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posted in July 2009
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Video: EDA eyes new opportunities for growth
News & Analysis  
7/31/2009   Post a comment
Opportunities for EDA to generate more revenue from outside the semiconductor industry frequently surfaced in discussion at this year's Design Automation Conference, with executives suggesting that EDA could play in markets including medical devices, military/aerospace, automotive and clean energy technology.
Handset shipments returned to growth in Q2, says iSuppli
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7/31/2009   Post a comment
Second quarter global handset shipments increased 4.7 percent in the second quarter, marking the first sequential growth since the second quarter of 2008, according to market research firm iSuppli.
SEMI suffers another layoff
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7/31/2009   Post a comment
The SEMI trade group has suffered another layoff.
No death penalty for SiPort engineer
News & Analysis  
7/31/2009   Post a comment
Jing Hua Wu, who was accused of murdering three executives at SiPort Inc., will not face the death penalty if convicted.
IR agrees to $90 million class action settlement
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7/31/2009   Post a comment
International Rectifier has reached an agreement to settle a class action lawsuit for $90 million, the company said.
Graphene nanoribbons lower power, cooler than copper
News & Analysis  
7/31/2009   1 comment
Graphene nanoribbons below 20-nanometer widths will carry 1000-times more current, and run up to 12-time cooler, than copper interconnects according to carbon semiconductor researchers at Georgia Institute of Technology.
Change of plan and CEO at Air Semiconductor
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7/31/2009   Post a comment
Fabless chip company Air Semiconductor Ltd. (Swindon, England) has received additional funding from Pond Venture Partners to complete development of its GPS chip and to strengthen its intellectual property portfolio. The company has replaced its top executive as part of a re-organization.
GlobalFoundries, ST, NXP lead weekly story ranking
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7/31/2009   Post a comment
Here are the top five online stories for the week beginning Sunday, July 26, as ranked by EE Times Europe readers, up to and including Friday, July 31. The ranking is based on the number of reader "views" or "hits" on a particular article.
PPLN chips enable high-volume green laser production
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7/31/2009   Post a comment
Crystal Technology (CTI, a subsidiary of EPCOS) has launched PPLN (periodically poled lithium niobate) chips for the generation of green laser light from a conventional semiconductor laser source.
Yageo : Current sensor features ultra-low resistance
Product News  
7/31/2009   Post a comment
Yageo has released the PF1206 ultra-low resistance current sensor designed for mini portable device applications.
Seven reasons why VLSI's Hutcheson is upbeat AND worried
News & Analysis  
7/31/2009   1 comment
Here's why one IC analyst is upbeat and worried.
AMD, HP propose extensions for PCI Express 3.0
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7/31/2009   Post a comment
Researchers from Advanced Micro Devices and Hewlett-Packard have written two extensions to the PCI Express 3.0 specification which aims to enable lower cost chips that could support multiple protocols and reduce processor overhead.
ADI unveils low-power, zero-drift op amp
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7/31/2009   Post a comment
ADI's chopper stabilized ADA4051-2 op amp minimizes power use and prolongs battery life for portable instruments requiring high dc precision and measurement stability.
Microprocessor supervisor monitors up to six power-supply voltages
Product News  
7/31/2009   Post a comment
Maxim Integrated Products has introduced the MAX16055, hex-voltage microprocessor supervisor with integrated reset timing, which eliminates the need for an external capacitor.
Analog resistive touch-screen controllers debut for embedded markets
Product News  
7/31/2009   Post a comment
Microchip Technology's universal touch-screen controllers provide fully processed, reliable touch coordinates for a variety of consumer, industrial and medical applications.
Wolfson launches advanced PMIC line
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7/31/2009   Post a comment
Wolfson Microelectronics' latest power management chips are the first to employ its BuckWise regulator technology, helping to cut support components and facilitate advanced multitasking.
NXP Class-D car audio amplifier offer high efficiency
Product News  
7/31/2009   Post a comment
NXP has introduced a family of dual channel Class-D amplifiers that according to the vendor's promises deliver high sound quality and energy efficiency. The NXP TDF8599 Class-D amplifier family operates with maximum output power from 70 to 130 watts (250 watts mono), significantly reducing power dissipation in the vehicle head-unit when compared to traditional Class-AB amplifiers and ensuring more efficient heat management.
SEMI hails European communication on 'high-tech' industry
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7/31/2009   Post a comment
SEMI has claimed that its campaign for greater recognition of, and support for, chip manufacturing in Europe is paying off. Evidence for this will come Sept. 23, SEMI said, when it expects the European Commission's Directorate General for Enterprise & Industry will produce a communication recognizing the importance of "Enabling High-Tech" industries.
Globalfoundries more advanced than TSMC, analyst says
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7/31/2009   Post a comment
In the competitive foundry landscape, Globalfoundries might be not a leader in terms of volume, but in any case it is a leader in terms of technology, finds Gartner analyst Bob Johnson.
Wolfson Q2 sales up 32% sequentially
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7/31/2009   Post a comment
Wolfson Microelectronics plc (Edinburgh, Scotland), a supplier of mixed-signal circuits for consumer electronics, made an operating loss of $2.4 million on second quarter revenue that reached $33.2 million, a rise of 32 percent sequentially but down 38 percent from Q2 2008.
Baumer : Level sensor mounts onto standpipes
Product News  
7/31/2009   Post a comment
Baumer’s FFDK 16 level sensors is easily mounted onto a standpipe or a tube using the included cable tie.
Head unit increasingly resembles PC, iSuppli finds
News & Analysis  
7/31/2009   1 comment
Economic pressure and customers' requirements will urge car manufacturers to look at the PC market when meeting design decisions for future head units, predicts market researcher iSuppli. Thus, the differentiating features move into the software — with some interesting consequences.
NXP names head of US identification business
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7/31/2009   Post a comment
Dutch chip manufacturer NXP BV (Eindhoven, The Netherlands) has appointed Anthony Sabetti as senior director for business development, strategy marketing for the identification (ID) business in North America.
Silicon Valley, Wall Street meet at interconnect event
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7/30/2009   Post a comment
The Hot Interconnects conference will move from its longstanding home on the Stanford campus to Lower Manhattan next month as organizers try to bring together Silicon Valley technologists and bleeding edge systems users on Wall Street, in part to debate the competition between 10 Gbit Ethernet and Infiniband.
Asyst sells assets to three companies
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7/30/2009   Post a comment
Ending perhaps the last chapter in a painful saga, Asyst Technologies Inc. has agreed to sell its entire assets to three companies: Crossing Automation Inc., Murata Machinery Ltd. and the Peer Group.
Climbers, descenders seen in Q2 IC rankings
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7/30/2009   Post a comment
A rebound in chip sales for the second quarter has caused a major change in the overall IC rankings in the period, according to IC Insights Inc.
OSRAM TopLED Black Series LEDs improve readability in high ambient light conditions
Product News  
7/30/2009   Post a comment
The TopLED Black Series with lens from OSRAM Opto Semiconductors is a range of medium-power LEDs mounted in an industry standard package but in matte black material. The black package offers significantly higher contrast with lower reflectivity than comparable white-package devices without compromising overall luminous intensity.
New E85 station opening in Arizona
Product News  
7/30/2009   Post a comment
The Renewable Fuels Association (RFA) announces the opening of the first E85 station in Coolidge, Arizona. E85 is a blend of 85 percent ethanol, 15 percent gasoline, designed for flex-fuel vehicles.
Kappos sketches out plans for patent office
News & Analysis  
7/30/2009   1 comment
David J. Kappos, nominated by President Barack Obama to head the U.S. Patent and Trademark Office, pledged to "refashion the patent examination process" and improve funding for the patent office in his confirmation hearing before the Senate Judiciary Committee Wednesday.
ARC in take-over talks
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7/30/2009   Post a comment
ARC International plc (St, Albans, England), a licensor of configurable processor cores, has confirmed that it is in discussions which may result in an offer being made for the company. ARC made a regulatory announcement after its share price started on climb on Wednesday (July 29).
Imagination considers growth by acquisition
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7/30/2009   Post a comment
Multimedia core licensor Imagination Technologies Group plc (Kings Langley, England) is on the look out to grow by acquisition, as well as organically, according to Tony King-Smith, vice president of marketing.
Nissan provides e-car technical details
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7/30/2009   Post a comment
Japanese car maker Nissan plans to introduce its electric volume vehicle for 2010 production start. The OEM already offered a glimpse to the car's electric drive and internal IT systems. Surprise: The driving range is 160 km — not bad to start with.
Karlsruhe tram-train runs field trial on Ni-Cd battery system
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7/30/2009   Post a comment
The pioneering Stadtbahn Karlsruhe tram-train network in Germany has completed an extended field trial with a Saft MATRICS MRX battery system to demonstrate the potential reliability, performance and TCO (Total Cost of Ownership) advantages offered by using specialised rechargeable nickel-cadmium (Ni-Cd) batteries in a light rail application.
TSMC raises capex, yields up in strong Q1
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7/30/2009   Post a comment
Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) posted strong results in the second quarter and raised its capital spending for 2009.
Micron rolls DDR3 LRDIMM
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7/30/2009   Post a comment
Micron Technology Inc. said that it has rolled out the industry's first DDR3 load-reduced, dual-inline memory module (LRDIMM).
Lane Electronics : Circular reverse bayonet coupling connectors suit military and industrial applications
Product News  
7/30/2009   Post a comment
Lane Electronics announces the MG series of circular bayonet coupling connectors with reverse bayonet coupling. Originally designed for military applications, the connectors are also well suited for industrial and transport applications including railways.
Akros Silicon : Quad-output power SoC is 92 percent dc-dc efficient
Product News  
7/30/2009   Post a comment
Akros Silicon Inc. introduces an isolated quad-output digital power SoC that sets a new integration benchmark for the isolated dc-dcs that are used in a wide range of industrial, datacom, automotive, medical, residential gateway, display and other distributed power applications.
DAC attendance spots recessionary times
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7/30/2009   Post a comment
Preliminary attendace figures at this year's Design Automation Conference show an increase in total conference and exhibit attendance by 12 percent over last year's DAC held in Anaheim, Calif. and by three percent over the 2007 San Diego event.
ST, Stollmann partner to deliver turnkey NFC solutions
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7/30/2009   Post a comment
STMicroelectronics NV (Geneva, Switzerland) and communications software development house Stollmann GmbH (Hamburg, Germany) announced they have teamed to deliver turnkey NFC (Near Field Communication) interface solutions, complete with the necessary hardware and software components.
GlobalFoundries could be the elusive Eurofoundry, and more
News & Analysis  
7/30/2009   1 comment
If Infineon could be persuaded to follow ST and switch outsourced IC manufacturing to GlobalFoundries in Dresden, we would some of the way along the path to creating a Eurofoundry that would keep advanced digital CMOS manufacturing in Europe, albeit with the help of Abu-Dhabian petrodollars.
Micronova shrinks HiL simulator to desktop size
Product News  
7/30/2009   Post a comment
With the NovaSim Micro, test devices vendor Micronova (Vierkirchen, Germany) has shrunk Hardware-in-the-loop (HiL) simulators to desktop size. Despite its small size, the simulator runs function tests on complex ECUs, the vendor promises.
SMSC rolls MOST network analyzing solution
Product News  
7/30/2009   Post a comment
With the Optolyzer G2 Premium bundle, chip vendor SMSC introduces a high-end analysis toolset that is part of SMSC Optolyzer G2 family. The bundle comes with an Optolyzer G2 for MOST25, MOST50 and MOST150 networks.
Motorola Q2 net profit up on cost cutting but sales fall
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7/30/2009   Post a comment
Motorola Inc.'s net income rose sharply in the second quarter on falling costs and improved operating margins although sales continued to decline and market share in the wireless handset division eroded further.
Continental just keeps afloat in 1H09
News & Analysis  
7/30/2009   Post a comment
Automotive tier one Continental AG has managed to just keep its adjusted operating figures positive in the first half of the year, but under the bottom line the company made a hefty loss. The outlook is very cautious.
ST sees positive backlog indicators for Q4
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7/30/2009   Post a comment
In a commentary of financial results for the first half of fiscal year 2009, European chipmaker STMicroelectronics NV (Geneva, Switzerland) expressed optimism as it expects demand to recover in the second half of 2009.
Unipower : 350W medical switchers deliver continuous full power to 50 degree C
Product News  
7/30/2009   Post a comment
Unipower’s AG-350PM series of power factor corrected switch mode power supplies are designed specifically for the medical systems market.
Binder : Shieldable M12 connectors have an 8 to 10 mm cable outlet
Product News  
7/30/2009   Post a comment
Due to UL approvals, chain flex requirements and increasing pole numbers, the outer diameters of cables tend to become bigger.
Chances dwindle for Apollo's Infineon investment, paper says
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7/30/2009   Post a comment
The likelihood that private equity investor Apollo Global Management LLC could take a minority share at still loss-making chip maker Infineon are vanishing, reveals Financial Time Deutschland (FTD).
Final curtain falls for Qimonda
News & Analysis  
7/30/2009   1 comment
Insolvent DRAM manufacturer Qimonda AG's Dresden fab, which has been set into a 'sleep mode' in April, will be switched off for good by the end of the year. In his search for an investor, insolvency administrator Michael Jaffé hoists the white flag.
Soitec, Corning to develop substrates for OLED mobile displays
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7/30/2009   Post a comment
Soitec SA (Bernin, France) and Corning Inc. (Corning, N.Y.) have concluded an agreement in a view to develop advanced substrates for the flat panel mobile display market.
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