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posted in February 2013
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China's cyberespionage will continue unabated, say experts
News & Analysis  
2/28/2013   7 comments
Security experts at the RSA Security Conference weigh in on reports of information-stealing attacks and cyberespionage by China.
Intel will make 14nm FPGAs for Altera
News & Analysis  
2/28/2013   2 comments
Intel will let Altera make FPGAs in its 14nm FinFET process in a deal that turns up the heat on TSMC in foundry and Xilinx in high-end FPGAs.
The Life of (a Raspberry) Pi
Product News  
2/28/2013   1 comment
Break out the party hats – the folks at element14 are currently celebrating the Raspberry Pi's first birthday!
AMD settles patent dispute with Tessera
News & Analysis  
2/28/2013   Post a comment
Agreement settles pending litigation between two firms. Financial terms not disclosed.
Comms processors up performance for 4G/LTE and multi-radio base stations
Product News  
2/28/2013   Post a comment
The Axxia 5500 family of communication processors by LSI accelerates performance and increase power efficiency for multi-radio base stations and 4G/LTE-capable wireless networks.
GainSpan unveils first single-chip Wi-Fi and ZigBee IP
Product News  
2/27/2013   Post a comment
Multi-standard, multimode chip contains WLAN baseband, RF functions, and a dual IPv4/ IPv6 stack to spur the adoption of the Internet of Things (IoT).
Altium Vault Server: Next-gen electronic design data management platform
Product News  
2/27/2013   Post a comment
Altium Vault Server represents a new generation of the company’s exclusive Vault design data management technology.
Slideshow: Samsung cagey on smartphone SoC at ISSCC
News & Analysis  
2/27/2013   8 comments
Samsung faced down archrivals at ISSCC but showed few details about its Exynos 5 Octa, while Renesas and Mediatek took more open approaches.
Altera's future high-performance FPGAs to use Intel’s 14nm tri-gate technology
Product News  
2/27/2013   5 comments
Intel has been ramping its foundry services for some time now with some smaller FPGA companies – now its nabbed a big FPGA "fish" in the form of Altera.
Quick links to DESIGN West classes
News & Analysis  
2/27/2013   Post a comment
The three new "From Napkin Sketch to Shenzhen" tracks are among 17 other tracks at DESIGN West 2013.
Pericom expands USB 3.0 signal conditioning family
Product News  
2/27/2013   Post a comment
With their small footprint and low power, Pericom’s latest devices are well-suited for mobile devices.
Gigabit Ethernet MAC IP with audio video bridging
Product News  
2/27/2013   Post a comment
Arasan Chip Systems has added AVB (Audio Video Bridging) to its Gigabit Ethernet MAC product family.
Audio engines combine with high-performance MEMS mics for feature-rich sound
Product News  
2/27/2013   Post a comment
STMicroelectronics together with Soundchip, has introduced two High Definition Personal Audio (HD-PA) audio engines, STANC0 and STANC1, and an HD-PA microphone, the MP34AB01H, which enable the creation of feature-rich, software-controlled smart audio accessories.
36.5mm x 22mm buzzer outputs up to 94 dB for alarm equipment
Product News  
2/27/2013   Post a comment
The Sonitron Robust Application standard series (SRA) buzzers are 36.5mm diameter, 22mm deep units designed for automotive applications and process and alarm equipment, with a sound pressure level up to 94 dB.
Wolfson and Sensory demonstrate world's lowest-power speech recognition solution for mobile
News & Analysis  
2/27/2013   Post a comment
Wolfson Microelectronics has worked with Sensory, a leader in speech technologies for consumer electronics to implement Sensory's TrulyHandsfree Voice Control and audio detect front-end on Wolfson’s latest ultra-low power platforms for mobile phone audio channel processing.
Let LTE and quad-core apps processor battle begin
News & Analysis  
2/27/2013   Post a comment
As the Mobile World Congress raises its curtain next week, both Nvidia and Marvell are rushing to announce new smartphone ICs with the mobile industry’s two new “must-have features”: quad-core and LTE modem.
Android, FreeRTOS top EE Times' 2013 embedded survey
News & Analysis  
2/27/2013   15 comments
Android has become the most popular third-party operating system for embedded applications according to a survey of engineers – but as they become more familiar respondents may be starting to shy away from the OS for future projects.
TI introduces breakthrough InstaSPIN-FOC motor control technology
Product News  
2/26/2013   Post a comment
Identify, tune and fully control your motor in less than 5 minutes and eliminate the need for a mechanical rotor sensor. Available on C2000 Piccolo MCUs today!
Firefox goes mobile, LG changes channels for WebOS
News & Analysis  
2/26/2013   9 comments
Mozilla shows off FireFox OS and its partnership with four OEMs and 18 carriers; LG Electronics changes channels for HP's WebOS.
Intel to make 14-nm FPGAs for Altera
News & Analysis  
2/26/2013   39 comments
Intel will build FPGAs for Altera in its 14-nm FinFET process in a deal that turns up the heat on TSMC in foundry and Xilinx in high-end FPGAs.
Sequans gung-ho for LTE Broadcast
News & Analysis  
2/26/2013   3 comments
LTE Advanced enables operators to get into LTE Broadcast -- multicasting popular content simultaneously to multiple devices.
Toshiba samples 64-GB universal flash storage
Product News  
2/26/2013   Post a comment
The JEDEC-compliant interface handles essential writing block management, error correction and driver software.
OCZ unveils SSD with 20-nm flash
Product News  
2/26/2013   Post a comment
The 6 Gb/s SATA III-based MLC drive will come in 220-GB and 240-GB capacities.
Achronix is shipping 22nm Speedster22i FPGAs
Product News  
2/25/2013   Post a comment
Achronix Semiconductor Corporation has begun shipping their industry-leading Speedster22i HD1000 FPGAs to customers.
Full production of entire Xilinx Zynq-7000 All Programmable SoC family
Product News  
2/25/2013   Post a comment
The smartest solution with proven performance, lowest power and unmatched productivity.
Cypress announces revolutionary Gen5 TrueTouch controllers
Product News  
2/25/2013   Post a comment
In addition to unmatched performance with regard to noise, new devices enable in-cell stack-ups and deliver world’s best waterproofing.
What’s under the hood of Sony's PS4?
News & Analysis  
2/25/2013   9 comments
Although Sony did not show the PS4 game console, the spec sheets provide a glimpse of what’s inside in each unit.
Big Data streamlines fabs
News & Analysis  
2/25/2013   2 comments
Streamlined analytics in Microsoft's structured query language cut processing time for wafer fab data at AMD by 90 percent plus boost energy efficiency 10-times at Samsung.
Intel upgrades 32-nm SoC for smartphones
News & Analysis  
2/25/2013   5 comments
Intel will show an upgraded 32-nm processor for smartphones at Mobile World Congress and talk about an upcoming new 22-nm Atom core and SoC.
DESIGN West: Livin' La Vida Mobile
News & Analysis  
2/22/2013   1 comment
MLove Confestival founder Harald Neidhardt foresees "empathetic" electronics, which adapt their functions users' environments.
Non-contacting rotary position sensors offer rotational life of 50 million cycles and more
Product News  
2/22/2013   Post a comment
Bourns has expanded its line of non-contacting rotary position sensors for operation in harsh environments.
Vishay integrates MEPIC resistor on a PCB substrate
Product News  
2/22/2013   Post a comment
Device offers joule or flash ignition for fast firing times down to 250 µs, and features firing energy down to 1.5 mJ.
Data compression IP reduces 3G/4G system costs
Product News  
2/22/2013   Post a comment
IDT’s patent-protected compression IP reduces system cost by enabling the use of low cost fiber to connect RRUs to baseband unit in wireless infrastructure.
AD5689R 16-bit D/A converter targets wide application range
Product News  
2/22/2013   Post a comment
With relative accuracy of ±2-LSB INL, 2-ppm/°C 2.5-V reference, and space saving packages, ADI’s nanoDAC+ converters allow analog designers to address a wider range of applications without having to trade off performance for footprint.
Slideshow: ISSCC spotlights nanotubes, wireless comms
News & Analysis  
2/22/2013   9 comments
Carbon nanotubes, video processing, 60 GHz and processors featured among the highlights from this year's ISSCCC presentations.
Xilinx' fully adaptive Gbps-class PtP microwave modem IP for backhaul apps
Product News  
2/21/2013   Post a comment
1024QAM microwave modem IP solution combines fully programmable hardware and API software for next-generation intelligent broadband wireless solutions.
Reflex CES demos SoC FPGA-based system-on-module (SoM)
Product News  
2/21/2013   Post a comment
Demonstration at Embedded World 2013 (February 26-28, 2013, Nuremberg, Germany) highlights prototyping platform, data recorders, & customizable rugged systems.
TI spins motors in minutes with sensorless, brushless DC motor drivers
Product News  
2/21/2013   3 comments
Integrated motor drivers accelerate product design by eliminating external components and software development.
STMicroelectronics launches LIS3MDL single-chip magnetometer
Product News  
2/21/2013   Post a comment
High-performance magnetometer completes range of magnetic, acceleration and gyroscopic sensors delivering design flexibility.
ADLINK embedded systems support multiple operating systems
Product News  
2/21/2013   Post a comment
ADLINK’s latest Smart Panel series provides high-value cost/performance with a powerful CPU and multiple OS support.
Baidu taps Marvell for ARM storage server SoC
News & Analysis  
2/20/2013   8 comments
China’s Internet search giant will use a Marvell Armada XP ARM-based SoC to power a storage server, one of the first big design wins for an ARM-based server SoC.
Linaro group gives ARM a hand in networking
News & Analysis  
2/20/2013   Post a comment
The newly formed Linaro Networking Group will develop for ARM low-level Linux code for virtualization, real-time tasks and packet processing.
App developers to be given Google Glasses
News & Analysis  
2/20/2013   6 comments
Google is developing a version of its prototype wearable computer that it will share with application developers in an effort to spread interest and create an ecosystem for the concept.
Six firms dominate 300-mm wafer fab capacity
News & Analysis  
2/20/2013   3 comments
Memory and foundry chip makers dominate the upper echelons of IC manufacturers ranked by 300-mm wafer production capacity, with the top six vendors holding nearly 75 percent.
China's Godson processors to power servers in 2014
News & Analysis  
2/20/2013   11 comments
Loongson Technology is sampling a 32-nm Godson server processor and plans to ship a 28-nm version this fall to as many as 10 server makers in China.
Apple processors: Designed differently but here to stay
News & Analysis  
2/20/2013   31 comments
What's next in Apple's iPhone- and iPad- powering A-series processor family? Two experts prognosticate.
Apple processors: Designed differently but here to stay
News & Analysis  
2/20/2013   31 comments
What's next in Apple's iPhone- and iPad- powering A-series processor family? Two experts prognosticate.
ARM and STMicro join with Mathworks to support Cortex-M MCUs
Product News  
2/19/2013   2 comments
Offering first ever MATLAB, Simulink, and Embedded Coder support for Cortex-M processor-based MCUs.
Sensory's mega-cool TrulyHandsfree voice control 3.0
Product News  
2/19/2013   1 comment
Accurate voice user interfaces with biometric security and ID; Sensory's TrulyHandsfree voice control is enhanced with user defined triggers and passphrases.
DESIGN West: How to win with Kickstarter
News & Analysis  
2/19/2013   9 comments
Learn from entrepreneur Bob Baddeley's failure and his friend's success as he talks crowd-sourced funding for startups.
Page 1 / 3   >   >>


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