JEDEC forms new IC standards group to make 802.11 WLANs fly News & Analysis 3/29/2002 Post a comment ARLINGTON, Va. -- Will the wireless local-area networking (WLAN) market finally take off? JEDEC here is attempting to make the WLAN market fly by confirming the formation of a new group that will develop chip-level standards for 802.11 technology.
The group, called the JC-61 Committee-Wireless Interface Networking Group (WING), originated from several efforts led by Acer Laboratories, Conexant, Hewlett-Packard, Mitsubishi Electric and Philips.
Semiconductor Alert! (March 25-29) News & Analysis 3/29/2002 Post a comment Greetings from Down-East Maine, which just happens to be one of the last bastions of pure democracy. And the best remaining example of this is the annual New England "town meeting." Here, town residents gather to vote on every, and I mean every, budget line item. I thought I'd tell you about my town meeting because it's not only a moving experience, it's a heckuva lot of fun.
Canesta readies first 'electronic perception' chips and software News & Analysis 3/29/2002 Post a comment SAN JOSE -- In what could have a major impact in a number of markets, startup Canesta Inc. here introduced the world's first "electronic perception" chip and software technology.
Electronic perception technology is a real-time imaging capability that will enable machines and electronic devices to perceive nearby objects and their movements in three dimensions.
WLAN-chip maker Bermai obtains first round of venture funding News & Analysis 3/29/2002 Post a comment PALO ALTO, Calif. -- Bermai Inc., a supplier of chips for high-speed wireless local-area networking applications, has received $15 million in its first round of venture funding.
The round was co-led by Mobius Venture Capital, Blueprint Ventures, and Advanced Technology Ventures (ATV). The funding will be used to help launch Bermai's single-chip product, based on the 802.11a standard.
On Semi names ex-Cypress executive to head marketing and sales News & Analysis 3/29/2002 Post a comment PHOENIX -- On Semiconductor here today announced that it has appointed William R. Bradford, a former executive with Cypress Semiconductor Inc., as its new senior vice president of sales and marketing.
Bradford held various positions during his 11-year career at Cypress. Most recently, he served as the vice president of European sales and marketing for the San Jose-based company. He replaces Michael Rohleder who resigned from the company in January.
Sharp makes push into N. American MCU market News & Analysis 3/29/2002 Post a comment Sharp Microelectronics of the Americas (SMA), attempting to establish itself as a serious player in the North American microcontroller market, is rolling out its BlueStreak series of 8-, 16-, and 32-bit devices.
Fujitsu's compound IC group forges 40-Gbps chip deal with JDS Uniphase News & Analysis 3/29/2002 Post a comment SAN JOSE -- Fujitsu Quantum Devices Ltd., Fujitsu Compound Semiconductor Inc., and JDS Uniphase Corp. announced a multi-source agreement (MSA) for the development of 40-gigabits-per-second devices.
The companies will develop PIN receivers with differential coplanar outputs for use in 40-Gbps fiber-optic applications. The MSA receiver reduces board space, cancels common mode noise at the clock and data recovery (CDR) circuit, and doubles the output voltage swing, according to Fujitsu Compound.
Fujitsu promises 90-nm production within a year News & Analysis 3/29/2002 Post a comment Fujitsu Ltd. has begun prototype production of chips in its 90-nanometer (0.09-micron) process technology at its Akiruno Technology Center, and plans to introduce the process for commercial production in the next fiscal year, which begins Monday (April 1).
'Let them come,' Chinese foundries say to competition News & Analysis 3/29/2002 Post a comment Taiwan's semiconductor manufacturing machine is poised to enter China, but that isn't concerning the mainland's fledgling foun-dry service providers, which claim that access to inexpensive technology and strong customer relationships will give them an edge for years to come.
Qualcomm, Nvidia unseat Xilinx, Altera as top fabless companies, says new ranking News & Analysis 3/29/2002 Post a comment SCOTTSDALE, Ariz. -- The revenue rankings of fabless chip companies has been shuffled a great deal by the semiconductor downturn. Programmable logic rivals Xilinx Inc. and Altera Corp. fell from No. 1 and No. 2 in fabless revenues to No. 3 and 6 last year, respectively, while chip set suppliers Qualcomm Inc. (in cell phones) and Nvidia Corp. (PC graphics) took the top two spots in the fabless IC segment, according to IC Insights Inc.
EE job market posts modest gains News & Analysis 3/29/2002 Post a comment A rise in demand for engineers for temporary work assignments and a small increase in hiring for permanent positions reported by U.S. staffing firms point to the beginning of a recovery for both the electronics industry and the national economy.
Robotic Vision being investigated by SEC for accounting error News & Analysis 3/29/2002 Post a comment CANTON, Mass. -- Robotic Vision Systems Inc. today disclosed it is under investigation by the U.S. Securities and Exchange Commission (SEC) for accounting practices that caused RVSI to restate its financial results for the company's fiscal 2000 year and a three-month period, ended Dec. 30, 2000.
Taiwan's government lifts ban on China fabs News & Analysis 3/29/2002 Post a comment TAIPEI, Taiwan -- After months of delay, Taiwan's government has finally lifted a ban on 200mm wafer investments in China, although with several conditions.
Taiwan's government will let semiconductor companies build a total of three fabs before 2005 using current-generation production equipment, Premier Yu Shyi-kun said at a press conference late tonight. Facilities that operate with new manufacturing equipment won't be allowed for at least two years from now, he added.
Flat start to 2002 is good for chip business, says SIA News & Analysis 3/29/2002 Post a comment SAN JOSE -- Worldwide semiconductor sales began 2002 just like it ended 2001--unchanged in January at a total of $10.01 billion compared to $10.01 billion in December, said the Semiconductor Industry Association today. Chip sales in the Asia Pacific region and Americas offset drops in Europe and Japan, said the San Jose-based trade group.
StarFabric development kit News & Analysis 3/29/2002 Post a comment A software development kit has been unveiled for engineers implementing the StarFabric switched-backplane architecture in system designs.
Vietnamese refugee works both sides at TI News & Analysis 3/28/2002 Post a comment Texas Instruments Fellow Duy-Loan Le spent her formative years straddling two countries and two cultures: one ravaged by war and steeped in tradition; the other a golden land of opportunity where innovation ruled.
Harmonic balance simulation speeds RF mixer design News & Analysis 3/28/2002 Post a comment Harmonic-balance simulators and electromagnetic analysis tools are becoming essential to RF mixer design. New balun structures for RFICs are key to matching impedances at high GHz-requencies. An AWR scientist offers some pointers on mixer-design using contemporary modeling tools.*
PDF asks software to improve chip yields News & Analysis 3/28/2002 Post a comment Taking its semiconductor yield enhancement technology into the chip design world, PDF Solutions Inc. has rolled out Design-Based Yield Improvement (DBYI), a services and software offering aimed at fabless semiconductor providers.
Big DSP suppliers chilled in market downdraft News & Analysis 3/28/2002 Post a comment
Major DSP makers, accustomed to yearly success, found themselves caught in the vortex of last year's crashing communications market, resulting in severely reduced revenues and the first negative growth in DSP history.
Fairchild wraps military chip line sale to IR News & Analysis 3/28/2002 Post a comment Fairchild Semiconductor International, South Portland, Maine, today announced it has completed the sale of its military and space-related discrete power product line to International Rectifier for approximately $29.6 million cash.
Carriers to keep a tight rein on spending News & Analysis 3/28/2002 Post a comment Network equipment and communication IC vendors attending this week's Integrated Broadband Networks Summit took little comfort in the words of executives from local and long-haul service providers, who said their only capital investments in the next few years will be for systems and software that can reduce month-to-month operating expenses.
Jedec to standardize WLAN chip interfaces News & Analysis 3/28/2002 Post a comment The Joint Electronic Device Engineering Council (Jedec) hopes to standardize a digital interface that will link chips in wireless LAN system architectures, and announced the formation of a subcommittee this week that will develop such an interface.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.