DeepScale on Robo-Car: Fuse Raw Data
News & Analysis 9/21/2017 Post a comment
DeepScale has developed a perception system for ADAS/autonomous vehicles. It offers pre-trained AI algorithms, based on raw data, not object list, coming from multiple sensory data types, and accelerates its fusion on an embedded processor like Snapdragon.
Smartphones: Have NFC Will Travel
News & Analysis 9/20/2017 Post a comment
Vendors of smartphones — both Android and iPhone — are putting an NFC reader in the hands of consumers, making NFC a globally interoperable platform to connect, commission, and control things with NFC tag. IoT is NFC’s next big opportunity.
Agricultural Goes High Tech
News & Analysis 9/15/2017 Post a comment
At Germany’s Geisenheim University, an agricultural institute situated in a wine region, vineyards are a test bed for the effects of rising CO2 levels on plant growth.
Robo-car Early-Birds Flock Together
News & Analysis 9/11/2017 12 comments
Those who came to a small automated vehicle event ranged from a former Microsoft executive to a simulation expert and a startup in Silicon Valley, illustrating the changing balance of power and new constituents in the mobility ecosystem.
Toshiba Plans Next Memory Fab
News & Analysis 9/8/2017 1 comment
Even as the future of Toshiba Memory remains unclear, firms chooses Kitakami City in Japan's Iwate prefecture as site of Toshiba's next memory chip fab.
GE Venture, Nvidia Bond over Inspection AI
News & Analysis 9/8/2017 Post a comment
Avitas Systems and Nvidia have partnered to enable AI in inspection services for the industrial sector. Asked about the limitations of today’s AI, Avitas chief said, still missing is an AI’s ability to compute on the very edge device itself.
Intel Wins Appeal on EU Antitrust Fine
News & Analysis 9/7/2017 2 comments
Nine years after the European Union fined Intel more than $1.3 billion for antitrust violations, an appeals court tossed the case back to a lower court for re-evaluation.
Ex-Baidu Scientist Blazes AI Shortcut
News & Analysis 8/31/2017 4 comments
Ren Wu, formerly a distinguished scientist at Baidu, has pulled a new AI chip company out of his sleeve, called NovuMind. In an exclusive interview with EE Times, Wu discussed the startup’s developments and what he hopes to accomplish.
Google Fellow: Neural Nets Need Optimized Hardware
News & Analysis 8/23/2017 1 comment
Jeff Dean, leader of the Google Brain project, told an audience at the Hot Chips conference that neural networks need specialized computers to perform a small handful of specific operations that make up the vast majority of machine learning models.
Startup Unveils Graph Processor at Hot Chips
News & Analysis 8/21/2017 Post a comment
ThinCI, in presenting its “Graph Streaming Processor (GSP),” claimed that its graph processor can beat traditional computing engines such as GPU and DSP due to GSP’s abilities to do direct graph processing, on-chip task-graph management and execution, and task parallelism.
ThinCI Q&A on Deep-Learning
News & Analysis 8/16/2017 1 comment
ThinCI will detail next week at Hot Chips its deep learning processor. Last week, Denso revealed a new subsidiary to develop IP cores for automated driving. We caught up with ThinCI CEO to connect the dots.
Room-temp Laser-on-CMOS Achieved
News & Analysis 8/7/2017 7 comments
Researchers from Arizona State and Tsinghua Universities achieved a room-temperature CMOS laser using a molybdenum ditelluride monolayer over a silicon cavity.
Engineer's Guide to Imaging Valley
News & Analysis 8/4/2017 Post a comment
French researchers have accumulated key imaging technologies, ranging from X-ray and far infrared to visible image sensors, 3D imaging, and software – all concentrated in Grenoble area. Here are key movers and shakers in Imaging Valley.
IBM Claims Tape Density Record
News & Analysis 8/3/2017 2 comments
In a boost for Big Data, IBM Research has set a tape areal-density record of 201 gigabytes/square inch on nano-grained sputtered tape from Sony Storage Media Solutions.
ST Sprints While Q’comm Deal Hobbles NXP
News & Analysis 8/1/2017 Post a comment
STMicroelectronics is sprinting toward the winner’s circle in MCUs, NFC and sensors, while NXP is hobbled by its pending acquisition by Qualcomm. ST, claiming No. 3 share in volume MCU market, disclosed a plan for 64-bit MCU, and FD-SOI.
Ions Power Machine-Human Interface Demo
News & Analysis 7/27/2017 Post a comment
The University of Maryland’s NanoCenter demonstrated an “inverted” battery that converts electrical signals into the ion power used by the human brain’s synapses to yield what it says is a perfect machine-to-human interface.
Startup Campus Beckons Int'l Inventors
News & Analysis 7/27/2017 1 comment
From Shenzhen to New York and Silicon Valley, incubators are popping up, providing affordable space for entrepreneurs to build and nurture startups. Among them, what makes Station F — recently opened in Paris as the world’s largest startup campus — different?
Semiconductor M&A Fervor Cools
News & Analysis 7/25/2017 Post a comment
The value of semiconductor industry deals fell markedly in the first half of this year as the absence of "megadeals" brought down the total value of transactions, according to IC Insights.
Neural Accelerator Battle Begins
News & Analysis 7/21/2017 7 comments
The embedded market for neural network accelerators is heating up, with more systems — ranging from smart speakers and drones to light bulbs — poised to run neural networks locally instead of going back to the cloud for computation.
Mesh to Thrust Bluetooth in Industrial IoT
News & Analysis 7/18/2017 3 comments
Mesh Networking is finally coming to Bluetooth as a formally ratified, interoperability- tested global standard, allowing Bluetooth proponents to target a whole new machine-to-machine, industrial Internet of Things market. Might it mend IoT mess?
Woodie Flowers: Things, Not Theory
News & Analysis 7/17/2017 23 comments
The legendary MIT professor who helped start the FIRST Robotics Competition discusses what engineers need. In Part 1, Flowers explains how engineering is about solving practical problems.