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posted in June 2012
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DCD's D68000 IP core with Linux, MAC, and debugger
Product News  
6/30/2012   Post a comment
Digital Core Design announce a modern incarnation of the good old Motorola 68000 processor as an IP core for use in FPGAs and ASICs/SoCs.
Microsemi's advanced motor control algorithms for SmartFusion cSoCs
Product News  
6/30/2012   Post a comment
SmartFusion cSoCs (chips with MCU, programmable digital, and programmable analog) provide cost-effective solutions ideal for safety-critical applications.
New Xilinx Kintex-7 FPGA-based Connectivity Kit
Product News  
6/30/2012   Post a comment
Use of pre-verified and integrated IP shortens time-to-market, reduces BOM, future-proofs high speed serial designs, and dramatically increases design productivity.
Kane's new Altera Stratix V-based Computational Accelerator
Product News  
6/30/2012   Post a comment
Kane Computing has announced that the Gidel ProcV PCIe x 8 (Gen3) computational accelerator board is now in production.
Multi-network support is now available for ZigBee PRO networks
Product News  
6/30/2012   1 comment
Ember claims to be the world’s first ZigBee technology provider to support multiple interconnecting networks on a single system-on-chip (SoC) or network co-processor (NCP) for Connected Home applications.
Single Chip SATA II DOM SSD meets multiple rugged app requirements
Product News  
6/29/2012   Post a comment
RunCore has launched what it claims to be the world’s first single chip SATA II DOM SSD for advanced embedded SSD solutions, the RunCore Mini DOM.
Novaled expands agreement with Samsung Mobile Display
News & Analysis  
6/29/2012   2 comments
Novaled has entered into a multi-year licensing and purchase agreement with Samsung Mobile Display to provide dopant materials used in the transport layers of its AMOLED display modules from Novaled.
UMC licenses IBM technology for 20-nm FinFETs
News & Analysis  
6/29/2012   9 comments
UMC said it licensed technology from IBM to expedite the development of its 20-nm CMOS process, including FinFET 3-D transistors.
Newport Media gets the ISDB picture in smartphones
News & Analysis  
6/29/2012   5 comments
Fabless chip company Newport Media has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial transmissions, which are standard in Latin American and Japanese markets.
Litho firm buys packaging patents from IBM
News & Analysis  
6/28/2012   2 comments
Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductors, said it acquired the rights to a collection of chip packaging patents from IBM. The purchase price was not disclosed.
Micron reportedly strikes deal to buy Elpida for $2.5 billion
News & Analysis  
6/28/2012   15 comments
U.S.-based memory chip vendor Micron Technology has reached a deal to acquire bankrupt Japanese DRAM vendor Elpida Memory for roughly $2.5 billion, according to an English language report by Japan's Nikkei newspaper.
Marvell aims to be China chip leader
News & Analysis  
6/28/2012   10 comments
No, Marvell Technology is not moving to China. However, the U.S. fabless chip company wants to become “the largest semiconductor company in China,” according to a Marvell executive.
Report: Qualcomm wafer fab not ruled out
News & Analysis  
6/28/2012   30 comments
Paul Jacobs, CEO of Qualcomm, the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.
Nordic streamlines code in latest RF chips
News & Analysis  
6/28/2012   10 comments
Nordic Semiconductor announced the first members of its nRF51 family of 2.4 GHz RF chips that take a fresh approach to separating protocol and apps software.
U-blox makes LTE move, buys Cognovo and 4M Wireless
News & Analysis  
6/28/2012   2 comments
Swiss GPS and wireless chip company U-blox is acquiring 4G chip company Cognovo and LTE protocol licensor 4M Wireless for approximately $26 million.
Legislation seeks to relax restrictions on tracking fake chips
News & Analysis  
6/28/2012   12 comments
A House proposal seeks to reverse U.S. customs rules that prevent chip makers from examining fake chips to determine their authenticity. However, the bill is a long way from final passage.
Researchers report solid-state quantum leaps
News & Analysis  
6/27/2012   5 comments
Labs in the U.S. and Europe separately reported progress in adapting solid-state materials to store spintronic quantum states, a critical hurdle on the path to using spintronics in quantum computing.
Silicon Laboratories Si21x8 TV tuners
Product News  
6/27/2012   Post a comment
Silicon Laboratories launched its fourth generation TV tuner product line, which includes devices that offer greater integration, lower power consumption and the highest tolerance to Wi-Fi and LTE interference.
Texas Instruments TPA3116D2, TPA3118D2 and TPA3130D2 Class D audio amplifiers
Product News  
6/27/2012   3 comments
Higher efficiency levels and lower BOM costs will make Texas Instruments' Class D devices more accessible to cost-sensitive applications, including the LCD TV market, soundbars, after-market automotive solutions and portable audio docks.
Bourns buy of Jensen Devices opens auto lamp play
News & Analysis  
6/27/2012   1 comment
Bourns, Inc. has completed its purchase of substantially all of the assets of Jensen Devices AB (Stockholm, Sweden), a design and manufacturing firm of gas discharge tubes.
Google launches 7-inch, $199 Android tablet
News & Analysis  
6/27/2012   27 comments
As expected, Google used the occasion of its Google I/O developer event to launch a 7-inch media tablet, made by Taiwan's Asustek, which will be available in mid-July starting at $199.
Firm of mature parts offers lead-free version of AMD chip
Product News  
6/27/2012   Post a comment
Rochester Electronics, a manufacturer of mature semiconductors, has created a lead-free version of the AM188EM microprocessor.
Wire insulation enables relaxed design rules
News & Analysis  
6/27/2012   1 comment
The semiconductor industry is seeing increasing demand for miniaturization which necessitates changes in chip design, including larger numbers of I/O per unit space, multi-tier devices, and stacked dies that increase wire density.
U.S., European manufacturers join forces to compete with China
News & Analysis  
6/27/2012   56 comments
U.S. and European EMS providers are beginning to join forces as one way to compete with China's electronics manufacturing juggernaut.
New HyperLink DSP interface FPGA core from Integre Technologies
Product News  
6/27/2012   Post a comment
Integretek core leverages proven Texas Instruments’ HyperLink technology connecting Altera and Xilinx FPGA designs to TI’s TMS320C66x multicore processors.
Xilinx delivers PCIe Gen3 hard block and 1866 Mb/s DDR3 solution
Product News  
6/27/2012   1 comment
Xilinx integrated block for the PCI Express Gen3 standard accelerates productivity and increases system performance.
Maxim pledges $200M boost for U.S. chip making
News & Analysis  
6/27/2012   2 comments
Analog and mixed-signal chip maker Maxim said it plans to spend $200 million to upgrade its wafer fabs in Oregon, Texas and California. The investment will also create additional manufacturing jobs.
Analyze 802.11ac WLAN signals with bandwidths to 160 MHz
Product News  
6/27/2012   Post a comment
Rohde & Schwarz FSW-K91ac signal and spectrum analyzer offers T&M equipment required to generate standard compliant WLAN signals in the lab.
Aeroflex adds 802.11ac capability to S-Series line
Product News  
6/27/2012   Post a comment
New options support modulation schemes up to 256QAM.
GAO's portable DSOs span 25 MHz to 200 MHz
Product News  
6/27/2012   Post a comment
Each scope has two channels, plus an external trigger channel.
Indian fabless startup seeks $20 million, say reports
News & Analysis  
6/27/2012   15 comments
Fabless mobile computing chip company Ineda Systems Pvt Ltd. (Hyderabad, India) is planning to raise $20 million over the next few months, according to local reports.
Displayport, HDMI duel over mobile links
News & Analysis  
6/27/2012   2 comments
VESA’s Mobility Displayport will compete with Silicon Image’s MHL for which will be the interconnect of choice for high def video in handsets and beyond.
Applied tips dielectric etch tool for 3-D NAND production
Product News  
6/27/2012   4 comments
Chip equipment vendor Applied Materials launched a dielectric etch system targeted specifically for three-dimensional memory architectures.
Court halts U.S. sales of Samsung's Galaxy Tab 10.1
News & Analysis  
6/27/2012   4 comments
A U.S. judge on Tuesday backed Apple Inc's request to stop Samsung Electronics selling its Galaxy Tab 10.1 tablet in the United States, Reuters reported.
Infineon lowers guidance as business softens
News & Analysis  
6/27/2012   Post a comment
German chip company Infineon has updated its outlook for the third and fourth quarters of its 2012 fiscal year.
Intel announces another university research center
News & Analysis  
6/27/2012   2 comments
Intel CTO Justin Rattner announced the seventh Intel Science and Technology Center will focus on social computing and be based at the University of California, Irvine.
MediaTek to bring premier smartphone features to $150 - $200 handsets
News & Analysis  
6/27/2012   13 comments
Gunning for a growing market in mid- and entry-level smartphones, MediaTek is rolling out a new dual-core mobile phone platform, offering advanced multimedia features similar to those available on high-end smartphones such as Apple’s iPhones 4.
AMD rolls low-power embedded APU
News & Analysis  
6/27/2012   Post a comment
AMD introduced an accelerated processing unit targeted at very low power, small form factor and cost-sensitive embedded designs that require a combination of x86 compatibility and graphics.
2x2mm MEMS microphones delivered in tough plastic packages
News & Analysis  
6/27/2012   Post a comment
STMicroelectronics' novel microphone-assembly process ensures superior electrical and acoustic performance, unbeatable mechanical robustness, and slimmer form factors, according to the manufacturer.
High-speed active-protocol bi-directional converters manage audio, video signals between DisplayPort and HDMI
Product News  
6/27/2012   Post a comment
STMicroelectronics' “Mystique” family of products is what the company claims to be the world's first high-speed active-protocol bi-directional converters for managing audio and video signals between DisplayPort and HDMI.
Quad core HD audio processor SoC offers HD audio for smartphones and tablets
Product News  
6/27/2012   Post a comment
Wolfson Microelectronics plc has introduced the WM5110, the industry's first quad core High Definition (HD) Audio Processor System-on-a-Chip (SoC).
Bluetooth HCI module with antenna for automobiles
Product News  
6/27/2012   Post a comment
ALPS Electric Europe has developed the UGXZD–G Series Bluetooth HCI module with antenna for automobiles. Mass production is already underway. Principal applications are car navigation and audio systems.
Enclosed PCB mount speakers deliver from 73 db up to 85 dB at 1 meter
Product News  
6/27/2012   Post a comment
CUI Inc has added the CVS series of enclosed PCB-mount speakers to its product line, housed in a protective plastic case with diameters ranging from 15 to 31.8mm.
Audio configuration switch IC detects headset type to ease system design
Product News  
6/27/2012   Post a comment
By integrating the automatic detection and switching function in a single device, the TS3A225E audio headset detection and configuration switch IC from Texas Instruments eliminates detection, leakage and click-pop issues.
Molex rolls out 32-circuit wire-to-wire connection system
Product News  
6/26/2012   Post a comment
This new modular, hybrid extension enables adoption of a complete CMC connection system throughout the entire vehicle.
TriQuint targets WLAN with RF module
Product News  
6/26/2012   Post a comment
The dual-band WLAN module proves a solution for 802.11 a/b/g/n/ac Wi-Fi and Bluetooth applications.
Rugged FETs span 1MHz to 2 GHz
Product News  
6/26/2012   Post a comment
Two wideband RF power LDMOS FETs are available to meet these needs for applications from HF through L band, 1 MHz through 2 GHz.
SP10T and SP12T switches target 4G LTE
Product News  
6/26/2012   Post a comment
Peregrine announces its highest-linearity switches for 4G LTE applications
PV gross margins fell 75% in Q1
News & Analysis  
6/26/2012   2 comments
Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.
Wolfson wins audio slot in Samsung smartphone
News & Analysis  
6/26/2012   6 comments
Wolfson Microelectronics, a Scottish mixed-signal fabless chip company, has announced that its WM1811 audio hub IC is being used within the Galaxy S III smartphone from Samsung.
Page 1 / 7   >   >>


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