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posted in June 2009
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Sematech tips new 450-mm efforts, pitch standard
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6/30/2009   Post a comment
Despite the IC downturn, International Sematech insists that it is continuing to make progress on 450-mm tool technology, by announcing several new efforts in the arena.
Forum planned on 40/100G Ethernet
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6/30/2009   Post a comment
The Ethernet Alliance will host a one-day forum in Silicon Valley on the changes coming with the 40 and 100 Gbit/second versions of the IEEE P802.3ba standard now in the works.
Ex-UBS top dealmaker launches green tech boutique
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6/30/2009   Post a comment
Former top UBS AG investment banker Jeffrey McDermott and several other Wall Street veterans have launched a boutique advisory firm focused on alternative energy and "cleantech" companies.
Digitally controlled potentiometer reduces cost, programming and system calibration
Product News  
6/30/2009   Post a comment
With < 1 percent typical resistor tolerance, Intersil's low-voltage digitally controlled potentiometer (DCP) can be used as a true variable resistor, enabling users to set standard and non-standard resistor values for open-loop applications.
US EPA approves California auto emissions standard
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6/30/2009   Post a comment
The Obama administration Tuesday approved California's long-standing bid to set its own tough standards for vehicle emissions, a decision in tune with a national plan to boost fuel efficiency and reduce greenhouse gases linked to climate change.
Virginia Tech tools up with MathWorks
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6/30/2009   Post a comment
The MathWorks and Virginia Tech College of Engineering have signed a new three-year agreement for The MathWorks to provide resources and support for course components that utilize MathWorks tools.
Canon reportedly cutting 700 jobs in stepper biz
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6/30/2009   Post a comment
Canon plans to cut about 700 jobs from its lithography stepper division, according to reports.
Singapore launches 3-D packaging consortium
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6/30/2009   Post a comment
Singapore's Institute of Microelectronics (IME), a research group, has launched a consortium in 3-D packaging.
Protests interrupt Cisco keynote
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6/30/2009   1 comment
Protesters interrupted a keynote speech by Cisco Systems chief executive John Chambers at the company's annual Cisco Live event in San Francisco today.
Micron puts 34-nm NAND chips in mass production
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6/30/2009   Post a comment
Micron Technology announced mass production of NAND flash memory chips using 34-nanometer (nm) process technology. Micron also said its subsidiary, consumer memory product provider Lexar Media, would deliver flash memory cards and USB flash drives based on the 34-nm devices.
Digital photo frames to get connected
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6/30/2009   Post a comment
The total silicon opportunity for digital photo frame suppliers will exceed $550 million by 2013, according to market research group InStat.
Intersil : Low-voltage potentiometer has a tight resistor tolerance
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6/30/2009   Post a comment
Intersil has introduced the ISL22317, a low-voltage digitally controlled potentiometer (DCP) with < 1 percent typical resistor tolerance.
Innovations in the 'More than Moore' era
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6/30/2009   Post a comment
For decades semiconductor developments have been driven by Moore’s Law productivity gains. This led to extremely fast digital processors, increases in bandwidth and huge memories that boost the productivity of PCs, mobile phones and other applications demanding heavy data traffic and storage. However, the economics of the IC industry as well as developments in society, are creating a paradigm-shift in the semiconductor world.
IBM re-uses PV thermal energy for better efficiency
News & Analysis  
6/30/2009   1 comment
IBM researchers recently have shown that the reuse of cooling liquid for computers can increase the total efficiency of a system. Now they do a similar trick on solar cells. The result could be an overall efficiency of better than 50 percent.
Cypress Envirosystems' Wireless Pneumatic Thermostat Wins Prestigious Buildy Award for Smart Devices
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6/30/2009   Post a comment
Cypress Envirosystems announced that its Wireless Pneumatic Thermostat (WPT) has won in the Smart Devices category at the fifth annual Buildy Awards.
Optoma partners with Texas Instruments to develop new 3D future ready projectors
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6/30/2009   Post a comment
Optoma Technology, Inc. announced it is partnering with Texas Instruments to launch a new series of 3D enabled projectors during the second half of 2009. Utilizing Texas Instruments' DLP technologies, Optoma's new projectors will enable 3D imagery from a single projector, driving greater cost efficiency, easier installation and usage.
TI announces MSP430 MCUs for e-metering applications
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6/30/2009   Post a comment
In support of three-phase e-metering applications, Texas Instruments Incorporated has unveiled the ultra-low power MSP430F471xx microcontroller (MCU) series. The F471xx system-on-chip metering solution offers simultaneous sampling of voltage and current as well as tamper-detection for efficient and reliable energy measurement.
Freescale LED driver eliminates audible noise and visual artifacts for LCDs
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6/30/2009   Post a comment
Freescale Semiconductor has introduced the MC34845 LED driver with high-speed pulse width modulation (PWM) capability.
CADEKA : Octal A-D converter claims lowest power consumption
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6/30/2009   Post a comment
CADEKA claims the industry’s most power efficient, eight channel analog-to-digital converters.
Ember Unveils High Performance ZigBee Chips
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6/30/2009   Post a comment
Ember unveiled the EM300 Series, its next-generation ZigBee chip family that packs wireless networking performance and application code space into a low power-consuming chip set.
APC's Newest NetShelter Products Allow Businesses to Deploy Network and Server Equipment Directly in the Open Office
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6/30/2009   Post a comment
APC announced that it has expanded its NetShelter product line to include innovative rack enclosures that can be installed in virtually any open office environment.
Conexant : System-on-chip targets connected photo frames
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6/30/2009   Post a comment
Conexant Systems has announced the first in a planned series of system-on-chip (SoC) solutions targeted at the growing market for “connected” digital photo frames and interactive display appliances (IDAs).
Le pôle System@tic dresse ses priorités 2009-2011
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6/30/2009   Post a comment
Le pôle System@tic Paris-Région, l'Etat et la Région Ile-de-France viennent de signer le contrat de performance du pôle définissant les engagements réciproques pour la période 2009-2011.
Global chip sales seen ticking up in May
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6/30/2009   Post a comment
Global chip sales in May are believed to have increased by a seasonally adjusted 2 percent on the previous month, according to analysts at Carnegie Group (Oslo, Norway).
SMIC readies 45-nm process
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6/30/2009   Post a comment
Don't look now, but Chinese foundry provider Semiconductor Manufacturing International Corp. (SMIC) could be gaining on its rivals.
Metrology provider Semilab buys SDI
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6/30/2009   Post a comment
Continuing on its buying spree, metrology equipment provider Semilab Co. Ltd. has acquired Semiconductor Diagnostics Inc. (SDI).
Dolphin Integration unveils Helium audio converter
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6/30/2009   Post a comment
EDA and IP company Dolphin Integration SA (Meylan, France) claimed it has released a digital audio converter (DAC) that combines ultra-low power consumption and low bill-of-material with high audio quality.
RF power DC-DC converter offers smallest power management solution for W-CDMA/CDMA RFPAs in 3G handsets
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6/30/2009   Post a comment
Fairchild Semiconductor is claiming the industry's smallest power management solution for the designers of 3G handsets and wireless datacards with the introduction of the company's FAN5902, RF Power DC-to-DC converter which operates at 6 MHz with a reduced size 0.5uH chip inductor that saves space and component costs.
NXP, IBM in Dutch traffic control field trial
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6/30/2009   Post a comment
Traffic authorities in the Netherlands have started pilot trials with traffic control systems aiming at controlling traffic volume in critical regions. The project is based on technology from IBM and NXP.
Tower, Panavision partner for linear image sensors
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6/30/2009   Post a comment
Foundry Tower Semiconductor (Migdal Ha’emek, Israel) has started making, on its 0.18 micron CMOS process, reconfigurable linear image sensors for Panavision Imaging that are said to be the fastest of its type.
National rolls high-side dual LED flash driver
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6/30/2009   Post a comment
Natinal's PowerWise synchronous boost converter enables thermally optimized flash system in portable devices.
RF PA 6-MHz DC/DC converter implements dynamic voltage scaling for improved efficiency of 3G handsets
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6/30/2009   Post a comment
Fairchild FAN5902 has minimum footprint, maximum efficiency due to switching frequency, dynamic adjustment of power amplifier current to match output power
Broadcom jacks up Emulex offer 19%, drops lawsuit
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6/30/2009   Post a comment
Broadcom Corp. has increased its offer for Emulex Corp. 20 percent, raising the value of the deal to $912 million, and has also dropped a lawsuit against the board of directors in a bid to engage the management in a friendly takeover discussion.
Jobs go but new processors coming at ARC
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6/30/2009   Post a comment
ARC International (St Albans, England) is to lay off 35 employees and close several of its locations in a major restructuring that sees the licensor of multimedia IP cores reduced to 115 direct staff, excluding its Adaptive Chips joint venture in India. The company also revealed it is readying a new processing range that will be launched in November.
MSC : High voltage IGBTs offer fast switching with low conduction losses
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6/30/2009   Post a comment
Xtreme light Punch Through (XPT) IGBTs are the latest generation of short-circuit rated high voltage IGBTs from IXYS, with fast switching and low conduction losses.
Spoerle greift Atom-Entwicklern unter die Arme
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6/30/2009   Post a comment
Eine beschleunigte und erleichterte Entwicklung von x86-basierten Embedded-Produkten verspricht der Distributor Spoerle Nutzern seines EPC-X86-Designkonzepts. Entwickler können dabei auf umfangreiche Funktionsbibliotheken und andere fachliche Unterstützung zugreifen.
Minalogic change de président
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6/30/2009   Post a comment
Le pôle de compétitivité Minalogic, dédié aux micro- et nanotechnologies et au logiciel embarqué, vient de nommer Philippe Delorme à sa présidence.
Smart meters face uneven acceptance across Europe
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6/30/2009   Post a comment
While energy vendors and environmentalists promote smart power meters as a panacea for green user education and empowerment, the market perspectives have been rather unclear. Now a Swedish study brings light into the dark.
U.S. joins International Renewable Energy Agency
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6/30/2009   Post a comment
The United States joined the International Renewable Energy Agency (IRENA) Monday as part of the Obama administration's commitment to developing a new energy policy, Secretary of State Hillary Clinton said.
Intel, Micron, Samsung start NAND scaling race
News & Analysis  
6/29/2009   1 comment
The NAND flash memory scaling race is off and running--again.
Amkor's founder to step down as CEO
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6/29/2009   Post a comment
Amkor Technology President and Chief Operating Officer Ken Joyce will assume the role of CEO of the company effective Oct. 1. James Kim, Amkor's founder, will step down as CEO and become executive chairman.
SunPower, Wells Fargo funding solar projects
News & Analysis  
6/29/2009   1 comment
U.S. solar panel maker SunPower Corp and Wells Fargo Monday said they have teamed up to fund up to $100 million in solar projects for businesses and public buildings.
Climate bill spurs less green power than hoped
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6/29/2009   Post a comment
The renewable energy mandate in the climate change bill approved by the U.S. House of Representatives last week does not go far enough for green power proponents, but the proposed national standard is likely as strong as it will get.
Green pressure sensors tap quartz MEMS
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6/29/2009   Post a comment
Epson Toyocom unveiled a green sensor technology that eliminates dangerous oil and gases from pressure sensors, instead using a quartz microelectromechanical system (QMEMS) tuning fork as the sensing element.
Forte beefs up high-level synthesis tool
Product News  
6/29/2009   1 comment
High-level synthesis EDA vendor Forte Design Systems has commenced volume shipments of the latest version of its Cynthesizer SystemC synthesis software for hardware and electronic system level design.
Energy-efficient lowest-jitter transceivers offer more backplane and cable reach
Product News  
6/29/2009   Post a comment
Two new energy-efficient, quad transceivers that extend backplane and cable reach up to 30 percent farther than competitive devices have been unveiled by National Semiconductor Corp.
High-side dual LED flash driver enables dual LED operation for flash applications in handheld devices
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6/29/2009   Post a comment
National Semiconductor Corp., has introduced what is claimed to be the industry's first high-side light-emitting diode (LED) driver that enables dual LED operation for the camera flash function in portable, battery-powered multimedia devices.
2 A, switch-mode charger minimizes heat and charge time for mobile devices
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6/29/2009   Post a comment
Maxim Integrated Products has introduced a switch-mode DC-DC charger with Smart Power Selector circuitry.
Obama sets new lighting efficiency standards
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6/29/2009   Post a comment
President Barack Obama's administration Monday laid out new efficiency standards for lighting used in homes and businesses, hastening measures to help reduce greenhouse gas emissions, an official said.
Home appliances target for combined LED and front-panel driver
Product News  
6/29/2009   Post a comment
austriamicrosystems has added the AS1115 to its LED driver portfolio, which combines display driving and key scanning functionality to provide a simple front panel solution.
Page 1 / 16   >   >>


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