Video: EDA eyes new opportunities for growth News & Analysis 7/31/2009 Post a comment Opportunities for EDA to generate more revenue from outside the semiconductor industry frequently surfaced in discussion at this year's Design Automation Conference, with executives suggesting that EDA could play in markets including medical devices, military/aerospace, automotive and clean energy technology.
Graphene nanoribbons lower power, cooler than copper News & Analysis 7/31/2009 1 comment Graphene nanoribbons below 20-nanometer widths will carry 1000-times more current, and run up to 12-time cooler, than copper interconnects according to carbon semiconductor researchers at Georgia Institute of Technology.
Change of plan and CEO at Air Semiconductor News & Analysis 7/31/2009 Post a comment Fabless chip company Air Semiconductor Ltd. (Swindon, England) has received additional funding from Pond Venture Partners to complete development of its GPS chip and to strengthen its intellectual property portfolio. The company has replaced its top executive as part of a re-organization.
GlobalFoundries, ST, NXP lead weekly story ranking News & Analysis 7/31/2009 Post a comment Here are the top five online stories for the week beginning Sunday, July 26, as ranked by EE Times Europe readers, up to and including Friday, July 31. The ranking is based on the number of reader "views" or "hits" on a particular article.
AMD, HP propose extensions for PCI Express 3.0 News & Analysis 7/31/2009 Post a comment Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
Wolfson launches advanced PMIC line Product News 7/31/2009 Post a comment Wolfson Microelectronics' latest power management chips are the first to employ its BuckWise regulator technology, helping to cut support components and facilitate advanced multitasking.
NXP Class-D car audio amplifier offer high efficiency Product News 7/31/2009 Post a comment NXP has introduced a family of dual channel Class-D amplifiers that according to the vendor's promises deliver high sound quality and energy efficiency. The NXP TDF8599 Class-D amplifier family operates with maximum output power from 70 to 130 watts (250 watts mono), significantly reducing power dissipation in the vehicle head-unit when compared to traditional Class-AB amplifiers and ensuring more efficient heat management.
SEMI hails European communication on 'high-tech' industry News & Analysis 7/31/2009 Post a comment SEMI has claimed that its campaign for greater recognition of, and support for, chip manufacturing in Europe is paying off. Evidence for this will come Sept. 23, SEMI said, when it expects the European Commission's Directorate General for Enterprise & Industry will produce a communication recognizing the importance of "Enabling High-Tech" industries.
Wolfson Q2 sales up 32% sequentially News & Analysis 7/31/2009 Post a comment Wolfson Microelectronics plc (Edinburgh, Scotland), a supplier of mixed-signal circuits for consumer electronics, made an operating loss of $2.4 million on second quarter revenue that reached $33.2 million, a rise of 32 percent sequentially but down 38 percent from Q2 2008.
Head unit increasingly resembles PC, iSuppli finds News & Analysis 7/31/2009 1 comment Economic pressure and customers' requirements will urge car manufacturers to look at the PC market when meeting design decisions for future head units, predicts market researcher iSuppli. Thus, the differentiating features move into the software with some interesting consequences.
NXP names head of US identification business News & Analysis 7/31/2009 Post a comment Dutch chip manufacturer NXP BV (Eindhoven, The Netherlands) has appointed Anthony Sabetti as senior director for business development, strategy marketing for the identification (ID) business in North America.
Silicon Valley, Wall Street meet at interconnect event News & Analysis 7/30/2009 Post a comment The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
Asyst sells assets to three companies News & Analysis 7/30/2009 Post a comment Ending perhaps the last chapter in a painful saga, Asyst Technologies Inc. has agreed to sell its entire assets to three companies: Crossing Automation Inc., Murata Machinery Ltd. and the Peer Group.
New E85 station opening in Arizona Product News 7/30/2009 Post a comment The Renewable Fuels Association (RFA) announces the opening of the first E85 station in Coolidge, Arizona. E85 is a blend of 85 percent ethanol, 15 percent gasoline, designed for flex-fuel vehicles.
Kappos sketches out plans for patent office News & Analysis 7/30/2009 1 comment David J. Kappos, nominated by President Barack Obama to head the U.S. Patent and Trademark Office, pledged to "refashion the patent examination process" and improve funding for the patent office in his confirmation hearing before the Senate Judiciary Committee Wednesday.
ARC in take-over talks News & Analysis 7/30/2009 Post a comment ARC International plc (St, Albans, England), a licensor of configurable processor cores, has confirmed that it is in discussions which may result in an offer being made for the company. ARC made a regulatory announcement after its share price started on climb on Wednesday (July 29).
Imagination considers growth by acquisition News & Analysis 7/30/2009 Post a comment Multimedia core licensor Imagination Technologies Group plc (Kings Langley, England) is on the look out to grow by acquisition, as well as organically, according to Tony King-Smith, vice president of marketing.
Nissan provides e-car technical details News & Analysis 7/30/2009 Post a comment Japanese car maker Nissan plans to introduce its electric volume vehicle for 2010 production start. The OEM already offered a glimpse to the car's electric drive and internal IT systems. Surprise: The driving range is 160 km not bad to start with.
Karlsruhe tram-train runs field trial on Ni-Cd battery system News & Analysis 7/30/2009 Post a comment The pioneering Stadtbahn Karlsruhe tram-train network in Germany has completed an extended field trial with a Saft MATRICS MRX battery system to demonstrate the potential reliability, performance and TCO (Total Cost of Ownership) advantages offered by using specialised rechargeable nickel-cadmium (Ni-Cd) batteries in a light rail application.
DAC attendance spots recessionary times News & Analysis 7/30/2009 Post a comment Preliminary attendace figures at this year's Design Automation Conference show an increase in total conference and exhibit attendance by 12 percent over last year's DAC held in Anaheim, Calif. and by three percent over the 2007 San Diego event.
ST, Stollmann partner to deliver turnkey NFC solutions News & Analysis 7/30/2009 Post a comment STMicroelectronics NV (Geneva, Switzerland) and communications software development house Stollmann GmbH (Hamburg, Germany) announced they have teamed to deliver turnkey NFC (Near Field Communication) interface solutions, complete with the necessary hardware and software components.
GlobalFoundries could be the elusive Eurofoundry, and more News & Analysis 7/30/2009 1 comment If Infineon could be persuaded to follow ST and switch outsourced IC manufacturing to GlobalFoundries in Dresden, we would some of the way along the path to creating a Eurofoundry that would keep advanced digital CMOS manufacturing in Europe, albeit with the help of Abu-Dhabian petrodollars.
Micronova shrinks HiL simulator to desktop size Product News 7/30/2009 Post a comment With the NovaSim Micro, test devices vendor Micronova (Vierkirchen, Germany) has shrunk Hardware-in-the-loop (HiL) simulators to desktop size. Despite its small size, the simulator runs function tests on complex ECUs, the vendor promises.
SMSC rolls MOST network analyzing solution Product News 7/30/2009 Post a comment With the Optolyzer G2 Premium bundle, chip vendor SMSC introduces a high-end analysis toolset that is part of SMSC Optolyzer G2 family. The bundle comes with an Optolyzer G2 for MOST25, MOST50 and MOST150 networks.
Continental just keeps afloat in 1H09 News & Analysis 7/30/2009 Post a comment Automotive tier one Continental AG has managed to just keep its adjusted operating figures positive in the first half of the year, but under the bottom line the company made a hefty loss. The outlook is very cautious.
ST sees positive backlog indicators for Q4 News & Analysis 7/30/2009 Post a comment In a commentary of financial results for the first half of fiscal year 2009, European chipmaker STMicroelectronics NV (Geneva, Switzerland) expressed optimism as it expects demand to recover in the second half of 2009.
Final curtain falls for Qimonda News & Analysis 7/30/2009 1 comment Insolvent DRAM manufacturer Qimonda AG's Dresden fab, which has been set into a 'sleep mode' in April, will be switched off for good by the end of the year. In his search for an investor, insolvency administrator Michael Jaffé hoists the white flag.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.