GAO’s laser source detects fiber faults Product News 11/29/2012 Post a comment Aiding the installation and maintenance of optical networks, the Model C0280003 handheld laser source from GAO Instruments emits a visible red light at a wavelength of 650 nm to identify the location of fiber macrobends, breaks, problem connectors, and improperly aligned mechanical splices.
Is Renesas Mobile's LTE gambit paying off? News & Analysis 11/29/2012 9 comments It's been a tough year for mobile chip vendors like Renesas Mobile. Without a design win in Apple or Samsung smartphones, Renesas and other have no other volume sockets to go after.
Nuclear space engine demo'd by Los Alamos News & Analysis 11/27/2012 6 comments U.S. researchers have demonstrated the first use of a heat pipe to cool a small nuclear reactor used to power a Stirling engine. The concept could be used to power spacecraft.
Calxeda hires former Cisco exec as COO News & Analysis 11/23/2012 Post a comment A startup pioneering the development of ARM-based processor chips and technology for server computers, has announced that Gopal Hegde has joined the company as chief operating officer. Hegde was previously senior director of engineering at Cisco.
Intel buys U.K. graphics chip team News & Analysis 11/22/2012 3 comments Intel is buying a graphics chip design subsidiary from Creative Technology of Singapore in a move that could result in Intel scaling back its use of graphics cores licensed from Imagination.
Mars Curiosity gets down to science News & Analysis 11/21/2012 8 comments The Mars Curiosity rover has begun its search for evidence of microbial life on the Red Planet. A suite of sensors is delivering samples to an on-board lab for analysis.
Ceva bids for MIPS News & Analysis 11/21/2012 5 comments DSP IP licensor CEVA has offered a competing bid of $75 million in cash for MIPS Technologies in an attempt to outbid U.K. GPU licensing company Imagination Technologies.
Europe plots three pilot wafer fabs News & Analysis 11/21/2012 7 comments A European initiative formed to coordinate research in nanoelectronics has proposed projects for the creation of three pilot fabs, including one for 450-mm diameter wafers.