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posted in December 2011
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Eurotech's Catalyst CV embedded computer with Intel Atom N2000 launches in Q2 2012
Product News  
12/31/2011   Post a comment
Eurotech's Catalyst CV embedded computer module is based on the Intel Atom processor N2000, and offers dual-core performance capabilities with enhanced multimedia and a greater choice of operating environments, while using very little power. 
Tegal sells nanolayer deposition patents
News & Analysis  
12/30/2011   4 comments
Chip equipment vendor Tegal said it has sold more than 30 patents from its nanolayer deposition patent portfolio for about $3.6 million.
Kyocera offers lifetime LCD supply
News & Analysis  
12/30/2011   9 comments
A lifetime supply of liquid-crystal displays is being guaranteed to original equipment manufacturers by Kyocera, which recently extended its acquisition of LCD and touchscreen suppliers by purchasing Optrex.
VersaLogic announces multi-I/O expansion modules for SUMIT products
Product News  
12/29/2011   Post a comment
VersaLogic Corp. has launched their M1 line of expansion modules, providing industry-standard I/O interfaces for SUMIT-based embedded systems.
Tessera subsidiary buys 73 MoSys patents
News & Analysis  
12/29/2011   4 comments
Invensas, a subsidiary of technology licensor Tessera Technologies, said it purchased 73 memory chip technology patents from MoSys for $35 million in cash.
EE Times' top ten cloud stories in 2011
News & Analysis  
12/29/2011   8 comments
The most popular cloud computing stories of 2011 were about big vendors jumping in and engineers coming to grips with this emerging space.
Chinese foundries confirm merger
News & Analysis  
12/29/2011   9 comments
Hua Hong Semiconductor and Grace Semiconductor Manufacturing, China's second and third largest foundries, said they completed a merger between the two companies.
UMC tips 0.11-micron aluminum BEOL process
News & Analysis  
12/29/2011   1 comment
UMC claimed to be the first foundry to provide a specialized 0.11-micron aluminum process in the company's 200-mm fabs.
EE Times 10 most read news stories of 2011
News & Analysis  
12/28/2011   5 comments
Here, we present the 10 most widely read news stories on EETimes.com in 2011.
Intel rolls 32-nm Atom, preps 22-nm Ivy Bridge
News & Analysis  
12/28/2011   12 comments
Intel rolled out 32 nm Atom chips for netbooks and embedded systems and is reportedly planning to release its 22 nm Ivy Bridge notebook and desktop CPUs in April.
Report: TSMC mulls New York investment
News & Analysis  
12/28/2011   30 comments
Foundry giant TSMC is considering making an investment in New York state, according to a report by Taiwan's Central News Agency.
Raspberry Pi foundation readies $25 PC for launch
News & Analysis  
12/28/2011   30 comments
British not-for-profit foundation Raspberry Pi has said its credit-card sized $25 PCs will become available for sale next month, once they emerge from final beta testing.
Intel's Medfield benchmarks leaked
News & Analysis  
12/27/2011   13 comments
Purported specifications and benchmarks of Intel’s upcoming 32nm Medfield platform have been leaked online, detailing performance figures set to rival if not beat current chip market leaders in the tablet space.
NTT Docomo tips fabless JV for mobile chips
News & Analysis  
12/27/2011   4 comments
NTT Docomo, Japan's largest wireless carrier, said it reached a basic agreement with five chip companies to establish a fabless joint venture to develop and sell semiconductors for handsets and other mobile devices.
Can Apple make a better Web TV?
News & Analysis  
12/27/2011   23 comments
Can Apple crystallize the emerging concept of a Web-connected TV into a must-have product as it has done with MP3 players, smartphones and tablets?
Soitec to acquire Alatech Semi
News & Analysis  
12/27/2011   Post a comment
Electronic materials vendor Soitec said it would acquire all of the outstanding shares of French chip equipment company Alatech Semiconductor by the end of January 2012.
Invest in mobile, not PC in 2012 say financial analysts
News & Analysis  
12/27/2011   13 comments
Investment bank Canaccord Genuity has unveiled its top tech picks for 2012, with Qualcomm and Apple topping the list, while investors were warned to be wary of buying Intel stock in the coming months.
Back Story
News & Analysis  
12/27/2011   6 comments
We have compiled our “Confidential Top 10,” the ten most well-read EE Times Confidential stories this year. We have also put together "back stories," illustrating what have motivated us to go after a specific story.
ESL, down under style
News & Analysis  
12/26/2011   2 comments
I love it when I discover new EDA companies, especially those in the ESL field. Introducing VWorks…
LG Display to demo 55-in OLED TV at CES 2012
News & Analysis  
12/26/2011   5 comments
LG Display has developed a 55-inch TV panel with organic light emitting diodes as a demonstration that active matrix OLED technology can be applied cost efficiently to large panel sizes.
IHS: Wireless infrastructure gear market grew 9% in 2011
News & Analysis  
12/23/2011   5 comments
Global spending on wireless infrastructure equipment is set to return to growth in 2011 after two years of decline and stagnation, according to market research firm IHS iSuppli.
Boston-Power raises $30 million for China pot
News & Analysis  
12/23/2011   6 comments
Boston-Power Inc., a Massachusetts startup that is developing longer lasting, faster charging lithium-ion batteries aimed mainly at automotive applications, has announced it has raised an additional $30 million in private equity.
Broadcom takes Rambus license
News & Analysis  
12/22/2011   2 comments
Broadcom signed a patent license agreement giving the company access to Rambus technology in its ICs.
Touchscreens adopt on-cover over in-cell
News & Analysis  
12/22/2011   3 comments
LCD vendors worldwide are being pressured by smartphone and tablet makers to quickly integrate touch into the display itself, using in- or on-cell sensors, but slow development has prompted add-on touchscreen vendors to offer interim sensor-on-cover, touch-on-lens, and similar one-glass solutions, at least for 2012.
Inside Sony's Vita: IBM, Toshiba, Avago
News & Analysis  
12/22/2011   12 comments
IBM, Toshiba, Qualcomm and Avago won significant sockets inside Sony's Playstation Vita handheld game console, according to a teardown by UBM TechInsights.
Lead-free auto power MOSFETs come in standard TO packages
Product News  
12/22/2011   2 comments
Diffusion-soldering die-attach approach permits producing lead-free packages.
Linear Technology LTC2863 RS485 transceivers
Product News  
12/22/2011   Post a comment
Linear Technology's latest RS485/RS422 transceivers eliminate field failures without the need of costly external protection devices.
Indian chip firm hits rare milestone
News & Analysis  
12/22/2011   11 comments
An announcement by Cosmic Circuits that it has shipped 12 million ICs so far didn't garner a lot of attention internationally, but made waves here because it marks the first time an Indian chip company has attained such numbers.
Molex’s CMC 154-circuit header in compliant-pin mount and 32- and 112-circuit solder-mount headers
Product News  
12/22/2011   Post a comment
Molex's CMC 154-circuit header in compliant-pin mount and 32- and 112-circuit solder-mount headers offer robust, sealed, wire-to-board connection systems for high-conductivity, high-vibration powertrain applications.
Accelerated Android 4.0 available on ARM development boards
News & Analysis  
12/22/2011   5 comments
Linaro, a not-for-profit engineering organization that works with open-source software for the ARM processor architecture, has announced downloadable builds of v4.0 of the Android operating system on development boards from Samsung and ST-Ericsson.
Power semi market to grow 5% in 2012, says IMS
News & Analysis  
12/22/2011   5 comments
The global power semiconductor market will grow by 5.0 percent in 2012 to $32 billion after growing by 3.7 percent in 2011, according to market research firm IMS Research.
Chip sales for smart meters set to double
News & Analysis  
12/21/2011   13 comments
Sales of semiconductors used in smart electricity meters are projected to grow to $1.1 billion in 2016 from $505.6 million in 2011, due to rapid growth expected for the devices, according to market research firm IHS iSuppli.
Micron posts loss on declining memory ASPs
News & Analysis  
12/21/2011   2 comments
U.S. memory chip vendor Micron Technology posted its second consecutive quarterly loss, saying declining average selling prices for memory chips outstripped shipment bit growth.
XIMEA introduces USB 3.0 5Gbps industrial camera
Product News  
12/21/2011   2 comments
XIMEA GmbH claims to set a new benchmark for high-speed industrial cameras with the introduction of the MQ series USB 3.0 SuperSpeed industrial machine vision cameras.
10 notable blunders of 2011
News & Analysis  
12/21/2011   21 comments
As with any year, 2011 contained its share of blunders in the electronics world that will be remembered for years to come.
Compact 1.5 W DC/DC converters target high-vibration applications
Product News  
12/21/2011   Post a comment
An enclosed BPA package houses the transformer, control circuitry, and power switches for interconnect reliability.
DSOs have 2.4 Mpts memory and LAN interface
Product News  
12/21/2011   Post a comment
The 2540B and 2542B oscilloscopes from B&K Precision offer bandwidths of 60 MHz and 100 MHz respectively with 1 GSa/s sampling rates.
Space firsts, lasts in 2011
News & Analysis  
12/21/2011   9 comments
We reprise space firsts and lasts of 2011, a year during which planetary exploration thrived and the work-horse space shuttle flew its last mission to the International Space Station.
Vivante claims top GPU spot in China TD phones
News & Analysis  
12/21/2011   3 comments
Graphics IP licensor Vivante Corp. claims to be providing graphics cores for the majority of TD-SCDMA based smartphones. This would put Vivante ahead of better known graphics core licensors Imagination Technologies Group plc and ARM Holdings plc, albeit in just a part of the Chinese mobile phone market.
DMP opens U.S. office to push graphics IP
News & Analysis  
12/21/2011   1 comment
Digital Media Professionals Inc. (DMP), a provider of 2- and 3-D graphics rendering intellectual property (IP) cores, has announced the establishment of a U.S. subsidiary located in Campbell, California.
Imec is collaborating with Flamac on novel PV materials
News & Analysis  
12/21/2011   Post a comment
Research center Imec is collaborating with Flamac to develop novel materials as an alternative for the standard solar cells made of copper indium gallium and selenium (CIGS).
Fabless smart grid startup raises $12 million
News & Analysis  
12/21/2011   2 comments
Fabless communications chip company EnVerv Inc. has announced it has raised $12 million in a Series B round of funding led by Benchmark Capital. Previous investors, NEA and Walden International also participated in the round.
Analyst: Shortage may be over for AMD Llano
News & Analysis  
12/21/2011   4 comments
AMD's refresh of its A-series may indicate shortages are over for the 32nm parts, but a bigger shift in the AMD/Intel battle will come in 2012 when next-gen parts roll.
Linear Technology acquires Dust Networks
News & Analysis  
12/20/2011   4 comments
Linear Technology has acquired Dust Networks a provider of low-power wireless sensor network (WSN) technology.
Irwin Jacobs to retire from Qualcomm's board
News & Analysis  
12/20/2011   3 comments
Irwin Jacobs, a co-founder of Qualcomm who served as the company's CEO for its first 20 years and as its chairman for almost 24 years, will step down from Qualcomm's board of directors after his current term expires in 2012, the company said.
Microsemi and INVIA deliver DPA-resistant cryptographic software on SmartFusion FPGAs
Product News  
12/20/2011   1 comment
New solution from Microsemi and INVIA provides enhanced protection for security applications
Sematech identifies top tech challenges to 3-D ICs
News & Analysis  
12/20/2011   1 comment
Semiconductor technology research consortium Sematech's 3D Enablement Center, together with the Semiconductor Industry Association and Semiconductor Research Corp., has identified the top technical challenges for new "killer" applications to enable future development of heterogeneous 3-D integrations beyond mobile wide I/O DRAM, Sematech said Tuesday (Dec. 20).
New York plans $2 billion tech campus
News & Analysis  
12/20/2011   29 comments
New York officials selected Cornell and Israel's Technion as the first partners in a $2 billion effort to build a science and engineering campus rivaling Silicon Valley.
AMD adds 13 chips to mixed-core CPU line
News & Analysis  
12/20/2011   1 comment
AMD refreshed its line of processors that mix CPU and graphics cores with five desktop and eight notebook parts, including two chips available for over-clocking.
Gartner: Chip sales grew 1% in 2011
News & Analysis  
12/20/2011   3 comments
Market research firm Gartner again trimmed its forecast for 2011 semiconductor sales, saying its preliminary analysis shows chip revenue will grow by slightly less than 1 percent this year.
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