Analysis: Why Renesas is creating mobile IC spinoff News & Analysis 10/31/2010 5 comments Renesas Electronics' decision to spin out its mobile semiconductor products into a separate subsidiary is motivated not only by the differences between the markets for microcontrollers and baseband chips, but also to help protect Renesas' power amplifier business.
Graphene bandgap opened by vapor News & Analysis 10/29/2010 10 comments Tuning a semiconductor bandgap in sheets of pure carbon called graphene can be done using water vapor during fabrication, according to researchers from Rensselaer Polytechnic Institute.
Analog chip vendors post profits News & Analysis 10/28/2010 5 comments Analog chip vendors Maxim Integrated Products, Alpha and Omega Semiconductor and MaxLinear reported profits for their most recently concluded quarters
Interconnect pushed China super to #1 News & Analysis 10/28/2010 26 comments A homegrown, ultrafast interconnect chip set was part of the secret sauce behind the Tianhe-1a, the first China-built system to be named the world's fastest supercomputer.
Hynix, Magnachip post Q3 gains News & Analysis 10/28/2010 1 comment South Korean chip makers Hynix Semiconductor and MagnaChip Semiconductor reported third quarter sales increases despite some signs of a softening semiconductor market.
Will Broadcom buy change the femto market? News & Analysis 10/28/2010 13 comments Broadcom’s $86 million acquisition of Percello validates the fledgling femtocell market; it presents a scenario for femtocell to get integrated in another box; and it shows the future of femtocells priced on par with WiFi.
PandaBoard touts low-cost OMAP 4 mobile software dev Product News 10/28/2010 3 comments PandaBoard is an open source development tool for mobile devices that provides access to the OMAP 4 applications processor platform from Texas Instruments Incorporated (TI). The OMAP 4 platform is power- and performance-optimized for Smartphones and other mobile devices. A growing online community of Linux experts supports PandaBoard developers designing on mobile open source software distributions such as Android, Angstrom, Chrome, MeeGo and Ubuntu.
Intel backs cloud computing alliance News & Analysis 10/27/2010 6 comments Intel through its clout behind cloud computing, pledging to help drive the creation of standards, including participation in an alliance of global businesses.
Projection display firm raises VC News & Analysis 10/27/2010 2 comments Light Blue Optics Ltd., a startup company developing a color projector suitable for inclusion in mobile phones and other portable equipment, has announced it has raised $13 million in funding.
BI Technologies Model 144 series resistor networks Product News 10/27/2010 2 comments Aimed at military and aerospace applications, TT electronics BI Technologies is offering high-reliability custom resistor networks in hermetically sealed metal or HTCC packaging, enabling harsh environment operation to +175°C.
IBM, European researchers seek CMOS successor News & Analysis 10/27/2010 6 comments IBM Research Zurich, Infineon Technologies and Globalfoundries have joined forces with a half dozen European universities and research centers on a mission to cut the power consumption of electronic devices by10-fold and reduce standby power to zero.
STMicro hits Q3 target, names new COO News & Analysis 10/26/2010 Post a comment STMicroelectronics reported revenue for the third quarter in line with consensus analyst expectations and said it expects further growth in sales in the fourth quarter despite softening of demand in some market applications.
Cadence sketches out tools vision News & Analysis 10/26/2010 5 comments Cadence Design Systems, Inc. rolled out a strategy to provide an end-to-end flow silicon and software design tools as part of a new EDA360 campaign.
Veeco's Q3 sales up big News & Analysis 10/26/2010 Post a comment Chip equipment vendor Veeco its third quarter sales more than tripled compared with the third quarter of 2009, beating consensus analyst expectations for the period.
Qimonda settles with U.S. subsidiaries News & Analysis 10/26/2010 1 comment German chip maker Qimonda said its insolvency administrator has reached a settlement with Qimonda's U.S. subsidiaries, giving the parent company the right to over 800 patents and patent applications, according to a Dow Jones report.
Rohm's BD8381EFV-M LED driver Product News 10/25/2010 Post a comment ROHM Semiconductor has developed LED driver for automotive forward illumination applications that allows designers to specify the same driver for use in high-beam, low-beam and daytime running light circuits.
Modest growth projected for ICs in 2011 News & Analysis 10/25/2010 5 comments Semiconductor industry revenue is projected to grow 5.1 percent in 2011, according to market research firm iSuppli, which predicts the industry will enjoy a "soft landing" after a booming 2010.
Scenes from USA tech fest News & Analysis 10/25/2010 8 comments Photos from the USA Science & Engineering Festival, a two-day event held on the National Mall that drew tens of thousands of participants.
Atrenta, TSMC team on soft IP qualification flow News & Analysis 10/25/2010 Post a comment Atrenta Inc., a provider of early design closure solutions, and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) announced they have joined forces to enhance the quality of delivered synthesizable IP using Atrenta's SpyGlass platform.
Intel's embedded Xeon tackles avionics News & Analysis 10/25/2010 6 comments Mercury Computer systems claims first dibs on ruggedizing Intel's high-performance Xeon server processors to for avionics, space, surveillance and military pattern recognition.
CEA-Leti develops infrared-active 3D imaging matrix Product News 10/25/2010 Post a comment CEA-Leti has unveiled what it claims is the first single-impulse active 3D imaging matrix operating at infrared frequency capable of returning a three-dimensional image of a distant object with a spatial resolution of 30cm from a single-laser flash.
Sigma chips drive home nets three ways News & Analysis 10/25/2010 6 comments Sigma Designs hopes to leapfrog separate coax, telephone or power line home networking chips with a new chip set that supports a mix of new and existing standards over all three wires.