China stimulus seen as opportunity for IC firms News & Analysis 8/31/2009 Post a comment Market research firm Gartner advised semiconductor firms to step up efforts to work with Chinese manufacturers in order to cash in on a rise in that country's domestic demand being driven by a government subsidy program for home appliances.
Magma posts loss, amends tender offer News & Analysis 8/31/2009 Post a comment Magma Design Automation posted a loss in accordance with generally accepted accounting principles of $4.3 million on revenue of $28.8 million for the first quarter of its fiscal 2010, the company reported last week.
Globalfoundries in multi-year contract with Cadence News & Analysis 8/31/2009 Post a comment Foundry services provider Globalfoundries has signed a multi-year technology contract with semiconductor design software vendor Cadence Design Systems. The deployment covers large parts of the design chain including verification and manufacturing.
European chip vendors research manufacturing advantage News & Analysis 8/31/2009 Post a comment A group of European chip manufacturers and academic institutions have gathered in a research project aiming at improving the competitiveness of European chip industry. The 'IMPROVE' project focuses on specific aspects of chip semiconductor production: virtual metrology and predictive maintenance.
Newsbits: Broadband flood, iPhone in China Product News 8/28/2009 Post a comment Two separate signs of growth in communications hit today as the U.S. government reported it received nearly 2,200 applications requesting nearly $28 billion in stimulus funding for proposed broadband projects and Apple struck a deal with China Unicom to sell the iPhone in China.
HSL to provide femtocells directly to mobile users Product News 8/28/2009 Post a comment HSL (Hay Systems Ltd), a provider of mobile infrastructure, is making their HSL 2.75G Femtocell available directly from the company to mobile users around the world to improve mobile service availability for 2G and 3G mobile users.
Gateways, Web shape next-gen home networks News & Analysis 8/28/2009 Post a comment Tomorrow's home networks will be shaped by a race to bring the Web to digital home products and the rising influence of service providers, according to a market watcher Parks Associates in an online talk.
IBM visualizes single molecule structure News & Analysis 8/27/2009 Post a comment Scientists at IBMs Zurich laboratory have succeeded to visualize the structure of an individual molecule using non-contact atomic force microscopy (AFM). The move is a further step to a still very distant future: Molecular electronics.
Group bids to spend $178M on smart grids News & Analysis 8/27/2009 1 comment A team of utilities, vendors and research groups has submitted a five-year, $178 million proposal to the U.S. Department of Energy to build a smart electric grid demonstration system in the Pacific Northwest region, one of more than 400 bids for economic stimulus grants the DoE has received, contending for as much as $3.9 billion in government funds aimed at accelerating work on smart grids.
Nvidia offers $5,000 in prizes to Cuda programmers News & Analysis 8/27/2009 1 comment Graphics chipmaker Nvidia Corp. (Santa Clara, Calif.) has said it plans to offer prizes totaling $5,000 to five programmers who use the Cuda parallel programming environment to solve the first of a series of challenges.
Ethernet no threat to FlexRay, NXP says Product News 8/27/2009 Post a comment Recent discussions to establish Ethernet in automotive applications are no threat to the position of FlexRay as the data transmission technology of choice for safety critical applications, believes NXP as one of the founding members of the FlexRay Consortium.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.