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posted in January 2004
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Every function in this power management IC
Product News  
1/31/2004   Post a comment
austriamicrosystems touts its AS3603, an enhanced version of its AS3601 power management platform, as an industry benchmark for functionality and flexibility for mobile applications including cell phones, PDAs, and digital cameras. It features a DC/DC converter and ultra-low power LDOs, all programmable in 0.05-volt steps. The AS3603's feature set also includes a a driver for white LEDs, and a programmable 1-watt audio amplifier. The company says this chip takes up less than half the space of co
250-V MOSFETs in SO-8s bite into RDS
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1/31/2004   Post a comment
Vishay Siliconix says its trio of new 250-volt N-channel TrenchFETs offer the lowest on-resistance available in the SO-8, PowerPAK SO-8, and D2PAK packages for power MOSFETs rated at this voltage. Vishay cites a maximum on-resistance of 155 milliohms at 10-V gate drive for the Si4434DY and Si7434DP.
MOSFET-based OR-ing controller cuts power losses
Product News  
1/31/2004   Post a comment
Linear Technology's new LT4351 drives a MOSFET pass-element to implement an OR-ing diode solution for N + 1 redundant supply applications. What are the advantages of doing it that way? See product review.
Sony '90-nm' chip may not be, analysis firm claims
News & Analysis  
1/31/2004   Post a comment
A key chip in Sony's PSX game console that the company says is built in a 90-nm process technology was actually implemented in a 130-nm manufacturing process, according to the Canadian technology and patent-analysis firm Semiconductor Insights. Sony vehemently denied the charge.
Unified co-verification breaks HW/SW bottlenecks
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1/30/2004   Post a comment
Current hardware/software verification methods are cumbersome and slow. A single-kernel approach leveraging cycle-based simulation provides a significant advantage.
How poor packaging kills good PCB designs
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1/30/2004   Post a comment
Package parasitic inductance has a huge impact on PCB design and performance. In this excerpt from his recent book, PCB design guru Lee Ritchey (right) shows how to avoid VCC and ground bounce caused by poor IC package design.
Alcatel GGSN acquisition could leave Cisco hanging
News & Analysis  
1/30/2004   Post a comment
Alcatel has added a GPRS gateway support node (GGSN) box to its wireless product offering through the acquisition today (Jan. 30) of startup WaterCove Networks, a move that could eliminate Cisco from future Alcatel-enabled wireless networks.
IEEE gears up for Ethernet backplane standard
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1/30/2004   Post a comment
The IEEE could start work as early as March on a plan to draft its first standard for Ethernet-based backplanes, aiming to address a broad range of computer and communications gear.
More options available for mini pushbutton switches
Product News  
1/30/2004   Post a comment
The new MB2000 series of miniature pushbuttons from NKK Switches offers greater design flexibility with a variety of styles and options. The miniature pushbutton switches are available in single pole, double pole, and four pole, double throw configurations, as well as momentary and alternate circuits.
Cable assembly designed for high-speed ZD connectors
Product News  
1/30/2004   Post a comment
W.L. Gore & Associates Inc. will exhibit several new products including the new GORE EYE-OPENER ZD cable assembly and GORE SPEEDBOARD C prepreg with FR4 at DesignCon 2004, Feb. 3-4, in Booth 807.
Switch technology supports broadband differential signaling
Product News  
1/30/2004   Post a comment
There's a new class of switch products will enable the handling of differential broadband signals in advanced high-bandwidth applications, according to Pericom Semiconductor Corp. The company's line of application specific standard products (ASSPs) now includes switching solutions that address applications requiring up to 700 MHz of bandwidth.
Roving eye for Mars forces CCD rethink
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1/30/2004   Post a comment
Behind the spectacular panoramic images beamed back from Mars in recent weeks is a full-custom CCD imaging chip designed to meet the stringent demands and environmental conditions of the Martian surface. Its creator, former JPL engineer Mark Wadsworth (right), discusses the design challenges behind the chip.
Roving eye for Mars forces CCD rethink
News & Analysis  
1/30/2004   Post a comment
Behind the spectacular panoramic images beamed back from Mars in recent weeks is a full-custom CCD imaging chip designed to meet the stringent demands and environmental conditions of the Martian surface.
Asian economies brace for bird flu
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1/30/2004   Post a comment
Electronics manufacturers in Asia are reportedly taking steps to prevent the spread of avian influenza at their facilities as fears rise that the bird flu could prove more damaging to some Asian economies than last year's outbreak of severe acute respiratory syndrome.
Intel to attack AMD with Prescott, Yamhill, price cuts
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1/30/2004   Post a comment
Intel Corp. is taking the gloves off and preparing a three-pronged attack against its microprocessor archrival — Advanced Micro Devices Inc.
Wireless LAN braintrust defecting to UWB as shakeout looms
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1/30/2004   Post a comment
Calling ultrawideband technology "the next frontier of wireless," Matthew Shoemake is leaving his post as chair of the nascent IEEE 802.11n high-rate wireless LAN task group to head the latest UWB startup, WiQuest.
Optical interconnect compatible with MT and ceramic ferrule technologies
Product News  
1/30/2004   Post a comment
Teradyne Inc.'s Connection Systems Division (TCS) announced the company's first entry into the optical interconnect market with the introduction of the HD-Optyx optical connector. The company says it's the first modular optical interconnect that is compatible with both the high-density MT ferrule and mature, higher performance 1.25-mm ceramic ferrule technologies. This gives system designers greater flexibility by allowing them to choose 1.25-mm for system compatibility, MT for density, or both
35-amp connectors target telco apps
Product News  
1/30/2004   Post a comment
Anderson Power Products offers two new 35-amp power drawer connectors that are used for "N + 1" power supply and rectifier systems for server, telecommunications and networking applications. The connectors are UL verified for cross mating with competitive products, which offers additional sourcing alternatives for designers.
McData lays off 92 workers
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1/30/2004   Post a comment
McData Inc., a provider of network hardware for mainframe and client-server systems, will lay off 92 employees, leaving just under 1,000 workers in all locations.
Chemical exposure did not cause IBM-ers' cancer, says expert
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1/30/2004   Post a comment
Cancer in two former IBM hard disk drive employees was not caused by chemical exposure on the job, an occupational health expert testified at the chemical exposure trial.
Quarter-brick VICs can deliver 600 watts
Product News  
1/30/2004   Post a comment
Vicor Corporation has expanded on its VIC-in-a-Brick 48-to-12 volt bus converter with a family of nine intermediate bus converter modules (IBCs) that provide a fixed 3- to 48-volt output (3, 4, 6, 8, 9.6, 12, 16, 24, 48 volts) from a nominal 48-volt (38-55 V) input. These high-efficiency quarter-brick versions, delivering up to 100 amps or 600 watts, incorporate V • I Chip technology (July 7, p. 63) and provide a traditional brick-style bus solution for designers who at the same time desire
Convicting The Innocent With Technology
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1/30/2004   Post a comment
Anyone that can make noise will make noise
ST annonce des ventes en hausse au quatrième trimestre 2003
News & Analysis  
1/30/2004   Post a comment
Le fabricant franco-italien de semi-conducteurs STMicroelectronics a publié mercredi 27 janvier 2004, après clôture de Wall Street, son chiffre d'affaires et ses résultats pour le quatrième trimestre et l'ensemble de l'exercice 2003. Après un troisième trimestre assombri par une charge exceptionnelle liée au plan de restructuration du groupe, le bilan financier des trois derniers mois de l'année laisse percev
Silicon 101
Product News  
1/30/2004   Post a comment
How do you get from beach sand to microprocessors? Prof. Turley explains the process. In doing so, he reveals a few secrets.
VMEBus legt den Overdrive ein
News & Analysis  
1/30/2004   Post a comment
Im Rahmen des Aktionsprogramms "VME-Renaissance" stellt die Motorola Computer Group einen neuen Single-Board Computer vor. Kennzeichen sind eine völlig neue VMEbus-to-PCI-X-Bridge und ein schnelleres Protokoll für den altgedienten Bus. Der kommt damit auf ganz erstaunliche Geschwindigkeiten.
ON Semi und Melexis fahren gemeinsam Bus
News & Analysis  
1/30/2004   Post a comment
Die beiden Automibileletronik-Spezialisten ON Semiconductor und Melexis Microelectronic Systems wollen künftig eng zusammenarbeiten. Neben dem gegenseitigen Austausch von Intellectual Property (IP) ist eine gemeinsame Vermarktung der Produkte für automobilspezifische Bussysteme vorgesehen.
Software option for GPS tester
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1/30/2004   Post a comment
A software option has been developed for the GPS7500 noise and interference generators that delivers forth/back frequency sweep capabilities.
Power management IC
News & Analysis  
1/30/2004   Post a comment
The AS3603 power management IC has been developed for mobile communication devices, such as cell phones and PDAs.
Industrie-PC mit zeitgemäßer Prozessorleistung
News & Analysis  
1/30/2004   Post a comment
Mit zeitgemäßen Prozessoren peppt Siemens Automation and Drives seine Industrie-PC der Familien Simatic Box PC 840 und Simatic Rack PC 840 auf. Auch bei der Ausstattung bringt Siemens seine Rechner auf Vordermann.
L'immersion pourrait s'étendre au 22 nm
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1/30/2004   Post a comment
Taiwan Semiconductor Manufacturing Corp. envisage de recourir à la lithographie par immersion pour des couches critiques au 65 nm, à partir de la mi-2005, indique Burn Lin, directeur principal de la technologie du micromodelage chez TSMC.
Analyse : ARM peut-il contrôler le marché des microcontrôleurs ?
News & Analysis  
1/30/2004   Post a comment
Depuis sa création en 1990 sous le nom de Advanced RISC Machines Ltd., ARM a été un fabricant de puces sans puce. L'entreprise a peut-être changé son nom pour ARM et devenue une entreprise cotée en bourse, mais elle a toujours été un fabricant de puces sans puce.
Litho Forum voters stick with 193, 193i tools
News & Analysis  
1/30/2004   Post a comment
A vote among participants at the Litho Forum here Thursday (Jan. 29) heavily favored the use of 193-nm lithography, in both its "dry" and "wet" forms, for use in manufacturing in 2007 and again in 2009.
Trois entités pour la technologie de dépôt par couche atomique pour les DRAM de prochaine génération
News & Analysis  
1/30/2004   Post a comment
Infineon Technologies AG, Genus Inc. et UAlbany Center of Excellence in Nanoelectronics ont signé une lettre d'intention concernant la mise en place d'un partenariat de trois ans d'un montant de 12 millions de dollars. Ce partenariat vise le développement de dispositifs de mémoire de prochaine génération qui utiliseront la technologie du dépôt par couche atomique, également appelée ALD.
Immersions-Lithografie macht Fortschritte
News & Analysis  
1/30/2004   Post a comment
Die Technik der 193-nm-Immersionslithografie nähert sich rasch der Produktionsreife. Auf dem dritten Immersion Lithography Workshop der International Sematech ließen die drei wichtigsten Scanneranbieter durchblicken, dass demnächst mit produktionsreifen 193-nm-Immersionstools zu rechnen sei.
Photonic crystal start-up secures $10 million in VC funding
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1/30/2004   Post a comment
Mesophotonics , a developer of photonic crystal technology, has closed a $10 million second round fund raising.
Synopsys rachète Analog Design Automation
News & Analysis  
1/30/2004   Post a comment
Afin de renforcer ses produits à signaux analogiques et mixtes, Synopsys Inc. a annoncé son intention d'acquérir les actifs d'Analog Design Automation Inc. (ADA), un fournisseur de logiciels d'optimisation de circuits automatisée. Synopsys revendra la technologie de façon autonome et l'intégrera dans ses simulateurs HSpice et NanoSim.
NTIA to referee wideband interference debate
News & Analysis  
1/30/2004   Post a comment
The Multiband-OFDM Alliance this week agreed to join Motorola in independent tests being performed by ITS Labs (Boulder, Colo.) to evaluate the interference characteristics of their respective ultrawideband proposals, EETimes has learned.
U.S. to referee UWB interference debate
News & Analysis  
1/30/2004   Post a comment
The Multiband-OFDM Alliance this week agreed to join Motorola Inc. in independent tests being performed by ITS Labs to evaluate the interference characteristics of their respective ultrawideband proposals.
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