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posted in April 2007
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RF module operates in 868-MHz ISM band
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4/30/2007   Post a comment
One RF Technology has introduced a low-cost, 868-MHz RF module dubbed TinyOne Lite that is optimized for low-power radio communication at a competitive cost and available with or without an integrated antenna.
CEO interview: Microchip's Steve Sanghi
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4/30/2007   Post a comment
In 1990, Steve Sanghi joined Microchip Technology Inc. when the firm was flat on its back and near liquidation.
High-power diode laser bars offer simplified integration
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PulseLife Horizontal Arrays are Coherent Inc.'s new series of diode laser packages that deliver high-power output while offering simplified water-cooling requirements.
Linear launches quad-channel 2.25-MHz DC/DC converter
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4/30/2007   Post a comment
Linear Technology has developed a quad channel, high efficiency, 2.25-MHz, synchronous buck regulator that delivers up to 300mA, dual 200mA and 100mA continuous outputs from a 3mm x 3mm QFN package.
DC/DC converter is drop-in replacement for old, new designs
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4/30/2007   Post a comment
Ericsson Power Modules' latest DC/DC converter platform, the PKY4716PI, uses the industry-standard full-brick format and footprint, making it a suitable drop-in replacement for applications in the telecom and industrial sectors.
Nu Horizons expands European presence
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Electronics distributor Nu Horizons opens a subsidiary in Munich. From here, the company plans to serve Germany and its eastern neighbor countries.
IRCONA joins the Lattice LEADER design services program
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Lattice welcomes new partner IRCONA's electronic product development expertise to the Lattice LEADER design services program.
1 W DC/DC converter suitable for small-design applications
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C&D Technologies extended their NMJ series of low-power DC/DC converters to include eight single-output models. The devices are UL60950 safety-standard approved, 1 W converters.
U.S. will not oppose IEEE patent disclosure policy
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The Justice Department said it will not oppose on antitrust grounds the IEEE's proposed policy for disclosing patents in standards deliberations.
PMICs enable smaller design of DC/DC converters, LDOs
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Maxim Integrated Products introduced the MAX8667/MAX8668, a 4-channel power-management ICs (PMICs) in a 9 mm2 TQFN package. These PMICs minimize total design size by integrating two step-down DC/DC converters and two low-input, low-dropout regulators (LDOs), as well as all feedback networks.
HD-AVC/DOCSIS platforms target high-definition PVR applications
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4/30/2007   Post a comment
Conexant Systems announced the availability of two OpenCable-compliant cable set-top box (STB) reference designs for high-definition (HD) personal video recording (PVR) applications.
GUI console targets SNMP-capable midspans
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Phihong developed a GUI (graphical user interface) console for use with their simple network management protocol (SNMP)-capable midspans.
Compact MEMS flow sensors detect clogged filters, protect equipment
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Omron Electronic Components developed the D6F-W and D6F-V series of MEMS flow sensors, which have the ability to measure air velocity and volume. The D6F-W01A1 measures a flow range of 0 to 1 m/s and the D6F-W04A1 a range of 0 to 4 m/s. Both exhibit a ±5% full-scale repeatable accuracy, while the D6F-V measures a flow range of 0 to 3 m/s with a ±10% full-scale repeatable accuracy.
Micro fuel cells to hit mainstream in 2010
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4/30/2007   Post a comment
Despite a flurry of announcements and investments in micro fuel cells for portable devices, the technology is not expected to become a mainstream product until 2010 or so, according to an expert in the arena.
MP3 chip market sees new landscape
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Despite the growth of MP3 player sales, the market for controller chips for these products is seeing intense price erosion as new competitors enter the fray, according to iSuppli Corp.
Epoxy preform remains flexible under thermal cycling
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Designed for under-the-hood automotive applications, Multi-Seals Inc. introduces the Uni-Form M5-82 linear epoxy preform that remains flexible under temperature changes.
Sager, APP pen distribution pact
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Sager Electronics announced it has been selected to distribute Anderson Power Products throughout North America.
IC Manage announces hardware/software design management platform
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GDP (Global Design Platform) from IC Manage facilitates scalable, collaborative, IC (FPGA, ASIC, SoC) and system-level electronic designs.
Cradle rescued by funding, says analyst
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After nearly going under, Cradle Technologies Inc. has secured some funding to sustain its operations, according to an analyst.
Town hall to discuss nanotech standards
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The IEEE will hold a town hall meeting at the NSTI Nanotech Conference 2007 next month to discuss its completed Nanoelectronics Standards Roadmap (NESR).
MSC to distribute Hitachi displays in France
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Seeking to expand its market share in Europe, Hitachi Display Products Group has added MSC to its distribution network in France.
Tiny encoder delivers 318 LPI resolution
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Avago says its high resolution AEDR-8400-14x surface-mount optical encoders are the industry's smallest with dimensions of 3 x 3.28 x 1.26-mm.
ST selects Obducat nano-imprint litho for R&D
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STMicroelectronics has placed an order for a nano-imprint lithography (NIL) R&D system from Obducat AB to be used in a post-silicon R&D unit for development purposes. Obducat has also produced stampers that are being used in this assessment project.
Israeli tech companies raised $406 million in 1Q
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During the first quarter of 2007, 121 Israeli high-tech companies raised $406 million from venture investors — both local and foreign.
Electronic displays to revolutionize lighting
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An international three-year project, partly funded by the European Union, has been launched with the objective to mass-produce organic light emitting devices (OLEDs).
Qimonda's Loh banking on DRAM market comeback
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One year into his tenure as CEO of the world's third largest DRAM maker, Qimonda's Kin Wah Loh is out to prove that his company can be nimble and aggressive rather than a problematic memory division of its parent company, Infineon Technologies AG.
Hidden IP: booby trap or buried treasure?
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Standards bodies are reviewing their procedures for dealing with intellectual-property (IP) rights, many of them focusing on patent and licensing disclosure.
Ixia moves test chassis to desktop
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Nomination du président du directoire de l'AII
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L’Agence de l’Innovation Industrielle a annoncé la nomination, par décret du Président de la République en date du 10 avril 2007, de Jacques Bongrand en tant que membre et président du directoire.
Carbon film resistors offer less than 3 watts for commercial apps
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IRC offers the CCF series of commercial-grade low-power carbon film resistors for consumer electronic devices.
Micro fuel cells to hit mainstream in 2010
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Despite a flurry of announcements and investments in micro fuel cells for portable devices, the technology is not expected to become a mainstream product until 2010 or so, according to an expert in the arena.
Under the Hood: Inside Microsoft's Xbox 360 Elite
Teardown  
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In the wake of its Sony Playstation 3 and Nintendo Wii video teardowns, Semiconductor Insights kept the cameras rolling as it took apart the new Xbox 360 Elite to see just how Microsoft plans to stay competitive in the hotly contested, three-way gaming platform market.
Atmel blames ex-CEO for option snafu
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Atmel Corp. announced that its board has completed its independent investigation regarding the company's past stock option grants and practices.
Analysts see positive chip indicators
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There was a lot of doom and gloom in the air about semiconductors until now. Analysts are slightly more bullish about the industry after relatively strong chip sales in March.
Qimonda's Loh banking on DRAM market comeback
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Kin Wah Loh, CEO of Qimonda, is out to prove that his company can be nimble and aggressive rather than a problematic memory division cramping the style of its parent company, Infineon Technologies.
Interactive Intelligence Completes IP PBX
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Integration for Microsoft Exchange Server 2007 Unified Messaging aims to minimize the cost and complexity of custom unification.
K&S posts loss, sales drop
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Chip-equipment provider Kulicke & Soffa Industries Inc. (K&S) said net revenue from continuing operations for the second quarter was $142.7 million, compared to $152.3 million for the previous quarter and $160.3 million for the comparable year-ago quarter.
Hidden IP: booby trap or buried treasure?
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4/30/2007   Post a comment
If the process by which technology standards are forged and implemented isn't broken, it is surely straining under the weight of globalization, relentless technological change, patent-infringement and antitrust lawsuits as well as increasingly noisy standards battles among competing industry consortia.

DFM: just what doctor ordered
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As design-for-manufacturing and design-for-yield take on critical importance at the 65-nanometer node, discussions proceed apace about how best to handle them. At the recent Design Automation and Test in Europe conference here, experts from chip, EDA and foundry companies used a medical metaphor to frame the debate, asking whether it's better to be "surgeons" who deal with DFM and DFY issues at tapeout or "family doctors" who, with an eye toward prevention, minister to the design starting at the
Cisco rolls deep-packet-inspection ASIC for Catalyst card
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4/30/2007   Post a comment
Cisco Systems Inc. is adding a deep-packet-inspection ASIC to its 65xx Catalyst switching line, challenging com- petitive single-function appliances for local-area networks.

Meru stresses hardware flexibility for 802.11n nets
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Meru Networks Inc., which has blazed its own trail in 802.11b/g media access control chips to gain system-level advantages, is going for multiple unique attributes in its 802.11n networks.

High luminance 2.7-inch LCD modules target industrial applications
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NEC Electronics America adds three high luminance 2.7-inch QVGA amorphous silicon color LCD modules to its portfolio of TFT-LCD modules for industrial mobile applications.
BenQ refocuses on ODM business to survive
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BenQ Corp. pulled a U-turn last week, opting to spin off its branded business instead of its manufacturing division in an effort to find firm footing after a disastrous attempt to become a household name.

MEMS exec sees billion-dollar markets
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Microelectromechanical systems (MEMS) are poised to leverage the economies of scale that have driven the semiconductor industry, enabling a bright future of new devices with lower cost, superior performance and increasingly diminutive size. So says MEMS expert Kaigham (Ken) Gabriel, the co-founder of Akustica Inc. (Pittsburgh) and a veteran MEMS developer.

Promise, peril in going green
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4/30/2007   Post a comment
Don't worry, this is not another commentary about climate change, although I do know that simulations can be very sensitive to assumptions in their underlying models and to errors in the input data. (As physics Nobel laureate Niels Bohr said, "Prediction is very difficult, especially if it's about the future.") My concern is about the R&D structure that will arise as society attempts to reduce the possibility of global warning through new and improved energy sources, greater efficiency and
Pushing for 'another record year'
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4/30/2007   Post a comment
Despite a seasonal slowdown in the overall semiconductor industry, Microchip Technology Inc. last week smashed Wall Street's estimates for its fourth fiscal-2007 quarter and broke the $1 billion plateau in annual sales for the fiscal year.

Designer's woes inspire FPGA verification tool
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4/30/2007   Post a comment
There are far more FPGA design starts than ASIC design starts, but far fewer FPGA verification tools.
Networks: Ethernet card challenges Infiniband
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NetEffect Inc. (Austin, Texas) claims that its dual-port 10-Gbit/second Ethernet card closes in on the throughput, latency and cost of Infiniband, currently the performance leader in data center networking. The NE020 card implements the iWarp standard, defined more than five years ago to create a high-performance version of Ethernet using the techniques baked into Infiniband.

Samsung uses direct metal links in DRAM stack
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4/30/2007   Post a comment
Samsung Electronics scored a win last week in what is shaping up to be an industrywide effort to accelerate the development of direct metal connections between chips. Samsung completed the task in an all-DRAM stacked package--the first of its kind, according to the company.

Standards not quite a 'hot topic' in Beltway
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4/30/2007   Post a comment
The word "innovation" is on the lips of nearly every politician and half the lobbyists in Washington. But when it comes to the technical standards that form the underpinnings of U.S. innovation, the subject is "a real killer at a cocktail party," said Don Deutsch, vice president for standards strategy and architecture at Oracle Corp.

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