IDF: Rambus group tackles cost issues News & Analysis 8/31/1999 Post a comment A Rambus DRAM Implementers Forum, announced Tuesday will consider ways to trim costs associated with the Rambus memory architecture, including taking a common approach to reducing the number of memory banks in the current Direct RDRAM design.
Spice utility addresses process variations News & Analysis 8/31/1999 Post a comment Process variations are becoming a significant problem for sub-0.25-micron chip design, but designers traditionally have not had an accurate way to predict them. A technology-CAD (T-CAD) company, PDF Solutions, is trying to change that by aiming its new Circuit Surfer tool at designers.
S3 adds transform and lighting to graphics chip News & Analysis 8/31/1999 Post a comment S3 Inc. has incorporated a transform and lighting engine in its latest product, the Savage2000. The addition showcases the next major wave in graphics-engine technologies and further suggests that the once-dominant company may be on a comeback.
Two power utilities unite for national fiber-optic net News & Analysis 8/31/1999 Post a comment New Century Energies Inc., a holding company over several state power utilities and new communication subsidiaries, is partnering with Touch America Inc. (Butte, Mont.) to create an 18,000-mile fiber-optic network to challenge the new crop of fiber interexchange carriers (IXCs).
Synopsys offers "term-value" tool licenses News & Analysis 8/31/1999 Post a comment Synopsys Inc. Wednesday (Sept. 1) will roll out one-, three- and five-year "term value licenses," EE Times has learned. While the licensing approach might appear at first glance similar to the ill-fated three-year flexible access model (FAM) licenses used at Cadence Design Systems, Synopsys insists it's taking a different approach that won't artificially inflate revenues.
Shaky Olicom sells token-ring business News & Analysis 8/31/1999 Post a comment Olicom A/S today (8/31) announced the sale of its token-ring LAN business, including chip, board and system-level products, to Madge Connect, an arm of Madge Networks N.V. (Wexham Springs, U.K.). The sale could augur even more serious shakeouts at Olicom, coming on the heels of yesterday's sudden resignation announcement by chief technology officer Niels Jorgensen and the company's postponement of its earnings report for the June-ended quarter in anticipation of the "sale of other activities."
Satcom provider ICO files for bankruptcy News & Analysis 8/31/1999 Post a comment ICO Global Communications Ltd. has filed for Chapter 11 bankruptcy, leaving the Globalstar consortium as the only low-earth-orbit satellite communications provider still planning to do business as usual.
Temic inks SiGe deals with Anadigics, M/A COM News & Analysis 8/31/1999 Post a comment Anadigics Inc. has signed a joint development agreement on silicon germanium with Atmel Corp. subsidiary Temic Semiconductors Inc. (Heilbronn, Germany), the second SiGe deal the German company has inked in as many weeks. On Aug. 24, Temic joined hands with AMP Inc. subsidiary M/A-COM Inc. (Lowell, Mass.) to jointly design and manufacture SiGe ICs for RF/IF telecommunications applications.
Apple unveils PowerPC G4 News & Analysis 8/31/1999 Post a comment Claiming ownership to a "supercomputer on a chip," Apple Computer Inc. revealed details of the PowerPC G4 processor Tuesday (Aug. 31) at the Seybold trade show here.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.