EMI filters integrate ESD protection Product News 2/28/2006 Post a comment Vishay has launched six EMI filter arrays with integrated ESD protection diodes in ultra-small leadless, plastic packages. These devices provide both EMI filtering and ESD protection for data lines in space critical mobile applications.
Inficon buys coating firm News & Analysis 2/28/2006 Post a comment Inficon Inc., a manufacturer of instrumentation and process control software for the semiconductor and vacuum-coating industries, has acquired substantial assets of Electro Dynamics Crystal Corp. (EDC), a developer of quartz-based products.
Symbol, Terabeam settle patent suit News & Analysis 2/28/2006 Post a comment Symbol Technologies Inc. has entered into a licensing agreement with Terabeam, Inc., the parent company of Proxim Wireless Corp., settling long-standing patent litigation between the two companies.
Push-pull connectors enable quick mating Product News 2/28/2006 Post a comment Amphenol Industrial Operations has introduced a series of push-pull aluminum shell connectors that allow for quick mating and unmating. The Amphe-PPM series provides signal and power interconnects in medical instrumentation and process control applications.
Evergreen's loss widens, sales up News & Analysis 2/28/2006 Post a comment Solar cell maker Evergreen Solar Inc. said revenues increased 25 percent to $11.6 million from $9.3 million for the fourth quarter of 2004 and rose 4 percent from $11.1 million for the third quarter of 2005.
Firms partner on PCIe verification News & Analysis 2/28/2006 Post a comment PLDApplications and EVE have forged a partnership whereby, PLDA's x4 PCIe Xpress intellectual property will be embedded in EVE's ZeBu hardware-assisted verification platform.
ATCA platform supports DSP, network processors for WiMAX Product News 2/28/2006 Post a comment Mercury Computer Systems is rolling out a modular AdvancedTCA platform for the dataplane that's built around the performance, scalability, and reliability of the serial RapidIO embedded system interconnect. The platform's architecture supports DSP, communications processors, FPGAs, and network processors.
Asat posts loss, speeds move to China News & Analysis 2/28/2006 Post a comment Amid ongoing losses, Asat Holdings Ltd. said that the transfer of all manufacturing operations to its new facility in Dongguan, China is anticipated to be completed by the end of April -- or about four months ahead of schedule.
Evergreen Solar inks pact with Vermont company News & Analysis 2/28/2006 Post a comment Solar power product supplier Evergreen Solar Inc. has entered a four-year photovoltaic module supply contract worth $88 million with Global Resource Options Inc. (GRO), a Vermont-based solar power distributor and system integrator.
Lab test system gets handset trace capability Product News 2/28/2006 Post a comment RF test equipment vendor Aeroflex adds handset trace capability to its existing SystemAT test system. The SystemAT is used for regression testing wireless network software prior to rollout, and handset validation/interoperability testing. It also accommodates network load and capacity testing.
India readies high-tech manufacturing policy News & Analysis 2/28/2006 Post a comment The Indian government will soon announce a policy that will enable it take equity in and help boost the manufacture of high-technology products, such as semiconductors, wafers, storage devices, plasma and LCD panels.
7-phase DC/DC boosts supply efficiency 3 percent Product News 2/28/2006 Post a comment International Rectifier‘s improved XPhase family of scalable multi-phase DC/DC chipset devices, the IR3084 and IR3084U control ICs, help achieve up to three percent higher efficiency in 130-amp applications with seven phases, as compared to five-phase designs.
SystemC IDE requires no license for executables creation News & Analysis 2/28/2006 Post a comment Electronic system level and hardware description language design solution provider Summit Design said its Vista integrated development environment for SystemC design and debug can now easily create and compile executables of SystemC designs based on the OSCI simulation kernel.
Silicon Design Chain claims methodology validation News & Analysis 2/28/2006 Post a comment The Silicon Design Chain Initiative claimed that a second, enhanced version of its power-management methodology and implementation up to tapeout of the ARM 1136JF-S processor is proof of the methodology and its interdependent technologies.
Report: Western Digital expects to meet guidance News & Analysis 2/27/2006 Post a comment Hard drive supplier Western Digital Corp. said that shipments and OEM demand are tracking to expectations for the March fiscal quarter, according to a Lehman Brothers analyst's note citing an 8-K filing from the company as the source.
China's Vimicro sees flat profits, sales News & Analysis 2/27/2006 Post a comment Vimicro International Corp., a fledging fabless semiconductor company in China, said revenue in the fourth quarter of 2005 was $27.5 million, compared with $27.4 million in the third quarter and up 113 percent from the $12.9 million reported in the fourth quarter of 2004.
Pentium-M chassis to underscore software productivity Product News 2/27/2006 Post a comment Thales Computers and IBM are readying a chassis called the PowerMP6. When it debuts in the near future, it will consist of multiple Pentium-M boards in a 19-in. rack. The PowerMP6 will be available in various customized configurations with up to eight processor boards per rack.
Op amps draw 13 uA per amp Product News 2/27/2006 Post a comment Exclusive to eeProductCenter: Linear Technology Corp. says its 1.8-volt dual and quad operational amplifiers are the first available in a tiny DFN package.
Memory Bulletin: NAND prices dive News & Analysis 2/27/2006 Post a comment Spot prices for NAND-based flash memories continue to fall at an alarming rate amid ongoing rumors of product order cancellations from Apple Computer Inc. and Sony Corp., according to Gartner Inc.
STATS puts pop in PoP packages News & Analysis 2/27/2006 Post a comment Singapore’s STATS ChipPAC Ltd. said that it has increased the performance of its package-on-package (PoP) technology with a two-die stack capability in the bottom package.
Shockley Labs marks 50th anniversary News & Analysis 2/27/2006 Post a comment Civic and industry leaders gathered at a produce market to commemorate the 50th anniversary of Shockley Semiconductor Laboratory -- sometimes considered the birthplace of Silicon Valley.
16-bit MCU boasts 1.8 mW/MIPS power consumption Product News 2/27/2006 Post a comment NEC Electronics America’s 16-bit 78KOR series flash microcontrollers boasts low power consumption of 1.8 milliwatts per million instructions per second and six times the power/performance ratio of NEC Electronics' 8-bit 78K0 MCUs.
PCI-X board runs parallel TI DSPs Product News 2/27/2006 Post a comment Designed for high-speed I/O and processing, here's news of a board-level PCI-X drop-in that harnesses the power of up to nine TI TMS320C6414T DSPs. With that you can get over 2000-Mbytes/s of concurrent I/O, and the ability to combine any number of customer-specific channels of data for up to 500-Mbytes/s of continuous data input from an external source.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.