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Lattice Deal: Harbinger of FPGA & ASSP Union
News & Analysis  
5/1/2015   1 comment
Lattice CEO, after its acquisition of Silicon Image in March, believes the marriage of FPGA company to an ASSP firm is a match made in heaven. He said, “That’s why Intel wants Altera. It’s obvious.” But is it?
Effective Code Coverage Comes to Multicore Software
News & Analysis  
5/1/2015   Post a comment
New code coverage tool gives greater visibility into software running on a multicore design.
NXP CEO on China, Apple Pay, IoT & V2V
News & Analysis  
4/30/2015   1 comment
In unveiling its Q1 earnings, NXP CEO talks about the pending RF power business sales, its China strategy, a new mobile payment market that Apple Play in China may trigger, and its IoT strategy.
How the 3 Cs Drive IC Consumption
News & Analysis  
4/29/2015   1 comment
The communications, computers and consumer electronics sectors are set to be responsible for more than 70 percent of IC sales in every geographic region -- Americas, Europe, Japan, and Asia-Pacific -- in 2015, according to market research firm IC Insights.
Ethernet Geared for Cars, Factories
News & Analysis  
4/29/2015   7 comments
A new class of Ethernet chips and software will emerge next year, opening the networking technology up to use in time-sensitive applications in cars, factory robots and more.
Start-up's Co-Robots Handle Logistics
News & Analysis  
4/29/2015   1 comment
Seven month old startup Fetch Robotics is already releasing its first product for warehouse logistics -- a pair of co-robots that fetches online orders from warehouse shelves and sends them to automated machinery that seals the box and applies its label.
IBM Solves Quantum Computing
News & Analysis  
4/29/2015   17 comments
IBM's new prototype of its future quantum computer corrects errors that spoil calculations and is scalable to any size.
Topic Teardown: Connected Cars' Pros & Cons
Teardown  
4/28/2015   11 comments
We illustrate the benefits of connected cars. We analyze the driving force behind the connected car. We will scout security measures necessary inside cars in order to make connected cars less vulnerable to external malicious attacks.
Ruggedized Tire Pressure Sensor Raises Bar
News & Analysis  
4/28/2015   1 comment
Heavy trucks, buses and construction vehicles can now have the luxury of automatic tire pressure monitoring with Freescale's new chip that it claims also issues warnings that can prevent blowouts.
Freescale Reveals NXP Mega Merger Details
News & Analysis  
4/24/2015   9 comments
Five companies, aside from NXP, were in talks with Freescale, and CEO Gregg Lowe will be leaving post merger. Freescale reveals details of the NXP merger during its quarterly results call.
Elvis Sees All in Russia
News & Analysis  
4/23/2015   17 comments
A Russian company claims it has the first Russian designed smart chip. The video intelligent processor (VIP-1) is sold in surveillance systems in Russia, but may be sold as a bare-chip overseas.
Cadence Tensilica Fusion DSP Core Targets IoT, Wearables
News & Analysis  
4/22/2015   Post a comment
Tensilica Fusion is a configurable and scalable DSP that is ideal for applications requiring specialized computation, ultra-low power consumption, and the smallest possible footprint.
TI Obsoletes FPGA
News & Analysis  
4/21/2015   56 comments
Texas Instruments is out to kill the FPGA with a nine processor chip that can downsize avionics, military and medical applications to portable size -- from backpack radars to portable MRIs.
Athena Security IPs Designed to Mend Holes in SoCs
News & Analysis  
4/21/2015   6 comments
We see rapidly growing needs for protecting connected systems by using security chips with crypto keys inside. But how do we know if security chips themselves (designed into such connected systems) aren’t leaking key information?
Wearable Cameras Next Boom Market for Image Sensors
News & Analysis  
4/20/2015   Post a comment
Annual shipments of wearable cameras will surpass 30 million units by 2020 according to market research firm Tractica.
Making Wireless LoRa Design Easier, Faster
News & Analysis  
4/20/2015   1 comment
Microchip has a pre-certified coin-cell sized module to accelerate deployment of LoRa wireless networks.
Transceiver Supports Dual 2.4 GHz IoT Networks
News & Analysis  
4/20/2015   Post a comment
Industrial applications, home automation, and the like often need multiple networks to be active. This transceiver helps bridge them.
TSMC Cuts Capex by $1 Billion
News & Analysis  
4/16/2015   4 comments
Taiwan Semiconductor Manufacturing Co. (TSMC) is cutting its planned capital expenditure for this year by $1 billion, citing improvements in capital efficiency and a faster-than-expected migration to its leading-edge 16nm process technology.
Apple Buys Array Camera Firm LinX
News & Analysis  
4/15/2015   Post a comment
Apple has acquired Israeli startup LinX Computational Imaging Ltd., the developer of an array camera for mobile equipment, for a purchase price estimated at about $20 million.
Intel Does Balancing Act
News & Analysis  
4/15/2015   Post a comment
In its Q1 results, predictably Intel's PC business is down but data center, IoT, and nonvolatile memory made up for PC loses. Surprisingly capex goes down.
Module Makes BLE a Drop-In Design Element
News & Analysis  
4/14/2015   6 comments
The EZ-BLE radio module is fully self-contained, making Bluetooth Low Energy connectivity easy to add.
MEMS Startup Selects MIPS for Sensor Hubs
News & Analysis  
4/10/2015   Post a comment
A South Korean startup has licensed a MIPS Warrior M-class CPU core from Imagination Technologies Group plc for use in sensor hubs it is developing to address IoT, wearables and automotive applications.
Sony Tips Billion-Dollar Capex for Stacked Image Sensors
News & Analysis  
4/9/2015   Post a comment
Sony Corp. has announced an additional $375 million of spending planned for the 2015 fiscal year to further increase its ability to manufacture stacked CMOS image sensors.
On Semi Wins Image Sensor Slot
News & Analysis  
4/9/2015   Post a comment
A tear down of the Hero entry-level sports camera from GoPro Inc. by market research firm IHS Technology reveals that Hero is based on the A7LS34 image processing chip from Amberella Inc. and a CMOS image sensor from Aptina, now part of On Semi.
RTOS Evolves to Ease Wireless IoT Device Design
News & Analysis  
4/9/2015   Post a comment
Automated power management and built-in drivers allow this RTOS to greatly simplify IoT design.
Intel's 'Plans' for Atom x3 in IoT/Wearables, Bargain Smartphones
News & Analysis  
4/9/2015   2 comments
Intel's Developer Forum in Shenzhen kicked off a major effort to woo Chinese firms and developers to Atom for wearables, mobiles and IoT.
TSMC Outlines 16nm, 10nm Plans
News & Analysis  
4/8/2015   2 comments
TSMC announced plans to roll out updated low-power versions of existing chips and announced its roadmap for smaller process nodes. The company will begin volume production of its 16nm FinFet+ in the middle of this year while breaking ground on 10nm development.
IC Insights Halves Sensor Growth Forecast
News & Analysis  
4/7/2015   Post a comment
Market research firm IC Insights Inc. has more than halved the growth it expects to see in the sensors and actuators semiconductor category during 2015 and 2016.
Omnivision Loses Ground in CMOS Image Sensor Ranking
News & Analysis  
4/7/2015   Post a comment
Sony has pulled out a lead over its nearest competitors in the CMOS image sensor market in 2014 winning more than a quarter of the global market, according to according to market research company Yole Developpement.
Code Visualization Comes to ARM Community
News & Analysis  
4/7/2015   Post a comment
Percepio has joined the ARM Connected Community, bringing its Tracealyzer code visualization tool to the party.
Atmel Bids for Low-Power MCU Leadership
News & Analysis  
4/7/2015   Post a comment
Atmel is targeting its SAM21 MCUs at the needs of Internet of Things developers by providing fine-grained feature-by-feature power management.
Sony Licenses Bonding Technology from Ziptronix
News & Analysis  
4/2/2015   Post a comment
Ziptronix Inc., a developer and provider of low-temperature direct bonding interconnect (DBI) technology for 3D integration, has announced a patent licensing agreement with Sony Corp. for the application of its technology to image sensors.
CCD Image Sensors are Dead, says Yole
News & Analysis  
4/2/2015   Post a comment
"This is the beginning of the end for Sony CCDs," says Yole's imaging and sensors analyst.
KIT, Schaeffler Optimize Power Steering for Electric Cars
News & Analysis  
4/1/2015   Post a comment
A joint research project from mechatronics company Schaeffler AG and the Karlsruhe Institute of Technology is developing concepts that make power steering for electric vehicles more energy efficient.
Neural Networks Take on Embedded Vision
News & Analysis  
3/30/2015   1 comment
Synopsys configurable vision coprocessor architecture uses ARC-based RISC cores in tandem with specialized object detection processing engines.
How Will Deep Learning Change SoCs?
News & Analysis  
3/30/2015   5 comments
Deep learning is changing the way computers see, hear and identify objects -- but will it ever migrate into smartphones or vision SoCs for cars? Has anybody come up with SoCs optimized for neural networks?
Robotic Bacteria Senses Humidity
News & Analysis  
3/27/2015   Post a comment
A bacterial spore studded with graphene quantum dots makes the world best humidity sensor according to researchers at the University of Illinois at Chicago.
Bosch Rides Apple to MEMS Dominance
News & Analysis  
3/26/2015   5 comments
How did Bosch achieve a future “MEMS titan” status? Why is STMicroelectronics slipping? Get the lowdown of MEMS Industry status and technology breakdown.
Core Independent MCUs Come to Power Management
News & Analysis  
3/26/2015   Post a comment
Using redundant sets of key power management functions, Microchip has used its core independent peripheral architecture in an 8 bit MCU to bring a high degree of flexibility to power supply, automotive, battery management, and LED display apps.
Free Online Class Teaches Analog Design
News & Analysis  
3/25/2015   Post a comment
A new online classroom from TI provides training and hands-on experience in analog design.
MCU Vendors Engaging in Low-Power Leapfrog
News & Analysis  
3/25/2015   8 comments
Competition to be the low-power MCU leader has resulted in a burst of product introductions, but it is the developer who will ultimately win.
Intel's Xeon Phi to House 72 Cores
News & Analysis  
3/25/2015   12 comments
Intel's Xeon Phi mutiprocessor, with up to 72 cores and integrated Micron Hybrid Memory Cubes, will accelerate both enterprise and supercomputer workloads.
TI’s 32-bit 'Successor' to the 16-bit MCU
News & Analysis  
3/24/2015   Post a comment
TI's new ARM Cortex-M4F-based MCU is a higher performance alternative to traditional the 16-bit MSP430 and a lower power and feature-rich alternative to the ARM Cortex-M0.
Panasonic: ‘747 Is Our Connected Device’
News & Analysis  
3/24/2015   6 comments
Panasonic unveiled its plan to offer royalty-free access to its software and patents to help speed the growth of the Internet of Things. We caught up with Panasonic’s CTO, asked him about the company's IoT patents and software.
Multicore MCU Brings Gigabit Ethernet to IoT
News & Analysis  
3/23/2015   Post a comment
Multiple cores bring blazing speed to low-cost MCUs for Ethernet connectivity and audio applications.
Bringing Sub-Threshold Voltage to Any MCU
News & Analysis  
3/23/2015   Post a comment
Based on the same subthreshold voltage technology used in its ARM-based Apollo Cortex-based processors, Ambiq's real-time clock family brings its low power benefits to any MCU-based design.
Amazon Drones Need a Few Breaks from the FAA
News & Analysis  
3/20/2015   2 comments
Amazon received an “experimental airworthiness certificate” from the FAA, but it isn't quite a breakthrough?. Not so much. Here’s why Amazon Prime Air’s dream of package delivery via drones is still a long shot.
Patent Filings: Who Made the Cut for Top 50?
News & Analysis  
3/19/2015   5 comments
We often measure the technology prowess – of a nation, a company – by the number of international patents filed and granted. China’s Huawei Technologies was the top applicant for international patents in 2014, according to a WIPO report.
Industrial IoT Drives Microsemi-Vitesse Merger
News & Analysis  
3/18/2015   Post a comment
Microsemi Corp. will acquire Vitesse Semiconductor Corp. for $389 million to focus on “communications semiconductors.” On horizon is the MIPS vs. ARM conflict as the two companies use two diverging processor cores of their product lines.
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NEXT UPCOMING BROADCAST
Why Connect a Car?
May 11, 1pm EDT Monday
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
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