U.S. Protecting Us from AI News & Analysis 10/21/2016 2 comments From lost jobs to nuclear holocaust, any negative impact artificial intelligence could have on society is what the U.S. government wants to head-off.
4DS Memristors Target ReRAMs News & Analysis 10/20/2016 6 comments 4DS Memories Ltd. (West Perth, Western Australia) has achieved the 40-nanometer milestone that puts it on the path to competing effectively with flash it its $40 billion market.
IoT Hears LTE Calling News & Analysis 10/19/2016 Post a comment Qualcomm said AT&T, Verizon and five module makers will use its chip for Cat-M1 and NB1 trials this year and commercial services in 2017.
CEA-Leti: What Crickets Can Teach Us News & Analysis 10/19/2016 Post a comment Bio-inspired research is picking up momentum. But where CEA-Leti’s approach differs from others, more focused on neuromorphic engineering by mimicking the brain, is that “we take a full system approach,” according to Leti’s science director.
Oxygen Layer May Extend Moore's Law News & Analysis 10/19/2016 2 comments Mears Silicon Technology (MST) at Atomera Inc. (Los Gatos, Calif.) increases the carrier mobility and drive current, while reducing the leakage current for any CMOS transistor.
Full Color e-Posters Could Reach 10,000 DPI News & Analysis 10/18/2016 1 comment Researchers from the Chalmers University of Technology (CUT) have demonstrated that plasmonic nanostructures combined with electrically-tuneable polymers could yield just any color on demand.
Large Flexible Fingerprint Sensor Reaches 500dpi News & Analysis 10/18/2016 Post a comment FlexEnable together with ISORG have jointly launched a flexible fingerprint sensor with an image resolution of 500 dots per inch (dpi). Only 0.3mm thick, the flexible optical sensor is suitable for applications requiring standard-compliant fingerprint enrolment and/or identification.
Germany Hits Tesla, Raises Bigger Issues News & Analysis 10/17/2016 16 comments The German Transport Minister requested Tesla to stop advertising its EV’s Autopilot function. The question is whether this is a result of concerted efforts by German automakers “looking for a way to ‘clip Tesla’s wings,’ asked one analyst.
Bloomberg in France Advises Startup Crowd News & Analysis 10/14/2016 Post a comment Michael Bloomberg, CEO of Bloomberg, and Emmanuel Macron, former French Minister of Economy, came on stage together at a two-day conference in Paris, talked to the entrepreneurs about startups, roles of the government and taking risks.
Salaries Rise, Gaps Widen for EEs News & Analysis 10/14/2016 1 comment Salaries for electrical engineers rose 3.85% in 2015 but gender and racial gaps in incomes widened significantly, according to a the latest survey from the IEEE.
IBM Weaves New 25G Link News & Analysis 10/14/2016 5 comments IBM announced OpenCAPI, a 25G interconnect for processors, accelerators and memories with backing from seven partners.
IoT Startup Taps Blockchain News & Analysis 10/13/2016 1 comment Startup Filament has developed an end node for the industrial Internet of Things than extends the LoRa network and uses blockchain as part of its security.
TSMC Grows Share of Foundry Business News & Analysis 10/13/2016 Post a comment Taiwan Semiconductor Manufacturing Co. increased its share of the foundry business to 55 percent this year on better than expected demand for smartphones during the third quarter.
V2X Mandate: It’s Now Or Never News & Analysis 10/13/2016 11 comments Connected Car proponents insist that the V2X mandate should be issued in the last 100 days of the Obama administration. Without the federal government’s commitment, they warn that V2X might never come to fruition in the United States.
Did Processor Cause Samsung Note 7 Blowup? News & Analysis 10/12/2016 35 comments It’s far from clear what caused Samsung Note 7 to catch fire. But a new report emerged that the culprit might not be the lithium-ion batteries. Rather, the problem might reside in tweaks made to the processor.
Daimler: First to Go Wireless Charging News & Analysis 10/12/2016 6 comments The upcoming 2017 Mercedes-Benz S550e will become the first commercially available plug-in hybrid featuring Qualcomm’ wireless electric vehicle charging (WEVC) technology.
Achronix Brings eFPGA IP to SoC News & Analysis 10/11/2016 5 comments Achronix has declared that the embedded FPGA — which chip designers can simply drop into their own SoC designs with wire-to-wire connections — is no longer a pipe dream. It’s here and shipping, said Steve Mensor, Achronix executive.
Infineon Acquires LidarExpertise Through Innoluce Takeover News & Analysis 10/11/2016 Post a comment With the takeover of Dutch fabless MEMS company Innoluce is Infineon complementing its sensor assortment for the booming market of technology for automated driving? Innoluce’s expertise will help Infineon to close its gap in the future-prone field of lidar sensors.
Specs Pave Roads Around Xeon News & Analysis 10/11/2016 3 comments Two groups – CCIX and Gen-Z—announced chip interconnects meant to provide open alternatives for the data center to Intel’s Xeon interfaces.
IoT Consumer Groups Merge News & Analysis 10/10/2016 2 comments The Open Connectivity Foundation and AllSeen Alliance will blend their open-source environments into a consumer alternative to Apple’s Homekit and Google’s Weave.
Patent Study IDs Nuisance Suits News & Analysis 10/7/2016 2 comments The U.S. Federal Trade Commission called on courts and Congress to put reduce a class of nuisance patent suits from so-called patent trolls.
Intel's Stratix 10 FPGAs, SoCs Sampling News & Analysis 10/6/2016 3 comments Devices like Stratix 10 FPGAs will help satisfy the insatiable demand for higher computational capabilities, lower latency, greater system flexibility, and increased power efficiencies
Lam/KLA Failure Cools M&A News & Analysis 10/6/2016 Post a comment Regulators struck down a proposed merger of Lam Research and KLA-Tencor, signaling collaboration will be the focus in process technology.
Startup Digs Deep Learning, Snags Big Backers News & Analysis 10/6/2016 3 comments ThinCI, architecture designer for deep learning graph analysis, has come out of stealth mode. The startup picked up Denso and Magna as its investors, while Dadi Perlmutter, former Intel executive vp is giving the startup’s technology a thumbs-up.
NXP Pushes Hardware Isolation in i.MX8 News & Analysis 10/5/2016 4 comments In response to the growing demand for advanced HMI, NXP launches new apps processors dubbed i.MX8. Its beauty lies in the safety and reliability inherent in its architecture. It comes with built-in hardware-based virtualization and domain protection.
NXP Rides Growing Motor Control MCUs News & Analysis 10/5/2016 Post a comment Carmakers are eager to squeeze more comfort and convenience into their cars. Inevitably, they will have to install more motor control chips into their vehicles. NXP is launching new motor control MCUs along with software and new tools.
Flash Extends Life of Magnetic Tape Machines News & Analysis 10/4/2016 1 comment Magnetic tape has long been a stalwart storage technology, and machines are still alive and well in many industries where it doesn't make financial sense to upgrade to more modern technologies
Toyota: Hydrocar as 'Power Bank' 20 Years out News & Analysis 10/4/2016 7 comments Toyota brought to Paris Toyota FCV (Fuel Cell Vehicle) PLUS. It uses compressed hydrogen as its fuel source. Toyota proposes the FCV PLUS will be also used as a “generator” for homes, other cars and local power grids.
TSMC Staffing R&D for 3nm Process News & Analysis 10/4/2016 9 comments TSMC will actively develop 5nm process technology, while dedicating R&D personnel to work on 3nm, ultimately aiming at 1nm, reports Taiwanese magazine CTimes.
X-Fab to Swallow Altis Semiconductor News & Analysis 10/4/2016 1 comment Analog, mixed-signal and MEMS foundry group X-Fab Silicon Foundries AG (Erfurt, Germany) is set to announced the assets of Altis Semiconductor (Corbeil-Essonne, France) out of insolvency proceedings.
Sony-Inside Huami Watch: Is It Time for FD-SOI? News & Analysis 10/4/2016 2 comments Without any visible end products, FD-SOI has struggled to overcome the skepticism of many engineers. Finally, it’s official. And it’s a watch. Sony’s GPS chip -- built on 28-nm FD-SOI process -- is powering a smartwatch by Huami, Xiaomi’s sub-brand.
Biometrics May Replace Phone Passwords News & Analysis 10/3/2016 4 comments FotoNation, a wholly owns subsidiary of Tessera Technologies, Inc. (San Jose, Calif.) has unveiled a suite of face- and iris-recognition algorithms that it hopes to license to every major smartphone maker to obsolete the password without the added hardware of fingerprint recognition.
For IoT, Silicon Labs Buys RTOS Vendor Micrium News & Analysis 10/3/2016 2 comments Silicon Labs announced Monday the acquisition of Micrium, a supplier of real-time operating system software. The move effectively positions Silicon Labs as the only IoT chip vendor offering multiprotocol wireless MCUs complete with an embedded RTOS.
5G Powered by MEMS News & Analysis 10/3/2016 1 comment SiTime claims to have beat quartz crystals at their own game with its Elite line of microelectromechanical system (MEMS) oscillators for 4G and 5G applications.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.