S. patent activity for the first time in seven years, with 298,407 utility patents filed. Perennial patent leader IBM led the year with 7,355 patents, down slightly from 2014.
Cypress Unveils Traveo OTA Update MCUs News & Analysis 1/12/2016 Post a comment Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.
January 2016 Cartoon Caption ContestBob's punishment for missing his deadline was to be tied to his chair tantalizingly close to a disconnected cable, with one hand superglued to his desk and another to his chin, while the pages from his wall calendar were slowly torn away.122 comments