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Semiconductor R&D Spending Slows
News & Analysis  
1/26/2016   Post a comment
The semiconductor industry spent slightly more on R&D in 2015, but the rate of growth was among the lowest on record, according to IC Insights.
Sony to Acquire Altair Semi For $212 Million
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1/26/2016   Post a comment
Japanese electronics giant plans to combine existing sensing technologies with Israeli startups LTE chipsets for new breed of IoT products.
Linux Framework Attracts Support
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1/26/2016   Post a comment
A new working group will shepherd the OpenAMP framework for supporting multiple operating systems and processors within a system.
Create a Cardboard Energy Harvester
News & Analysis  
1/26/2016   26 comments
École Polytechnique Fédérale de Lausanne, Switzerland has invented a cardboard energy harvester suitable for wireless push-button switches and other similar applications.
High-Temperature Electronics Operate at 300°C
News & Analysis  
1/25/2016   2 comments
Sensors and actuators in industrial applications are increasingly deployed in environments with high temperatures. In the joint R&D project HOT 300, five Fraunhofer institutes have developed a number of basic technology components for high-temperature microsystems.
Qualcomm, TDK Prep $3bn RF Joint Venture
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1/25/2016   Post a comment
Qualcomm Inc. (San Diego, Calif.) and TDK Corp. (Tokyo, Japan) have agreed to form a joint venture – RF360 Holdings Singapore Pte. Ltd. – to deliver radio frequency modules and filters for multiple applications, including IoT, drones, robotics and automotive electronics.
Chip Stacks Take New Tacks
News & Analysis  
1/25/2016   4 comments
Chip stacks will be key to advances in semiconductors, but in logic TSVs are waning while fan-out techniques and SiPs are on the rise.
Silicon Motion Proactively Launches 3D NAND Controllers
News & Analysis  
1/25/2016   Post a comment
Client SSDs appear to be the early target for 3D NAND, even as planar TLC is still getting adoption and few vendors are actually shipping product in high volumes
Philips' $3 billion Lumileds Deal Blocked by US
News & Analysis  
1/25/2016   Post a comment
Royal Philips (Amsterdam, The Netherlands) has announced that a deal to sell an 80.1 percent interest in Lumileds, a vendor of LED-based lighting, has been terminated, because of concerns within the Committee on Foreign Investment in the United States (CFIUS).
Toshiba to Gut Chip Biz Sans NAND
News & Analysis  
1/22/2016   2 comments
Toshiba Corp. has decided to gut the company’s semiconductor business—except for its NAND flash memory products, Japan’s economic newspaper Nikkei reported Saturday morning.
Security Outlook Bleak, Improving
News & Analysis  
1/22/2016   1 comment
The rise of the Internet of Things with more devices and data means many more security breaches are ahead but so are more secure SoCs, said an expert at DesignCon.
Embedded Board Standards Reach for the Sky, and Beyond
News & Analysis  
1/22/2016   Post a comment
Standards-based modular systems continue to expand their range of applications in rugged and safety-critical systems design.
Will Xilinx Join the M&A Party?
News & Analysis  
1/21/2016   3 comments
Speculation holds that Qualcomm may be targeting Xilinx for acquisition after programmable logic vendor's recent regulatory filing.
IoT Shoots for the Stars
News & Analysis  
1/21/2016   1 comment
Arrayent, the inventor of the Connect Platform for Internet of Things brands such as Whirlpool, Pentair, Maytag Commercial Laundry, LiftMaster, and more just landed $15 million in Series C funding.
Sony To Use FD-SOI in Stacked Image Sensors
News & Analysis  
1/21/2016   4 comments
At the FD-SOI Forum held here Thursday, the biggest FD-SOI news, which surfaced as chatter during coffee breaks at the Forum, is that Sony is looking to use FD-SOI for image signal processor on chip stack CMOS Image Sensors.
Over-The-Air Charging Is The Future
News & Analysis  
1/21/2016   9 comments
The future of wireless charging doesn’t lie in current coil-based systems, which aren't "really revolutionary." Further, standardization won’t drive wireless charging adoption among consumers.
Report: Analog, TI Both Pass on Maxim Purchase
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1/21/2016   Post a comment
Both Texas Instruments Inc. and Analog Devices Inc. have decided not to pursue an acquisition of Maxim Integrated Products Inc. according to a Bloomberg report that referenced unnamed sources.
EUV Improves But Not Ready
News & Analysis  
1/21/2016   13 comments
Extreme Ultraviolet lithography (EUV) is making progress, but it will not yet ready until 2018, reported ASML.
Google, Intel Prep 48V Servers
News & Analysis  
1/21/2016   4 comments
Google called for 48V server motherboards and Intel said it has a prototype design out for feedback in a DesignCon panel.
Microchip Signs to Buy Atmel
News & Analysis  
1/20/2016   2 comments
Microcontroller, analog and flash memory IC vendor Microchip Technology Inc. (Chandler, Ariz.) has agreed to buy Atmel Corp. (San Jose, Calif.) for about $3.56 billion and Dialog Semiconductor, previously set to buy Atmel, has been paid a $137.3 million termination fee.
Memristor Computer Emulates Brain Functions
News & Analysis  
1/20/2016   8 comments
Knowm Inc. (Santa Fe, N.M.) has introduced two new memristors to emulate new brain functions plus has diversified its packaging by adding a die-only options that holds 180 memristors.
Intel Protege Pitches Wireless SoC for IoT
News & Analysis  
1/20/2016   Post a comment
Fabless chip company Telink Semiconductor Co. Ltd. (Shanghai, China) has launched the TLSR8269 a system-on-chip intended to provide low power wireless connection for the Internet of Things applications in the smart home.
Safety-Related Flaws at Unacceptable Level, Says Report
News & Analysis  
1/19/2016   3 comments
According to a report by the Center of Automotive Management (Bergisch-Gladbach, Germany), faulty safety equipment in the cars was by far the biggest reason for car vendors to launch a call-back campaign.
Ultrasound Proximity Software Replaces Hardware-Based Sensors
News & Analysis  
1/19/2016   2 comments
Elliptic Labs has launched a software-based ultrasound proximity sensing solution that relies on the smartphones' speaker and microphone to replace today’s optical proximity sensors.
Wireless Brain Sensor Monitors Then Dissolves
News & Analysis  
1/19/2016   Post a comment
A team of researchers from Washington University School of Medicine in St. Louis and the University of Illinois at Urbana-Champaign has created implantable electronic sensors that can measure intracranial pressure and temperature before being absorbed into the body.
Intel Thwarts Hackers
News & Analysis  
1/19/2016   4 comments
Intel has secretly built hardware into its 6th Generation vPro Core processors that it claims guarantee uncrackable authentication plus the ability up to share your screen with any WiDi equipped display in the world.
EEs & CSs Create Early-Stage Lung Cancer Detector
News & Analysis  
1/19/2016   Post a comment
Delta Electronics (Singapore) is readying for market a tabletop lung-cancer detector affordable by any doctor's office that instantly uncovers early stage lung cancer while it's still a simple operation to cure.
Qualcomm Enters $280M Joint Venture with Chinese Province
News & Analysis  
1/19/2016   1 comment
The joint venture will focus on the design, development and sale of advanced server chipset technology in China, which is the second largest country in the world for server technology sales.
Plastic Fingerprint Sensor Also Detects Underlying Veins
News & Analysis  
1/19/2016   Post a comment
FlexEnable and ISORG have jointly developed what they claim to be the world's first large area flexible fingerprint sensor on plastic designed for biometric applications.
V-Nova Preps UHD/4K Silicon IP for Licensing
News & Analysis  
1/19/2016   Post a comment
V-Nova Ltd., the startup creator of a proprietary video codec and compression technology called Perseus, has said it is preparing to provide its technology as UHD/4K video silicon IP for licensing and inclusion in customers' SoCs.
NXP Embraces 28nm FDSOI for MCUs
News & Analysis  
1/18/2016   Post a comment
NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.
Stanford Develops 'Safe' Battery
News & Analysis  
1/18/2016   14 comments
New battery developed at Stanford University shuts down at high temperatures and restarts when it cools without losing performance.
Intel Metamaterials Breakthrough
News & Analysis  
1/18/2016   15 comments
Has Samsung Snagged Qualcomm Business with New Process?
News & Analysis  
1/15/2016   2 comments
Samsung Electronics, which has been in a nip-and-tuck race with Taiwan Semiconductor Manufacturing Co. (TSMC) to win foundry orders with the world’s most advanced fabrication technology, may have grabbed all of Qualcomm’s business with a second-generation version of its 14nm FinFET process.
Little Pharm Born
News & Analysis  
1/15/2016   13 comments
Small drug companies (Little Pharm) may now have a tool with which to compete with Big Pharm thanks to National Taiwan University (NTU) professor Yufeng Jane Tseng's program that eliminates the costly animal-trials bottleneck.
Microchip Wins Atmel Bidding War
News & Analysis  
1/15/2016   1 comment
Atmel announced that its board of directors favors an acquisition proposal by Microchip Technology and cancel an existing agreement to be acquired by Dialog Semiconductor.
Intel Meets Expectations Despite Sagging PC Market
News & Analysis  
1/15/2016   1 comment
World's biggest chip maker says it's now deriving about 40% of sales from non-PC markets; firms sees data centers, Internet of Things and memory as future growth drivers.
TSMC Boosts 2016 Capex to About $9.5 Billion
News & Analysis  
1/14/2016   2 comments
Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s largest foundry, said it will increase its capital expenditure in 2016 to an amount ranging from $9 billion to $10 billion as it aims for a bigger share of finer geometry chips.
Consumers Feel Perils of Connectivity
News & Analysis  
1/14/2016   7 comments
Connectivity is the main thing in the Internet of Things . But what if software updates, unbeknownst to users, go haywire, leaving people -- especially seniors, the ill and babies – inside in the cold?
Al Gore on China, Mobile Web
News & Analysis  
1/14/2016   4 comments
The warming relationship between China and the U.S. is important for continued development of the mobile Internet, according to former vice president Al Gore. Yet new tech companies also play an important role in shaping the future world.
Samsung Gives Ground Over Chip Workers' Cancers
News & Analysis  
1/14/2016   Post a comment
Samsung Electronics Co. Ltd. has made a concession to the families of scores of workers and former employees who have died of cancers over the last decade.
Qualcomm, TDK Prep $3bn RF Joint Venture
News & Analysis  
1/14/2016   Post a comment
Qualcomm Inc. (San Diego, Calif.) and TDK Corp. (Tokyo, Japan) have agreed to form a joint venture – RF360 Holdings Singapore Pte. Ltd. – to deliver radio frequency modules and filters for multiple applications, including IoT, drones, robotics and automotive electronics.
3D XPoint Steps Into the Light
News & Analysis  
1/14/2016   8 comments
With its 3D XPoint memories moving into the fab, an IM Flash executive revealed details of the technology and challenges making the devices.
AMD’s ARM SoC Seeks Sockets
News & Analysis  
1/14/2016   1 comment
AMD announced production availability for its first 64-bit ARM-based server processor, but it lacks customers and is not competitive with Intel’s Xeon.
6 Things to Know About HDR, 4K TV
News & Analysis  
1/14/2016   3 comments
The consumer electronics world has just got some much-needed clarity on 4K Ultra High Definition TV. In parallel, the industry now faces a fresh format battle brewing over High Dynamic Range technology. Here are the six things you need to know about 4K, HDR.
All Aboard the Hardware Startup Train
News & Analysis  
1/13/2016   2 comments
After years of software-based funding and tedious development, the crowdfunding tide is turning toward hardware. At International CES, held Jan. 6- 9, officials from Indiegogo said companies throughout the chip and gadget ecosystem are getting on board.
Fujitsu Semiconductor Europe Repositions Itself as a Distributor
News & Analysis  
1/13/2016   Post a comment
Having sold its MCU products to Spansion and graphics chips to Socionext, Fujitsu Semiconductor Europe FSEU continues its restructuring strategy, resurfacing as a distributor under the name Fujitsu Electronics Europe (FEEU).
Patent Awards Down, IBM Still No. 1
News & Analysis  
1/13/2016   Post a comment
2015 saw a 1% downturn in U.S. patent activity for the first time in seven years, with 298,407 utility patents filed. Perennial patent leader IBM led the year with 7,355 patents, down slightly from 2014.
PC Shipments Fall For 4th Straight Year
News & Analysis  
1/13/2016   1 comment
Largest ever year-over-year drop after holiday season didn't materialize.
Cypress Unveils Traveo OTA Update MCUs
News & Analysis  
1/12/2016   Post a comment
Cypress Semiconductor Corp. rolled out the first series of Traveo MCUs with embedded flash on the 40nm process technology node, designed to enable mid-range to mass-market cars to implement over-the-air software updates.
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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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