Fairchild files patent lawsuit against Infineon News & Analysis 11/29/2008 Post a comment Fairchild Semiconductor (San Jose, Calif.) is suing Infineon Technologies AG in the U.S. District Courts of Maine and Delaware, claiming some of the German group's CoolMOS and OptiMOS power management devices, as well as its Infineon IGBT and CanPak parts, infringe one or more of eight Fairchild patents.
UCLA develops higher efficiency polymer solar cells News & Analysis 11/28/2008 Post a comment Researchers at the UCLA Henry Samueli School of Engineering and Applied Science have shown the possibility of creating a new polymer for use in solar cells that exhibits greater sunlight absorption and conversion capabilities than existing polymers.
ST, INRIA team on embedded systems News & Analysis 11/28/2008 Post a comment STMicroelectronics NV and INRIA, the French national institute for research in computer science and control, have signed a partnership agreement for next-generation embedded systems.
Nujira touts PA efficiency advance in handsets News & Analysis 11/28/2008 Post a comment Power amplifier specialist Nujira (Cambridge, England) is claiming PAs in handsets that use its High Accuracy Tracking technology are twice as efficient during HSUPA transmissions, and 1.5 times as efficient during W-CDMA transmissions, than the same PA with a standard constant voltage (CV) supply as widely deployed in the industry today.
ST cuts Q4 revenue growth forecasts News & Analysis 11/28/2008 Post a comment European chipmaker STMicroelectronics NV has significantly downgraded its revenue growth outlook for the fourth quarter of 2008 and now expects revenues to be between $2.2 billion and $2.35 billion.
Nanotube switching effect discovered News & Analysis 11/27/2008 Post a comment Scientists from the Karlsruhe Institute of Technology (KIT) (Karlsruhe, Germany) have unexpectedly discovered a physical effect that potentially can be used to develop novel electronic components. By means of the effect, the conductance of the nanotubes can be controlled.
Global chip sales seen tumbling in October News & Analysis 11/27/2008 Post a comment The three-month moving average of global chip sales is expected to come in at $22.8 billion for October, down 1 percent on the $23 billion achieved in September, according to Bruce Diesen, analyst at Carnegie ASA in Oslo, Norway.
ERG : EL inverters offer plug-and-play solutions Product News 11/27/2008 Post a comment The family of Smart Force dc-ac EL inverters from Endicott Research Group provides a wide range of standard and custom solutions for display and device designers who need to power electroluminescent (EL) backlit LCDs or devices where EL is used for accent and decorative lighting.
AMD spin-off Foundry Co. sees no long-term downturn News & Analysis 11/27/2008 Post a comment AMD's manufacturing arm which is heading for a spin-off to form a foundry services provider, regards the current downturn as a good anti-cyclical investment opportunity. Nevertheless, the company is aware of the challenges they are approaching, said two top managers of the company.
3-D memristor chip debuts News & Analysis 11/26/2008 Post a comment Memristors technology got a boost recently from Hewlett-Packard Labs, which described the first 3-D memristor chip at a conference in Berkeley, Calif.
Price erosion round the corner for PNDs News & Analysis 11/26/2008 Post a comment Fierce competition and commoditization of entry-level personal navigation devices (PND) is likely to bite into the large profits made by makers of the devices over the past few years when sales grew at exponential levels, according to market research group Berg Insights (Gothenburg, Sweden).
Industrial Automation: To date no sign of recession News & Analysis 11/26/2008 Post a comment At SPS/IPC/Drives exhibition in Nuremberg the industrial automation industry shows no sign of a recession. The industry is in a good mood, there is still growth and the ZVEI (German Electrical and Electronic Manufacturers' Association) expects further growth due to extensive bookings.
NXP, Phonak team for enhanced acoustics Product News 11/26/2008 Post a comment NXP Semiconductors and Phonak have jointly developed a single chip ultra low power radio for use in hearing systems that is being integrated into Phonak's forthcoming range of hearing aids and wireless accessories.
EC approves proposed JV between ST, Ericsson News & Analysis 11/26/2008 Post a comment The European Commission announced Wednesday (Nov. 26) it has authorized, under the European Union merger regulation, the creation of a joint venture between EMP, the wireless platform business of Ericsson, and ST-NXP, the wireless semiconductors business of STMicroelectronics.
Cadence exec downplays Connections controversy News & Analysis 11/26/2008 Post a comment An executive from EDA vendor Cadence Design Systems downplayed a report that suggested that Cadence had removed from membership a large number of software vendors from its Connections partnership program and defended Cadence as having the "broadest partner program in the industry."
Italy plays host to MEMS 2009 Product News 11/25/2008 Post a comment The advance registration deadline of November 30th is about to expire for the 22nd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2009).
Analog Profile: Jim Solomon News & Analysis 11/25/2008 Post a comment As part of the 'Analog Profiles' series in which we dig a little deeper into the backgrounds of the people shaping the analog sector, ADLE interviews Jim Solomon, Executive Chairman at Gemini Design Technology.
Spansion warns on Q4 revenue News & Analysis 11/25/2008 Post a comment NOR flash memory specialist Spansion became the latest semiconductor supplier to issue a warning about revenue in the current quarter, saying it expects fourth quarter net sales to be down about 20 percent sequentially.
UMC validates high-k process at 45nm News & Analysis 11/25/2008 Post a comment United Microelectronics Corp. has validated its high-k metal gate process with a test SRAM design run at the 45 nm node, a step toward the company's goal of offering a high-k process at the 32 nm node in 2010.
Industrial-, automotive-grade Atom processor coming, says report Product News 11/25/2008 Post a comment The world's largest chip maker Intel Corp. (Santa Clara, Calif.) is developing a variant of its Atom processor for use in harsh environments such as automotive applications, according to a Nikkei Electronics article. The industrial or automotive Atom, currently named Embedded Menlow XL, is due to ship to customers in 2009, the report said.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.